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    HF30C120ACB Search Results

    HF30C120ACB Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    HF30C120ACB International Rectifier Hexfred Die in Wafer Form Original PDF

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    HF30C120ACB

    Abstract: HFA08PB120
    Text: Previous Datasheet Index Next Data Sheet PD-2.499 TARGET HF30C120ACB HF30C120ACB Hexfred Die in Wafer Form 1200 V Size 30 4" Wafer Electrical Characteristics Wafer Form Parameter Description VFM Forward Voltage BVR Reverse Breakdown Voltage IRM Reverse Leakage Current


    Original     		PDF HF30C120ACB HF30C120ACB HFA08PB120 HFA08PB120

    HF30C120ACB

    Abstract: HFA08PB120
    Text: PD-2.499 TARGET HF30C120ACB HF30C120ACB Hexfred Die in Wafer Form 1200 V Size 30 4" Wafer Electrical Characteristics Wafer Form Parameter Description VFM Forward Voltage BVR Reverse Breakdown Voltage IRM Reverse Leakage Current Guaranteed (Min/Max) 2.8V Max.


    Original     		PDF HF30C120ACB HF30C120ACB HFA08PB120 HFA08PB120

    SCR gate drive circuit

    Abstract: an 80771 IN1190 IN1190A IN1190A diode 20509 Diode 31DQ HFA25TB60 SD400N IR 31DQ 03
    Text: Revised 8/27/98 www.irf.com Rectifiers / Thyristors Catalog of Availble Documents IR ProCenter Fax-On-Demand 310 252-7100 Standard Recovery Diodes Description Datasheets 1N1183 - IN1190 Series 1N1183A - IN1190A Series 1N1199A - 1N1206A Series 1N2054 thru 1N2068 Series


    Original     		PDF 1N1183 IN1190 1N1183A IN1190A 1N1199A 1N1206A 1N2054 1N2068 1N3085 -1N3092 SCR gate drive circuit an 80771 IN1190A diode 20509 Diode 31DQ HFA25TB60 SD400N IR 31DQ 03

    Untitled

    Abstract: No abstract text available
    Text: International I Q R Rectifi G f _ TARGET PD'2-499 H F 30C 120A C B HF30C120ACB Hexfred Die in Wafer Form 1200 V Size 30 4" Wafer Electrical Characteristics Wafer Form Param eter Description Guaranteed (Min/Max) Test Conditions V fm Forward Voltage


    OCR Scan     		PDF HF30C120ACB 250pA 100mm,

    HFA16TA120C

    Abstract: HF30A060ACD HFA16PB120 IR210 ir485 HF10A060ACD
    Text: ¡Ill usas I n t e r n a t io n a l R e c t if ie r Die Tables and Outlines HEXFRED Die w > M i Part Number Die{2) Part Number Die Size N/A 6 HF06A060ACB Length/Side in.) mm "C x 0" (in.) mm Anode MetaKzation Quantity Tray (0.066x0.066)1.68x1.68 (0.037x0.037) 0.94x0.94


    OCR Scan     		PDF HF06A060ACB 066x0 037x0 HFA04TB60 HFA08TA60C HF10A060ACB HF10A060ACD 090X0 062x0 HFA08PB60 HFA16TA120C HF30A060ACD HFA16PB120 IR210 ir485 HF10A060ACD

    HF10A060ACD

    Abstract: HFA08TB60 equivalent HFA16TA120C HFA16TA60C equivalent HFA04TB60 equivalent hfa06tb120 HF30A060ACD HF06A060ACB HFA30PA60C
    Text: I n t e r n a t i o n a l R e c t if ie r F w t l II HEXFRED 1 <2) Wafer Part Number (3) Di* Part Number Bond Pad ‘C X O’ Unjth/SIb* (ln.)mm Anod* MetaSzation (topskk) Tray Quantity Equivalent fin is M Product Di* S in DhAXB'Langth/Skb (iajmm 6 (0.066x0.066)1.68x1.68


    OCR Scan     		PDF HF06A060ACB 066x0 037x0 HFA04TB60 HFA08TA60C HFA08PB60 HFA08TB60 HFA16PA60C HFA16TA60C HFA15PB60 HF10A060ACD HFA08TB60 equivalent HFA16TA120C HFA16TA60C equivalent HFA04TB60 equivalent hfa06tb120 HF30A060ACD HFA30PA60C