HQFP208-P-2828-0
Abstract: HQFP 208 D1561 PAD105
Text: 208P6H-A Plastic 208pin 28✕28mm body HQFP EIAJ Package Code HQFP208-P-2828-0.50 Lead Material Alloy 42 MD e JEDEC Code – Weight g 5.39 157 b2 208 ME HD D 156 1 I2 Symbol HE E Recommended Mount Pad 105 52 53 104 A L1 F b y A1 c A2 e A A1 A2 b c D E e HD
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208P6H-A
208pin
HQFP208-P-2828-0
HQFP 208
D1561
PAD105
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Untitled
Abstract: No abstract text available
Text: HQFP208-C-3939-0.65 Radiation fin 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 アルミナ コバール 半田ディップ(5~50µm) 25.9 TYP.
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HQFP208-C-3939-0
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HQFP208-P-2828-0
Abstract: HQFP 208
Text: 208P6Z-E Plastic 208pin 28✕28mm body HQFP EIAJ Package Code HQFP208-P-2828-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD Under Planning b2 208 ME D 157 1 156 I2 Recommended Mount Pad E HE Symbol 105 52 53 104 F A L1 A1 c A2 e b L y Detail F
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208P6Z-E
208pin
HQFP208-P-2828-0
HQFP 208
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ZD MARK 22
Abstract: PRQP0208KE-B MAX2828
Text: JEITA Package Code P-HQFP208-28x28-0.50 RENESAS Code PRQP0208KE-B Previous Code FP-208E/FP-208EV MASS[Typ.] 5.3g NOTE 1. DIMENSIONS"*1"AND"*2" DO NOT INCLUDE MOLD FLASH 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. HD *1 D 156 105 157 104 Reference Symbol
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P-HQFP208-28x28-0
PRQP0208KE-B
FP-208E/FP-208EV
ZD MARK 22
PRQP0208KE-B
MAX2828
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HQFP208-C-3939-0
Abstract: No abstract text available
Text: HQFP208-C-3939-0.65 Radiation fin 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Al2O3 Kovar Solder dipping (5~50µm) 25.9 TYP.
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HQFP208-C-3939-0
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MB91F594
Abstract: MB91F59BC
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS705-00010-3v0-E 32-bit Microcontroller FR Family FR81S MB91590 Series * *
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DS705-00010-3v0-E
32-bit
FR81S
MB91590
591BH/F591BHS/F592B/F592BS/F592BH/F592BHS
MB91F594B/F594BS/F594BH/F594BHS/F596B
/F596BS
/F596BH
/F596BHS*
MB91F597B
MB91F594
MB91F59BC
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MB91F5
Abstract: No abstract text available
Text: FUJITSU SEMICONDUCTOR DATA SHEET DS705-00010-2v1-E 32-bit Microcontroller FR Family FR81S MB91590 Series * *
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DS705-00010-2v1-E
32-bit
FR81S
MB91590
591BH/F591BHS/F592B/F592BS/F592BH/F592BHS
MB91F594B/F594BS/F594BH/F594BHS/F596B
/F596BS
/F596BH
/F596BHS*
MB91F597B
MB91F5
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SH7750
Abstract: SH7750S HS7750KCM02HE Hitachi DSA00382 SDMR-3
Text: SuperH Family E10A Emulator Additional Document for User’s Manual SH7750 E10A HS7750KCM02HE Renesas Microcomputer Development Environment System SuperH Family / SH7750 Series Specific Guide for the SH7750 E10A Emulator Rev.1.00 2004.2.17 Cautions Keep safety first in your circuit designs!
