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    HEAT SINK FOR 304 POINT BGA Search Results

    HEAT SINK FOR 304 POINT BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCR5RG28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DM18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, DFN4 Visit Toshiba Electronic Devices & Storage Corporation
    TCR3DG18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 300 mA, WCSP4E Visit Toshiba Electronic Devices & Storage Corporation
    TCR2EF18 Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 1.8 V, 200 mA, SOT-25 (SMV) Visit Toshiba Electronic Devices & Storage Corporation
    TCR3RM28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 300 mA, DFN4C Visit Toshiba Electronic Devices & Storage Corporation

    HEAT SINK FOR 304 POINT BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    elina fan

    Abstract: 3dfx heat sink for 304 point BGA 2319B 658-35AB VSC870 VSC880 100C G53034-0 192 BGA PACKAGE thermal resistance
    Text: VITESSE SEMICONDUCTOR CORPORATION Application Note Thermal Management for the VSC870, VSC880 AN-36 Thermal Management The VSC870 and VSC880 backplane devices can use standard heat sinks to keep their junction temperatures within the specified limits. Both devices come in a thermally enhanced BGA package. Several types of


    Original     		PDF VSC870, VSC880 AN-36 VSC870 VSC880 G53034-0, elina fan 3dfx heat sink for 304 point BGA 2319B 658-35AB 100C G53034-0 192 BGA PACKAGE thermal resistance

    IPC-9702

    Abstract: BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C
    Text: Freescale Semiconductor Tape Ball Grid Array TBGA Overview TM Revision 0 – 2006 Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. Freescale


    Original     		PDF 30C/60% 125degC. IPC-9702 BGA PACKAGE thermal resistance Freescale JESD51-9 Freescale Tape Ball Grid Array Overview freescale 352 tbga ipc 9702 motherboard ga 151C C151C 181C

    LCS-68

    Abstract: 821575-1 LCS-84 1-382320-7 821574-1
    Text: Selecting Sockets for Altera Devices January 1998, ver. 2 Introduction Application Note 80 Altera offers a number of surface-mount packages. Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board


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    Yamaichi IC51-0444-1568

    Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
    Text: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production


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    BGA reflow guide

    Abstract: JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile
    Text: Solder Reflow Guide for Surface Mount Devices June 2009 Technical Note TN1076 Introduction This technical note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards. Each board has its own profile which


    Original     		PDF TN1076 1-800-LATTICE BGA reflow guide JEDEC SMT reflow profile BGA PROFILING 304-PQFP reballing fine BGA thermal profile

    D48X

    Abstract: 11 ak 30 a4
    Text: Package Diagrams October 2004 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH 5 E 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE -A- D c 5 6 eA Z Z 4 A2 A eB 7 -CSEATING PLANE .015 A1 L b2 10 b .010 GAGE


    Original     		PDF 16-Pin D48X 11 ak 30 a4

    84 pin plcc lattice dimension

    Abstract: C045
    Text: Package Diagrams November 2003 16-Pin Plastic DIP Package Dimensions in Inches -BN/2 b1 1 WITH LEAD FINISH E 5 6 CL E1 c1 c N SEE DETAIL A BASE METAL (b) SECTION Z-Z CL BASE PLANE c 5 -A- D 6 eA Z Z 4 A2 A eB 7 -C.015 SEATING PLANE A1 L b2 10 b .010 GAGE


    Original     		PDF 16-Pin 84 pin plcc lattice dimension C045

    SMD MARKING CODE 071 A01

    Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
    Text: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods


    Original     		PDF LCC-26P-M09 LCC-28P-M04 LCC-28P-M05 LCC-28P-M06 LCC-28P-M07 LCC-28C-A04 LCC-32P-M03 LCC-40P-M01 LCC-42P-M01 SMD MARKING CODE 071 A01 smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo

