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    HEAT SINK DESIGN TOSHIBA Search Results

    HEAT SINK DESIGN TOSHIBA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DF2B5M4ASL Toshiba Electronic Devices & Storage Corporation TVS Diode (ESD Protection Diode), Bidirectional, +/-3.6 V, SOD-962 (SL2) Visit Toshiba Electronic Devices & Storage Corporation
    74HC4053FT Toshiba Electronic Devices & Storage Corporation CMOS Logic IC, SPDT(1:2)/Analog Multiplexer, TSSOP16B, -40 to 125 degC Visit Toshiba Electronic Devices & Storage Corporation
    TK190U65Z Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 650 V, 15 A, 0.19 Ohm@10V, TOLL Visit Toshiba Electronic Devices & Storage Corporation
    TK7R0E08QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 64 A, 0.0070 Ohm@10V, TO-220AB Visit Toshiba Electronic Devices & Storage Corporation
    TCR5RG28A Toshiba Electronic Devices & Storage Corporation LDO Regulator, Fixed Output, 2.8 V, 500 mA, WCSP4F Visit Toshiba Electronic Devices & Storage Corporation

    HEAT SINK DESIGN TOSHIBA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    equivalent 2sk2837 mosfet

    Abstract: No abstract text available
    Text: Power MOSFET Heat Sink Design Power MOSFET in Detail 6. Heat Sink Design 6.1 Maximum Allowable Power Dissipation and Radiation Equivalent Circuits When the circuit has been designed for fully adequate thermal stability, the maximum allowable power dissipation PDmax for power MOSFETs can be determined based on the power MOSFET’s


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    J137

    Abstract: nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac
    Text: Power Solid-state Relay G3PA- VD Extremely Thin Relays Integrated with Heat Sink • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. (Except for


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    PDF G3PA-260B-VD, G3PA-450B-VD-2. G3PA-210B-VD G3PA-220B-VD K094-E1-04 J137 nissei capacitor nissei capacitors capacitor list nissei datasheet G32A-A20-VD G32A-A430 capacitor list nissei G3PA-220B-VD i2t graph phototriac

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
    Text: Solid State Relays G3PA Refer to Warranty and Application Considerations page 1 , Safety Precautions (page 4), and Technical and Safety Information (page 6). Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink.


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    PDF G3PA-260B-VD G3PA-450B-VD-2. K094-E1-06 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-450B-VD-2

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


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    PDF G3PA260B-VD G3PA-450B-VD-2. K094-E1-06 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


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    PDF G3PA260B-VD G3PA-450B-VD-2. G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-450B-VD-2 J-21

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260B-VD G3PA-430B-VD-2 G3PA-450B-VD-2
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.


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    PDF G3PA-260B-VD G3PA-450B-VD-2. G3PA-430B-VD-2 DC12-24) omron247 NL-2132 J26I-E-01 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-450B-VD-2

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    Abstract: No abstract text available
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.


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    PDF G3PA-260B-VD G3PA-450B-VD-2. G3PA-430B-VD-2 DC12-24) J01C-E-01a

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    Abstract: No abstract text available
    Text: Solid State Relays G3PA CSM_G3PA_DS_E_3_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


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    PDF G3PA260B-VD G3PA-450B-VD-2.

    G3PA-210BL-VD

    Abstract: G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2
    Text: Solid State Relays G3PA CSM_G3PA_DS_E_2_1 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


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    PDF G3PA260B-VD G3PA-450B-VD-2. G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD G3PA-260B-VD G3PA-450B-VD-2

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    Abstract: No abstract text available
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.


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    PDF G3PA-260B-VD G3PA-450B-VD-2. G3PA-430B-VD-2 DC12-24) X301-E-1b

    EN60947

    Abstract: EN6094 G32A-A10-VD G3PA-210B-VD DC5-24 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G32A-A430 G3PA-240B-VD
    Text: Solid State Relays G3PA Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA-260B-VD and G3PA-450B-VD-2.


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    PDF G3PA-260B-VD G3PA-450B-VD-2. G3PA-430B-VD-2 DC12-24) X301-E-1 EN60947 EN6094 G32A-A10-VD G3PA-210B-VD DC5-24 G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G32A-A430 G3PA-240B-VD

    G3PA

    Abstract: TOSHIBA DIODE CATALOG Wiring Duct G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD
    Text: Solid State Relays G3PA CSM_G3PA_DS_E_2_2 Extremely Thin Relays Integrated with Heat Sinks • Downsizing achieved through optimum design of heat sink. • Mounting possible via screws or via DIN track. • Close mounting possible for linking terminals. Except for G3PA260B-VD and G3PA-450B-VD-2.


