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    HERAEUS SOLDER PASTE Search Results

    HERAEUS SOLDER PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    HERAEUS SOLDER PASTE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Heraeus SOLDER PASTE F645

    Abstract: heraeus f816 heraeus F645 SA30C5-89M30 Heraeus paste profile SN63-90 Heraeus paste profile F645 heraeus heraeus f816 SN63-90 Heraeus pb free paste profile
    Text: SLVA333 Application Report May 2009 BGA Package Component Reliability After Long-Term Storage R. Key, B. Lange, R. Madsen ABSTRACT The white paper Component Reliability After Long Term Storage Texas Instruments application report SLVA304, http://focus.ti.com/lit/wp/slva304/slva304.pdf detailed a risk analysis with


    Original     		PDF SLVA333 SLVA304, com/lit/wp/slva304/slva304 Heraeus SOLDER PASTE F645 heraeus f816 heraeus F645 SA30C5-89M30 Heraeus paste profile SN63-90 Heraeus paste profile F645 heraeus heraeus f816 SN63-90 Heraeus pb free paste profile

    Heraeus PD 860002 SA

    Abstract: RFW8022 VJ3505 Heraeus paste profile chip antenna express card DVB heraeus UHF/Antenna GLUE antenna radiation
    Text: RFW8022 Vishay RFWaves RFW8022 UHF Antenna for Mobile Devices KEY FEATURES • • • • • VISHAY RFW8022 The company’s products are covered by one or more of the following: Taiwan Patent No. 155994, Taiwan Patent No. 176767, USA Patent No. 6,535,545. Other patents pending.


    Original     		PDF RFW8022 RFW8022 18-Jul-08 Heraeus PD 860002 SA VJ3505 Heraeus paste profile chip antenna express card DVB heraeus UHF/Antenna GLUE antenna radiation

    Heraeus PD 860002 SA

    Abstract: mbrai heraeus uhf pcb antenna vitramon VJ VJ3505M011SXMSRA0 US2008305750
    Text: VJ 3505 Vishay Vitramon VJ 3505 UHF Chip Antenna for Mobile Devices FEATURES • • • • • The company’s products are covered by one or more of the following: WO2008250262 A1 , US2008303720 (A1), US2008305750 (A1), WO2008154173 (A1). Other patents pending.


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 18-Jul-08 Heraeus PD 860002 SA mbrai heraeus uhf pcb antenna vitramon VJ VJ3505M011SXMSRA0 US2008305750

    CMMB antenna

    Abstract: Heraeus PD 860002 SA vitramon VJ heraeus Heraeus paste profile 100 mhz s band antenna uhf pcb antenna express card DVB tv Antenna mobile antenna design
    Text: VJ 3505 Vishay Vitramon VJ 3505 UHF Chip Antenna for Mobile Devices FEATURES • • • • • The company’s products are covered by one or more of the following: WO2008250262 A1 , US2008303720 (A1), US2008305750 (A1), WO2008154173 (A1). Other patents pending.


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 18-Jul-08 CMMB antenna Heraeus PD 860002 SA vitramon VJ heraeus Heraeus paste profile 100 mhz s band antenna uhf pcb antenna express card DVB tv Antenna mobile antenna design

    heraeus pd944

    Abstract: heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint
    Text: CHAPTER 4 THROUGH-HOLE MOUNTING METHODS page Soldering by dipping or solder wave 4-2 Repairing soldered joints 4-2 Philips Semiconductors IC Packages Through-hole mounting methods Chapter 4 SOLDERING BY DIPPING OR SOLDER WAVE The maximum temperature of the solder must not exceed


    Original     		PDF MLC742 heraeus pd944 heraeus pd945 Amicon d125f D125F3 PD945 PD944 AMICON D125F AmiconD125F TSSOP footprint

    Untitled

    Abstract: No abstract text available
    Text: VJ 3505 Vishay Vitramon VJ 3505 UHF Chip Antenna for Mobile Devices FEATURES • • • • • The company’s products are covered by one or more of the following: WO2008250262 A1 , US2008303720 (A1), US2008305750 (A1), WO2008154173 (A1). Other patents pending.