    3256E

    Abstract: No abstract text available
    Text: ispLSI 3256E In-System Programmable High Density PLD Functional Block Diagram G3 H0 A0 A1 OR Array A2 A3 ORP ORP • IN-SYSTEM PROGRAMMABLE — 5V In-System Programmable ISP using Lattice ISP or Boundary Scan Test (IEEE 1149.1) Protocol — Increased Manufacturing Yields, Reduced Time-toMarket, and Improved Product Quality


    Original     		PDF 3256E 3256E-100LQ1 304-Pin 3256E-100LQA 3256E-100LB320 320-Ball 3256E-70LQ1 3256E-70LQA 3256E

    AEG PS 431 relay manual

    Abstract: AEG PS 431 relay protocol caterpillar cat data link ford eec V relay AEG PS 431 LM304 HD9063 Murphy Controller TTD
    Text: an Enovation Controls Brand an Enovation Controls Brand ECONTROLS, INC 5311 South 122nd East Avenue Tulsa, Oklahoma 74146 USA Phone: +1 918 317 4100 Fax: +1 918 317 4266 E-mail: sales@fwmurphy.com Website: www.fwmurphy.com 5757 Farinon Drive San Antonio, Texas 78249 USA


    Original     		PDF 122nd AEG PS 431 relay manual AEG PS 431 relay protocol caterpillar cat data link ford eec V relay AEG PS 431 LM304 HD9063 Murphy Controller TTD

    48V-to-12V

    Abstract: smd TRANSISTOR marking T1
    Text: V•I Chip – BCM Bus Converter Module TM B048K120T15 Vin = 42 - 53 V Vout = 10.5 - 13.25 V Iout = 12.5 A K = 1/4 Rout = 32 mΩ max • 48V to 12V V•I Chip Converter • >96% efficiency • 150 Watt 225 Watt for 1 ms • 125°C operation • High density – up to 600 W/in3


    Original     		PDF B048K120T15 11/03/10M 48V-to-12V smd TRANSISTOR marking T1

    marking code SMD Transistor 2ak

    Abstract: smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 marking code SMD Transistor 2ak smd code marking NEC g TRANSISTOR SMD MARKING CODE 3401 transistor 5dx smd fairy liquid marking code AE SMD Transistor UPD65013 1.6/SmD TRANSISTOR av Ultrasonic humidifier circuit koki solder paste

    3256E

    Abstract: No abstract text available
    Text: ispLSI 3256E Device Datasheet June 2010 All Devices Discontinued! Product Change Notifications PCNs have been issued to discontinue all devices in this data sheet. The original datasheet pages have not been modified and do not reflect those changes. Please refer to the table below for reference PCN and current product status.


    Original     		PDF 3256E 3256E 3256E-70LB320 3256E-100LB320 3256E-70LQA 3256E-100LQA 3256E-70LQA1 3256E-100LQA1

    LGA 1156 PIN OUT diagram

    Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
    Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and


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    GE4F

    Abstract: UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00
    Text: Information SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL Document No. C10535EJ9V0IF00 9th edition Date Published December 1997 N Printed in Japan 1989 [MEMO] No part of this document may be copied or reproduced in any form or by any means without the prior written


    Original     		PDF C10535EJ9V0IF00 GE4F UPD65013 74022a SMD BGA 672 DRAWING ULF-210R TRANSISTOR SMD MARKING CODE 352 UPD7514 UPC451G2 smd TRANSISTOR code YW UPD74HC00

    IC51-128

    Abstract: transistor fpq 630 PC-68 TTP-48DF OF IC 7421 Enplas fpq Enplas PT740 AB am fm radio Hitachi DSAUTAZ005
    Text: Hitachi Semiconductor Package Data Book Introduction Contents Section 1 Introduction of Packages 1.1 Types of Packages and Advantages 1.2 IC Package Name and Code Indication 1.3 Method of Indicating IC Package Dimensions 1.4 Lineups in Terms of Shapes and Materials