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SH7750
HS7750KCM02HE
REJ10B0110-0100H
SH7750S
HS7750KCM02HE
Hitachi DSA00382
SDMR-3
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hitachi sh3
Abstract: fujitsu fr-v HQFP208 HQFP256 MB86290A MB86291 MB87J2120 uPD72254Y bga256 power dissipation Bluetooth Base band controller
Text: MICROCONTROLLER WORKSHOPS Graphic Controller 1 1 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com 1 PC graphics sets standards 2 30-Jan-01 Microcomponents Marketing FUJITSU MICROELECTRONICS EUROPE www.fujitsu-fme.com
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30-Jan-01
hitachi sh3
fujitsu fr-v
HQFP208
HQFP256
MB86290A
MB86291
MB87J2120
uPD72254Y
bga256 power dissipation
Bluetooth Base band controller
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MB86290
Abstract: HQFP-208 HQFP208 MB86290A MB86291 MB86833 V832 video SIGNAL CAPTURE MOBILE LCD DISPLAY Texture mapping
Text: MB86291< <SCARLET> > Graphics Controller Specifications Revision 1.0 March 2001 Copyright FUJITSU LIMITED 1998, 1999 ALL RIGHTS RESERVED All Rights Reserved The information in this document has been carefully checked and is believed to be reliable. However, Fujitsu Limited assumes no responsibility for inaccuracies.
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SH7750
Abstract: SH7750R pfce nec QFP-208
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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SH7750R
REJ10B0079-0100H
SH7750
pfce
nec QFP-208
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ba732
Abstract: COBCHIP ON BOARD ED-7303 QFP 128 bonding
Text: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 1 章 パッケージの分類 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 1 章部分とな
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LGA 1156 PIN OUT diagram
Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)
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DIP8-P-300-2
DIP14-P-300-2
DIP16-P-300-2
DIP18-P-300-2
MIL-M-38510
MIL-STD-883
LGA 1156 PIN OUT diagram
QSJ-44403
LGA 1150 Socket PIN diagram
LGA 1155 Socket PIN diagram
IC107-26035-20-G
LGA 1151 PIN diagram
REFLOW lga socket 1155
IC107-3204-G
TB 2929 H alternative
LGA 1155 pin diagram
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PDF
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ADE-702-196A
Abstract: Hitachi DSA0084 SH7750 SH7750S SH7751
Text: Hitachi Microcomputer Development Environment System SH7750 E10A Emulator User’s Manual ADE-702-196A Rev. 2.0 01/15/01 Hitachi, Ltd. HS7750KCM01HE Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
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SH7750
ADE-702-196A
HS7750KCM01HE
ADE-702-196A
Hitachi DSA0084
SH7750S
SH7751
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Denso L 918 8
Abstract: Denso L 918 P-PGA-132 MQFP-208 XC4000 XC4000E XC5000 XC1765D 145C XC1700D
Text: The Reliability Data Program October 1, 1996 Expanded Version Index • • • • • • HTOL High Temperature Operating Life . 85/85 (Bias Moisture Life). PCT (Unbiased Pressure Pot).
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PLCC-20,
Denso L 918 8
Denso L 918
P-PGA-132
MQFP-208
XC4000
XC4000E
XC5000
XC1765D
145C
XC1700D
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BGA256
Abstract: HQFP208 QFP-208 SH7750
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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14-pin
QFP-208)
BGA256
HQFP208
QFP-208
SH7750
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HQFP-208
Abstract: hitachi CONNECTOR 2 PIN 2514-6002 BGA256 HQFP208 QFP-208 SH7750R h-udi
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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14-pin
QFP-208)
HQFP-208
hitachi CONNECTOR 2 PIN
2514-6002
BGA256
HQFP208
QFP-208
SH7750R
h-udi
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PAL AM 16v8
Abstract: 9-JP32 FR30 HQFP208 SAA7111A SH7750 V832 IC 2V5 R100R0
Text: SCARLET Subboard Documentation Fujitsu Microelectronics Europe GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany History Revision V1.0 V1.1 V1.2 Date 12.03.01 06.06.01 05.07.01 Comment New Document Update redesign of board New board plan 2
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SAA7111
FUJ22b
PAL AM 16v8
9-JP32
FR30
HQFP208
SAA7111A
SH7750
V832
IC 2V5
R100R0
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GR-253-CORE
Abstract: HQFP-208 MB86692 FB155 intel atom microprocessor HQFP208
Text: Product Flyer September 1998 MB86692 FireBurst 155 ATM 155Mbps Multi-PHY Device Version 1.0 FML/NPD/FB155/FL/1963 The FireBurst155 ATM 155Mbps Multi-PHY Device is a highly integrated termination concentrator for ATM LAN/WAN applications. Implementing four UNI/NNI ports on a single device
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MB86692
FireBurstTM155
155Mbps
FML/NPD/FB155/FL/1963
FireBurst155
52Mbps
52MHz.