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 11-Mar-11

    CMMB antenna

    Abstract: 6040 vitramon VJ antenna radiation 86-0002
    Text: VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices FEATURES • Small outline 10.5 mm x 15.5 mm x 1.2 mm • Omni-directional, linear polarization • Complies with MBRAI standard • Complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 18-Jul-08 CMMB antenna 6040 vitramon VJ antenna radiation 86-0002

    vitramon VJ

    Abstract: Heraeus PD 860002 SA
    Text: VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices FEATURES • Small outline 10.5 mm x 15.5 mm x 1.2 mm • Omni directional, linear polarization • Complies with MBRAI standard • Complete UHF band coverage (470 MHz to 860 MHz) • Requires a tuning circuit and ground plane for optimal


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 18-Jul-08 vitramon VJ Heraeus PD 860002 SA

    Untitled

    Abstract: No abstract text available
    Text: VJ 3505 Vishay Vitramon VJ 3505 UHF Chip Antenna for Mobile Devices FEATURES • • • • • The company’s products are covered by one or more of the following: WO2008250262 A1 , US2008303720 (A1), US2008305750 (A1), WO2008154173 (A1). Other patents pending.


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12

    VJ5601M868MXBEK

    Abstract: VJ5601 868 MHz RFID 868 printed antenna design VJ5601M868MXBSR VJ5601M868
    Text: VJ5601M868MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 868 MHz FEATURES • Small outline 15.5 mm x 10.5 mm x 1.2 mm • 50  unbalanced tuning interface (max. 1.73 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5601M868MXBSR VJ5601M868MXBSR 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 VJ5601M868MXBEK VJ5601 868 MHz RFID 868 printed antenna design VJ5601M868

    VJ5301M9

    Abstract: VJ5301 VJ5301M
    Text: VJ5301M915MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 915 MHz FEATURES • Small outline 35 mm x 5 mm x 1.2 mm • 50  unbalanced tuning interface (max. 4.73 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5301M915MXBSR VJ5301M915MXBSR WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC. 2002/95/EC 2011/65/EU. VJ5301M9 VJ5301 VJ5301M

    Heraeus paste profile

    Abstract: PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus
    Text: Application Note June 21, 2008 Document No. : AN007-0001, Ver. 1.21 PDF Name: TLynx_Mfgr_Guide.pdf Application Guidelines for Non-Isolated Converters AN07-001: Manufacturing Guidelines for TLynx Series Modules Introduction The TLynxTM series modules are SMT DC/DC nonisolated converters, that feature a pinless interconnect


    Original     		PDF AN007-0001, AN07-001: Heraeus paste profile PD922 reflow profile FOR LGA COMPONENTS J-STD-033 J-STD-033A hot air bga IPC-9701 heraeus

    Untitled

    Abstract: No abstract text available
    Text: VJ5601M868MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 868 MHz FEATURES • Small outline 15.5 mm x 10.5 mm x 1.2 mm • 50  unbalanced tuning interface (max. 1.73 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5601M868MXBSR VJ5601M868MXBSR WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC. 2002/95/EC 2011/65/EU.

    Untitled

    Abstract: No abstract text available
    Text: VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices FEATURES • Small outline 10.5 mm x 15.5 mm x 1.2 mm • Omni-directional, linear polarization • Complies with MBRAI standard • Complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 11-Mar-11

    VJ5301

    Abstract: VJ5301M
    Text: VJ5301M868MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 868 MHz FEATURES • Small outline 35 mm x 5 mm x 1.2 mm • 50  unbalanced tuning interface (max. - 1.96 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5301M868MXBSR VJ5301M868MXBSR WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC. 2002/95/EC 2011/65/EU. VJ5301 VJ5301M

    VJ5301M915MXBEK

    Abstract: mbrai VJ5301M9 VJ5301 VJ5301M
    Text: VJ5301M915MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 915 MHz FEATURES • Small outline 35 mm x 5 mm x 1.2 mm • 50  unbalanced tuning interface (max. 4.73 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5301M915MXBSR VJ5301M915MXBSR 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 VJ5301M915MXBEK mbrai VJ5301M9 VJ5301 VJ5301M

