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    sod323 wave soldering

    Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820
    Text: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed


    Original     		PDF HLG05510 OT-23 HLG05511 HLG05522 OT-89 HLG05523 HLG05514 OT-143 sod323 wave soldering sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820

    All smd Packages sct-595 sot-23

    Abstract: HLG05531 HLG05532 HLG09054 SCT-595
    Text: Notes on Processing Component Placement The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed


    Original     		PDF HLG09183 HLG05516 HLG05818 HLG05520 MW-12 HLG05819 MW-16 HLG09056 All smd Packages sct-595 sot-23 HLG05531 HLG05532 HLG09054 SCT-595