HQFP-208
FML/NPD/FB155/FL/1963
GR-253-CORE
HQFP-208
MB86692
FB155
intel atom microprocessor
HQFP208
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121C-2
Abstract: XC1765D XC95108 XL mp8000ch4 p103 pot datasheet reliability report PQFP240 XC95xxx 17256d D1 PGA 478
Text: The Reliability Data Program Expanded Version Jan. 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4
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XC4005XL
PQFP-160
PLCC-84,
HQFP-304,
VQFP-100
XC4044XL
XC4013XLA
121C-2
XC1765D
XC95108 XL
mp8000ch4
p103 pot datasheet
reliability report
PQFP240
XC95xxx
17256d
D1 PGA 478
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425M
Abstract: DIP18 DIP20 DIP28 DIP32 DIP40 SOJ28-P-400-1 PGA wire bonding IPGA400-C-S33U-1 PGA240
Text: 2. 外形寸法図 2. 外形寸法図 2 2-1. パッケージ外形寸法 - 2 2-1-1. パッケージ寸法表示記号 - 2 2-1-2. リード位置許容値について - 3
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P-LFBGA144-1313-0
P-BGA256-2727-1
P-BGA352-3535-1
P-BGA420-3535-1
P-BGA560-3535-1
P-TFLGA32-0806-0
425M
DIP18
DIP20
DIP28
DIP32
DIP40
SOJ28-P-400-1
PGA wire bonding
IPGA400-C-S33U-1
PGA240
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PDF
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HS7750KCI01H
Abstract: SH7750 E10A Emulator SH7750 SH7750S SH7751 tab 173
Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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SH7750
HS7750KCI01H
SH7750 E10A Emulator
SH7750S
SH7751
tab 173
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PDF
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XC95XXXL
Abstract: XC95XXX XC1765D PQFP240 C17S xc9536 A9903 XCV1000E FG HT 12E APPLICATION Reliability Test Methods for Packaged Devices
Text: The Reliability Data Program Expanded Version July 1, 2000 Cover P1 TABLE OF CONTENTS Introduction .…4 The Reliability Program. .…4
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XC4005XL
PQFP-160
PLCC-84,
HQFP-304,
VQFP-100
XC4044XL
XC4013XLA
XC95XXXL
XC95XXX
XC1765D
PQFP240
C17S
xc9536
A9903
XCV1000E FG
HT 12E APPLICATION
Reliability Test Methods for Packaged Devices
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PAL AM 16v8
Abstract: JP46 74ALS34 Hitachi TANTAL scarlet FR30 HQFP208 SAA7111A SH7750 V832
Text: SCARLET Subboard Documentation Fujitsu Microelectronics Europe GmbH Am Siebenstein 6-10 63303 Dreieich-Buchschlag, Germany History Revision V1.0 V1.1 V1.2 Date 12.03.01 06.06.01 05.07.01 Comment New Document Update redesign of board New board plan 2
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SAA7111
FUJ22b
PAL AM 16v8
JP46
74ALS34
Hitachi TANTAL
scarlet
FR30
HQFP208
SAA7111A
SH7750
V832
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PDF
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