    868 printed antenna design

    Abstract: VJ5301 VJ5301M
    Text: VJ5301M868MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 868 MHz FEATURES • Small outline 35 mm x 5 mm x 1.2 mm • 50  unbalanced tuning interface (max. - 1.96 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5301M868MXBSR VJ5301M868MXBSR 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 868 printed antenna design VJ5301 VJ5301M

    VJ5601

    Abstract: VJ5601M915MXBEK
    Text: VJ5601M915MXBSR www.vishay.com Vishay Vitramon Surface Mount Ceramic Chip Antennas for 915 MHz FEATURES • Small outline 15.5 mm x 10.5 mm x 1.2 mm • 50  unbalanced tuning interface (max. 1.73 dBi gain (1) • Assembled onto a PCB in the standard reflow


    Original     		PDF VJ5601M915MXBSR VJ5601M915MXBSR 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 VJ5601 VJ5601M915MXBEK

    heraeus

    Abstract: uhf pcb antenna VJ6040 WO2008154173 Heraeus PD 860002 SA
    Text: VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices FEATURES • Small outline 10.5 mm x 15.5 mm x 1.2 mm • Omni-directional, linear polarization • Complies with MBRAI standard • Complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 2011/65/EU 2002/95/EC. 2002/95/EC 2011/65/EU. 12-Mar-12 heraeus uhf pcb antenna VJ6040 WO2008154173 Heraeus PD 860002 SA

    Untitled

    Abstract: No abstract text available
    Text: VJ 6040 Vishay Vitramon VJ 6040 UHF Chip Antenna for Mobile Devices FEATURES • Small outline 10.5 mm x 15.5 mm x 1.2 mm • Omni-directional, linear polarization • Complies with MBRAI standard • Complete UHF band coverage (470 MHz to 860 MHz) up to 1.1 GHz


    Original     		PDF WO2008250262 US2008303720 US2008305750 WO2008154173 2002/95/EC 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A

    multicore solder paste

    Abstract: JESD22-B111 JESD22-b111 drop JEOL 6335F JESD22B111 JEOL 6335F PXI-6052E
    Text: Effect of Temperature on the Drop Reliability of Wafer-Level Chips Scale Packaged Electronic Assemblies T. T. Mattila, R. J. James, L. Nguyen* and J. K. Kivilahti Laboratory of Electronic Production Technology Helsinki University of Technology Otakaari 7 A, P.O.Box 3000


    Original     		PDF HUTEPT-13, fi/Diss/2005/isbn9512279843/T) multicore solder paste JESD22-B111 JESD22-b111 drop JEOL 6335F JESD22B111 JEOL 6335F PXI-6052E

    JESD22-B111

    Abstract: LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus
    Text: Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki University of Technology P.O. Box 3000, 02150 Espoo, Finland 2 National Semiconductor Corporation


    Original     		PDF JESD22-B111 100-bumps 36-bumps 48-leads gov/div898/handbook/, gov/div853/lead 20free/part1 LLP48 JESD22B111 AA36 multicore solder paste SN50A AA100 AA-36 super mole heraeus

    mbrai

    Abstract: No abstract text available
    Text: V ishay I ntertechnolog y, I nc . AND TEC O L OGY INNOVAT I N HN Multilayer Ceramic Chip Capacitors VJ 6040 O 19 62-2012 Capacitors - Complete UHF Band Coverage Multilayer Ceramic Chip Antenna for Mobile Devices Key Benefits • • • • • • Small outline 10.5 mm x 15.5 mm x 1.2 mm


    Original     		PDF 2011/65/EU VMN-PT0184-1203 15-Jun-10 mbrai

    JESD22-B111

    Abstract: Olympus bx60 heraeus Sn37Pb-bumped Heraeus paste ws 8704B5000 electroless nickel environmental test Cu OSP 6335F Cu6Sn5
    Text: Drop Test Reliability of Wafer Level Chip Scale Packages Mikko Alajoki, Luu Nguyen * and Jorma Kivilahti Lab. of Electronics Production Technology Helsinki University of Technology P.O.Box 3000, 02150 Espoo, Finland * National Semiconductor Corporation P.O.Box 58090, Mail Stop 19-100, Santa Clara, USA


    Original     		PDF