HITCE WEIGHT Search Results

HITCE WEIGHT Result Highlights (2)

Part	ECAD Model	Manufacturer	Description	Download	Buy
EVAL-CN0216-ARDZ		Analog Devices	Precision Weight Scale ARDUINO
EVAL-CN0216-PMDZ		Analog Devices	Precision Weight Scale Ckt wit

HITCE WEIGHT Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
entek Cu-56 Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile Text: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.	Original	PDF	20ppm/ 5989-0834EN AV02-0769EN entek Cu-56 bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
BGA PROFILING Abstract: BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile Text: HITCE* Ball Grid Array Lead-free Surface Mount Assembly Application Note 5364 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.	Original	PDF	20ppm/ AV02-0768EN BGA PROFILING BGA Ball Crack OSP FLIPCHIP CRACK pcb warpage after reflow 0711m BGA PACKAGE thermal profile expansion joint JEDEC SMT reflow profile
MS-034-AAn-1 Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002 Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel	Original	PDF	Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
29f040b Abstract: teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6 Text: White Electronic Designs Table Of Contents Product Overview . 2 Commitment . 3	Original	PDF	DMD2006F 29f040b teradyne catalyst Stacked 4MB Flash and 1MB SRAM WED3C755E8MC FLF14 kyocera 128 cqfp CERAMIC QUAD FLATPACK CQFP 95613 hac 132 BAG PACKAGE TOP MARK tms320c6
radix-8 FFT Abstract: DBGA KD 472 M mov CMAC A15B2 sc sf 12A H4 17ER CI23 honeywell hx3000 HX3000 Text: DSP Architectures RHDSP24 Radiation Hardened Scalable DSP Chip Transform Your WorldTM Data Sheet Real 24 PORT A Imag 24 RHDSP24 Imag 24 24 24 X INPU TB US Y INPUT BU S O U TP U TB US 24 48 Imag 24 Scheduler/ Controller X Y Memory A 24 Memory B 24 System Controls	Original	PDF	RHDSP24 RHDSP24-Y-75-M DSPA-RHDSP24DS radix-8 FFT DBGA KD 472 M mov CMAC A15B2 sc sf 12A H4 17ER CI23 honeywell hx3000 HX3000
ic MB 16651 G Abstract: MB 16651 MPC860 jtag tdm RECEIVER 221-217 0xE302 oscillator 10ppm MB 16651 G DS3-M13 V 22916 Text: Preliminary Information This document contains information on a product under development. The parametric information contains target parameters that are subject to change. M29320 12-Port DS3/E3/STS-1 Electrical Integrated Line Termination Device for Transport Networks	Original	PDF	M29320 12-Port M29320 29320-DSH-001-D ic MB 16651 G MB 16651 MPC860 jtag tdm RECEIVER 221-217 0xE302 oscillator 10ppm MB 16651 G DS3-M13 V 22916
tlu 011 Abstract: CP12 CP14 CP15 CRC-32 4000 SERIES MOTOROLA land dpu 230 RX10B Text: Architecture Guide C-5e/C-3e NETWORK PROCESSOR SILICON REVISION B0 C5EC3EARCH-RM Rev 04 PRODUCTION Architecture Guide C-5e/C-3e Network Processor Silicon Revision B0 C5EC3EARCH-RM Rev 04 Copyright 2004 Motorola, Inc. All rights reserved. No part of this documentation may	Original	PDF
engine control module seg np2 Abstract: tlu 115 tlu 011 CP15 CRC-32 CP12 CP14 l 83s 472 722 C3E 351 IBM powerpc 405 GPr 266MHz PROCESSOR Text: Architecture Guide C-5e/C-3e NETWORK PROCESSOR SILICON REVISION B0 C5EC3EARCH-RM Rev 04 PRODUCTION Freescale Semiconductor, Inc., 2004. All rights reserved. Architecture Guide C-5e/C-3e Network Processor Silicon Revision B0 C5EC3EARCH-RM Rev 04 How to Reach Us:	Original	PDF	CH370 engine control module seg np2 tlu 115 tlu 011 CP15 CRC-32 CP12 CP14 l 83s 472 722 C3E 351 IBM powerpc 405 GPr 266MHz PROCESSOR