J-STD-003
Abstract: J-STD-005 heller 1700 ISO-9453-1990 QQ-S-571F J-STD-004 ANSI/IPC-A-610 QQ-S-571 SN60 SN62
Text: Assembling SRD Products Onto Customers’ PWBs Jon S. Prokop Vice President, Manufacturing 972 789-3818 jprokop@rfm.com Confidential Assembling SRD Products Onto Customers’ PWBs • Considerations/Topics – – – – – – – – – PWB footprint (layout)
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SM20H:
ANSI/J-STD-001
ANSI/J-STD-002
ANSI/J-STD-003
ANSI/J-STD-004
ANSI/J-STD-005
IPC-TM-650
IEC-1191-1
ISO-9453-1990
J-STD-003
J-STD-005
heller 1700
QQ-S-571F
J-STD-004
ANSI/IPC-A-610
QQ-S-571
SN60
SN62
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Senju oz
Abstract: senju solder alloys Howard H. Manko Senju
Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Page-1 Walsin Technology Corporation Background Pb free solder material was started in 1995. A composition of Sn-4Bi-2Ag-0.5Cu-0.1Ge was announced in July
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SnBiAg
Abstract: senju solder paste WALSIN philips mlcc Senju flux Senju oz
Text: Walsin Technology Corporation Lead Free MLCC, Chip-R, MLCI SMA Application Guideline HTTP://WWW.PASSIVECOMPONENT.COM Version 03 Page-1 Walsin Technology Corporation Background Sn/Pb Phase Diagram Engineering version Pb free solder material was started in 1995. A
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OZ-7085-340F-32-12)
2Ag-20In
SnBiAg
senju solder paste
WALSIN
philips mlcc
Senju flux
Senju oz
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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AN1035
Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
Text: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction
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AN-1035
065mm.
pp1509-1523
AN1035
tamura solder paste
SN62 PB36 ag2 kester
IRF6604
DirectFet
SN62 PB36 ag2 Copper
Tamura kaken
100N
IRF6601
IRF6602
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tamura solder paste
Abstract: AN-1035 SN63 PB37 multicore SN62 PB36 ag2 kester SN62 MP AN1035 tamura solder paste PROFILE Litton SN62 PB36 ag2 100N
Text: Application Note AN-1035 DirectFET Technology Board Mounting Table of Contents Page Device construction Design considerations Assembly considerations Mechanical test results Model-specific data 2 2 3 5 8 DirectFET™ is a new surface mount semiconductor technology designed primarily for boardmounted power applications. It eliminates unnecessary elements of packaging that contribute to
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AN-1035
150mm
025mm
500mm
tamura solder paste
AN-1035
SN63 PB37 multicore
SN62 PB36 ag2 kester
SN62 MP
AN1035
tamura solder paste PROFILE
Litton
SN62 PB36 ag2
100N
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663n
Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 IEC 68-2-32 tamura solder paste
Text: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4
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AN-1035
025mm
500mm
663n
technical data sheet of tamura solder paste
100N
AN-1050
AN-1080
IEC 68-2-32
tamura solder paste
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AN-1035
Abstract: technical data sheet of tamura solder paste 100N AN-1050 AN-1080 A142A 663n tamura solder paste PROFILE
Text: Application Note AN-1035 DirectFET Technology Board Mounting Application Note Table of Contents Page Device construction . 2 Design considerations . 3 Assembly considerations. 4
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AN-1035
025mm
500mm
AN-1035
technical data sheet of tamura solder paste
100N
AN-1050
AN-1080
A142A
663n
tamura solder paste PROFILE
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Alpha WS609 solder
Abstract: Kester steam aging system solder paste alpha WS609 7406D mountaingate kester solder paste WS609 TL082 s05d SHINKO WS609
Text: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as
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Alpha WS609 solder
Abstract: mountaingate Kester steam aging system solder paste alpha WS609 ALS245 LS245 TL082 Dissolve Oxygen free energy matsua saw
Text: PALLADIUM LEAD FINISH USER'S MANUAL DOUGLAS W. ROMM INTRODUCTION Texas Instruments has introduced a revolutionary new lead finish into the Semiconductor industry. This plating technology consists of a copper base metal plated with nickel and palladium. The palladium acts as
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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eaton el 198
Abstract: PCb board zd lty 2 PCb board zd lty 6 nte quick cross 14305H SMD MARKING CODE ALg 5302H F105 LA 4301 Z851 marking code
Text: Indicator Lights LED Optoelectronics • Incandescent • Neon For Surface Mount, PC Mount & Panel Mount TABLE OF CONTENTS SECTION 6 SECTION 1 Technical Notes Incandescent Lamps Neon Lamps O ptoelectronics Soldering Neon Glow Lamps 3 6 10 SECTION 2 IDI Product Line
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L4-32
4366C
4916H1
4916S1
921H1
4921S1
4925H1
4925H
4925S1
eaton el 198
PCb board zd lty 2
PCb board zd lty 6
nte quick cross
14305H
SMD MARKING CODE ALg
5302H
F105
LA 4301
Z851 marking code
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