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    HF01E060ACE

    Abstract: IRGR3B60KD2
    Text: PD - 94647 HF01E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation Qualified for Industrial Market


    Original     		HF01E060ACE 125mm IRGR3B60KD2 12-Mar-07 HF01E060ACE IRGR3B60KD2 PDF

    HF01E060ACE

    Abstract: No abstract text available
    Text: PD - 94647 HF01E060ACE Hexfred Die in Wafer Form Features • GEN3 Hexfred Technology • Low VF • Low IRR • Low tRR • Soft Reverse Recovery Benefits • • • • Rugged Transient Performance Low EMI Excellent Current Sharing in Parallel Operation Qualified for Industrial Market


    Original     		HF01E060ACE 125mm IRGR3B60KD2 IRGR3B60K HF01E060ACE PDF