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    PT740 AB

    Abstract: 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 ADE-410-001J BP-108 EDR7315 QP4-064050-002-A
    Text: Hitachi Semiconductor Package Data Book ADE-410-001J 11th Edition March/2002 Semiconductor & Integrated Circuits Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF ADE-410-001J March/2002 PT740 AB 095G Unitechno rfpak fuji semiconductors manual 652B0082211-002 BP-108 EDR7315 QP4-064050-002-A

    panasonic inverter dv 707 manual

    Abstract: 018T A423 Mosfet FTR 03-E Arcotronics 1.27.6 nsl 7053 mkp DX 3500 manual Honeywell DBM 01A Polyester capacitors 823k 250V SPRAGUE powerlytic 36Dx sprague 68D
    Text: PASSIVE COMPONENTS Resistors Networks and Arrays Bourns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 590, 591, 592 Caddock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 593 CTS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 594


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    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    P1020EC

    Abstract: P1020E P1020 QorIQ P1020 QorIQ dhrystone RGMII to SGMII bridge P1020DDR boot configuration pins in p1020 SDHC physical layer 3P1020
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: P1020EC Rev. M, 02/2011 P1020 P1020 QorIQ Integrated Processor Hardware Specifications The following list provides an overview of the feature set: • Dual high-performance 32-bit cores, built on Power


    Original     		PDF P1020EC P1020 P1020 32-bit 36-bit P1020E QorIQ P1020 QorIQ dhrystone RGMII to SGMII bridge P1020DDR boot configuration pins in p1020 SDHC physical layer 3P1020

    cpcap motorola audio

    Abstract: motorola DSR 505 A0-A21 DSP56600 DSP56652 CTS 366 Nippon capacitors cpcap motorola mcu cpcap motorola 3.2 51
    Text: Order this document by: DSP56652/D Rev 1, 1/99 MOTOROLA SEMICONDUCTOR TECHNICAL DATA DSP56652 Advance Information INTEGRATED CELLULAR BASEBAND PROCESSOR Motorola designed the ROM-based DSP56652 to support the rigorous demands of the cellular subscriber market. The high level of on-chip integration in the DSP56652 minimizes application


    Original     		PDF DSP56652/D DSP56652 DSP56652 32-bit DSP56600 cpcap motorola audio motorola DSR 505 A0-A21 CTS 366 Nippon capacitors cpcap motorola mcu cpcap motorola 3.2 51

    matrix m21

    Abstract: VSC870 VSC880 X11011
    Text: VITESSE SEMICONDUCTOR CORPORATION Datasheet High Performance 16 x16 Serial Crosspoint Switch VSC880 Features • Supports Variable Length Packets in Packet Mode • 16 X 16 Synchronous Serial Cross Point Switch • Serial Data Rates are 2.0Gb/s • Built-in Flow Control Channel in Packet Mode


    Original     		PDF VSC880 32Gb/s 32Gb/s VSC870 1300mV 1000mV. VSC880TY2 0-70oC 0-85oC G52191-0, matrix m21 VSC870 VSC880 X11011

    BGA 256 PACKAGE power dissipation

    Abstract: motorola transistor t75 PPC604E
    Text: SA14-2054-00 IBM Order Number MPC604E9VEC/D (Motorola Order Number) 7/96 TM Advance Information PowerPC 604e RISC Microprocessor Family: PID9v-604e Hardware Specifications The PowerPC 604e microprocessor is an implementation of the PowerPC™ family of reduced


    OCR Scan     		PDF SA14-2054-00 MPC604E9VEC/D 604eTM PID9v-604e 604TM MPC604e PPC604e. Topic20. BGA 256 PACKAGE power dissipation motorola transistor t75 PPC604E

    ep330

    Abstract: CLASSIC EPLD FAMILY altera EP1810
    Text: Operating Requirements for Altera Devices March 1995, ver. 6 Datasheet A ltera devices com bine unique program m able logic architectures w ith advanced C M O S processes to p rovid e exceptional perform ance and re lia b ility. To m aintain the highest possible perform ance and re lia b ility of


    OCR Scan     		PDF