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    PDF G3PA260B-VD G3PA-450B-VD-2. G3PA TOSHIBA DIODE CATALOG Wiring Duct G3PA-210BL-VD G3PA-210B-VD G3PA-220BL-VD G3PA-220B-VD G3PA-240BL-VD G3PA-240B-VD G3PA-260BL-VD

    TL12

    Abstract: TL12W01-D TL12W02-D TL12W02-L
    Text: Application note for Power LED 1 Application note for Power LED (1) <Thermal design for TL12series> 1. Introduction Applications for LED lamps are increasing in many fields, such as cellular phones, automotive interiors/exteriors, amusement equipment, signs/displays and consumer electronic devices. Toshiba provides various


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    PDF TL12series> 100mA; TL12 TL12W01-D TL12W02-D TL12W02-L

    TD62064AFG

    Abstract: TD62064 TD62064APG TD62074AFG TD62074APG DARLINGTON SINK DRIVER TD62074
    Text: TD62064,074APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064APG,TD62064AFG,TD62074APG,TD62074AFG 4ch High-Current Darlington Sink Driver The TD62064APG/AFG and TD62074APG/AFG are high-voltage, high-current darlington drivers comprised of four


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    PDF TD62064 074APG/AFG TD62064APG TD62064AFG TD62074APG TD62074AFG TD62064APG/AFG TD62074APG/AFG TD62064APG TD62074AFG DARLINGTON SINK DRIVER TD62074

    TA7267BP

    Abstract: YG6260 working of fused tube light using diodes TOSHIBA DIODE GLASS MOLD
    Text: [ 2 ] Handling Precautions [ 2 ] Handling Precautions 1. Using Toshiba Semiconductors Safely TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity


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    PDF 20-pin TA7267BP YG6260 working of fused tube light using diodes TOSHIBA DIODE GLASS MOLD

    ignition coil npn power darlington

    Abstract: HSOP16 TD62064 TD62064BFG TD62064BP1G
    Text: TD62064BP1G/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064BP1G,TD62064BFG 4ch High-Current Darlington Sink Driver The TD62064BP1G and TD62064BFG are high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for


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    PDF TD62064BP1G/BFG TD62064BP1G TD62064BFG TD62064BFG TD62064BP1G ignition coil npn power darlington HSOP16 TD62064

    TD62064AP

    Abstract: td62064af equivalent ic ignition coil npn power darlington TD62064AF TD62064AP DIP-16
    Text: TD62064AP/AF TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62064AP, TD62064AF 4ch High-Current Darlington Sink Driver The TD62064AP/AF is high-voltage, high-current darlington drivers comprised of four NPN darlington pairs. All units feature integral clamp diodes for switching inductive


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    PDF TD62064AP/AF TD62064AP, TD62064AF TD62064AP/AF TD62064AP DIP-16 HSOP-16 TD6206 TD62064AP td62064af equivalent ic ignition coil npn power darlington TD62064AF TD62064AP DIP-16

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    Abstract: No abstract text available
    Text: TD62318BPG/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318BPG,TD62318BFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318BPG and TD62318BFG are non-inverting transistor array which are comprised of four NPN darlington output stages


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    PDF TD62318BPG/BFG TD62318BPG TD62318BFG TD62318BFG TD62318BP1G DIP-16

    Untitled

    Abstract: No abstract text available
    Text: TD62308AP/AF TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308AP,TD62308AF 4ch Low Input Active High-Current Darlington Sink Driver The TD62308AP/AF is a non−inverting transistor array which is comprised of four NPN darlington output stages and PNP


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    PDF TD62308AP/AF TD62308AP TD62308AF TD62308AP/AF TD62308AP

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    Abstract: No abstract text available
    Text: TD62318APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318APG,TD62318AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318APG and TD62318AFG are non-inverting transistor arrays which are comprised of four NPN darlington output stages


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    PDF TD62318APG/AFG TD62318APG TD62318AFG TD62318AFG TD62318APG TD62318AFGe

    TD62308APG

    Abstract: ignition coil npn power darlington TD62308AFG
    Text: TD62308APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62308APG,TD62308AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62308APG/AFG is a non−inverting transistor array which is comprised of four NPN darlington output stages and


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    PDF TD62308APG/AFG TD62308APG TD62308AFG TD62308APG/AFG TD62308APG ignition coil npn power darlington TD62308AFG

    HSOP16-P-300-1

    Abstract: No abstract text available
    Text: TD62318BPG/BFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318BPG,TD62318BFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318BPG and TD62318BFG are non-inverting transistor array which are comprised of four NPN darlington output stages


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    PDF TD62318BPG/BFG TD62318BPG TD62318BFG TD62318BFG TD62318BP1G DIP-16 HSOP16-P-300-1

    TD62318AFG

    Abstract: TD62318APG
    Text: TD62318APG/AFG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62318APG,TD62318AFG 4ch Low Input Active High-Current Darlington Sink Driver The TD62318APG and TD62318AFG are non-inverting transistor arrays which are comprised of four NPN darlington output stages


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    PDF TD62318APG/AFG TD62318APG TD62318AFG TD62318AFG TD62318APG

    2SB553

    Abstract: No abstract text available
    Text: TO SH IBA 2SB553 TOSHIBA TRANSISTOR SILICON PNP TRIPLE DIFFUSED TYPE PCT PROCESS 2SB553 INDUSTRIAL APPLICATIONS Unit in mm HIGH CURRENT SWITCHING APPLICATIONS. POWER AMPLIFIER APPLICATIONS. 10.3MAX, Low Collector Saturation Voltage : v CE(sat)= —0.4V (Max.) at 1C= -4 A


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    PDF 2SB553 2SD553. 2SB553