HLG05515 Search Results

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Catalog Datasheet	MFG & Type	Document Tags	PDF
SOT323 reflow Abstract: All smd Packages sct-595 sot-23 dual infrared transistor CECC 00802 reflow profile 00802 SC-75 SCT-595 sod323 reflow Text: Notes on Processing Component Placement The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be	Original	SCT-595 HLG09053 SCT-598 HLG09183 HLG05516 HLG05520 MW-12 HLG05819 MW-16 HLG09056 SOT323 reflow All smd Packages sct-595 sot-23 dual infrared transistor CECC 00802 reflow profile 00802 SC-75 SCT-595 sod323 reflow	PDF
ujt 2646 Abstract: TRANSISTOR J 5804 label infineon barcode msc 1697 MSC 1697 IC pin diagram Rohde und Schwarz Active Antenna HE 011 cd 6283 audio smd transistor v75 log tx2 0909 IC data book free download Text: D a t a B o o k , J a n. 20 0 1 GaAs Components N e v e r s t o p t h i n k i n g . Edition 2001-01-01 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München, Germany Infineon Technologies AG 2001. All Rights Reserved. Attention please!	Original	D-81541 14-077S Q62702-D1353 Q62702-G172 Q62702-G173 ujt 2646 TRANSISTOR J 5804 label infineon barcode msc 1697 MSC 1697 IC pin diagram Rohde und Schwarz Active Antenna HE 011 cd 6283 audio smd transistor v75 log tx2 0909 IC data book free download	PDF
sod323 wave soldering Abstract: sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820 Text: Notes on Processing Component Placement HLG0 5414 The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed	Original	HLG05510 OT-23 HLG05511 HLG05522 OT-89 HLG05523 HLG05514 OT-143 sod323 wave soldering sod323 reflow reflow profile 00802 sot363 wave soldering HLG05516 HLG05517 HLG05520 HLG05521 HLG05818 HLG05820	PDF
HLG05507 Abstract: reflow profile 00802 Text: GaAs Components Notes on Processing 6 Notes on Processing Component Placement The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be	Original	HLG05818 HLG05516 HLG05520 MW-12 HLG05819 MW-16 P-TSSOP-10-2 P-TSSOP-10-2 HLG05506 HLG09056 HLG05507 reflow profile 00802	PDF
All smd Packages sct-595 sot-23 Abstract: HLG05531 HLG05532 HLG09054 SCT-595 Text: Notes on Processing Component Placement The ability to place semiconductors depends very much on the type involved. Up to a pitch size of 1.27 mm, mechanical centering by tools of an automatic component placement machine suffices, e.g. jaws and centering units. Multiple-pin ICs have to be placed	Original	HLG09183 HLG05516 HLG05818 HLG05520 MW-12 HLG05819 MW-16 HLG09056 All smd Packages sct-595 sot-23 HLG05531 HLG05532 HLG09054 SCT-595	PDF
reflow profile 00802 Abstract: sod323 reflow sod323 wave soldering Text: SIEM EN S Notes on Processing Table 1 Solderability Test to Siemens Standard Test criterion Solder bath temperature °C Dwell time in bath s Components for wave and reflow soldering Wetting 215 ± 3 3 ±0.3 Dewetting and leaching 260 ± 5 30 ±1 Components for reflow soldering only	OCR Scan	OT-89 OT-143 HLG05515 OT-223 reflow profile 00802 sod323 reflow sod323 wave soldering	PDF