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    HEAT PIPES INTEL Search Results

    HEAT PIPES INTEL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    UE36-C16221-06A4A Amphenol Communications Solutions 1x1 QSFP-DD cage assembly with 13.5mm height fin pin style heat sink, dual light pipe Visit Amphenol Communications Solutions
    UE36C2622106A4A Amphenol Communications Solutions 1x2 QSFP-DD cage with TALL height heat sink, top dual light pipe Visit Amphenol Communications Solutions
    UE36C1621105A3A Amphenol Communications Solutions 1x1 QSFP-DD cage with SAN height fin pin style heat sink, single light pipe Visit Amphenol Communications Solutions
    UE36-C16211-06A4A Amphenol Communications Solutions 1x1 QSFP-DD cage with single light pipe and 13.5mm TALL height fin pin style heat sink Visit Amphenol Communications Solutions
    UE36-C26211-06A3A Amphenol Communications Solutions 1x2 QSFP-DD cage assembly with 6.5mm height fin pin style heat sink and dual light pipe per port Visit Amphenol Communications Solutions

    HEAT PIPES INTEL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    050235

    Abstract: heat pipes E5520 E5504 E5530 LGA1366 E5506 shinetsu
    Text: Xeon 5500 Series Blade High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,


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    050234

    Abstract: LGA1257 heat pipes
    Text: Xeon 7500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 7500 SERIES PROCESSORS Aavid’s line of 7500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,


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    050074

    Abstract: heat pipes X5570 E5520 E5530 LGA1366 E5506 heat pipes intel
    Text: Xeon 5500 Series 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream PCs. Their unique design removes heat using heat pipes, copper,


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    E5520

    Abstract: LGA1366 E5530 E5506 heat pipes E5540
    Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,


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    050232

    Abstract: Intel Xeon 5500 heat pipes LGA1366 X5570 AAvid 050232 Xeon 5500 X557
    Text: Xeon 5500 Series 1U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper,


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    050075

    Abstract: E5540 LGA1366 Intel Xeon 5500 l5520 heat pipes E5506 W3520 E5520 E5530
    Text: Xeon 5500 Series 4U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream servers. Their unique design removes heat using heat pipes, copper, and


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    050233

    Abstract: E5504 Aavid thermalloy 9000 heat pipes intel E5520 E5530 LGA1366 x.25 intel E5506 aavid
    Text: Xeon 5500 Series Active 2U High Performance Heat Sink RoHS Compliant PASSIVE HEAT SINK FOR INTEL XEON 5500 SERIES PROCESSORS Aavid’s line of 5500 series processor heat sinks are suitable for mainstream desktop PCs. Their unique design removes heat using heat pipes, copper, and


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    EP80579

    Abstract: loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard
    Text: White Paper Chris Gonzales and Hwan Ming Wang Thermal/Mechanical Engineers Intel Corporation Thermal Design Considerations for Embedded Applications December 2008 321055 Thermal Design Considerations for Embedded Applications Executive Summary Embedded Applications differ from the typical desktop, server and mobile


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    PDF EP805799 L5408, EP80579 loop heat pipes heat pipes 32-1055 Sicc intel liquid cooling MULTIPLE EFFECT EVAPORATOR heat exchanger process TRANSFORM fanless motherboard

    Untitled

    Abstract: No abstract text available
    Text: PAPER# 2166 LOOP HEAT PIPE TECHNOLOGY FOR COOLING COMPUTER SERVERS Walter Zimbeck, Greg Slavik Technology Assessment & Transfer, Inc. 133 Defense Hwy, Suite 212 Annapolis, MD Ph: 410 224 3710 Email: zimbo@techassess.com John Cennamo, Sukhvinder Kang Aavid Thermalloy


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    heat sink

    Abstract: prestonia pentium m 790
    Text: P R E L I M I N A R Y Pentium 4 1-U High Performance Heat Sink Part Number 037704 HIGH PERFORMANCE HEAT SINK DESIGNED FOR 1-U SERVER APPLICATIONS USING THE PENTIUM® 4 PROCESSOR 423 pin, XeonTM, Foster, Prestonia, Gallatin Rely on Aavid Thermalloy's high performance heat pipe heat sink


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    thermalloy 250

    Abstract: thermal resistance case heat sink 444X Aavid 315G heat pipes intel AAVID/-
    Text: Pentium 4 4-U High Performance Heat Sink Part Number 037862 HIGH PERFORMANCE HEAT SINK DESIGNED FOR 4-U SERVER APPLICATIONS USING THE PENTIUM® 4 PROCESSOR 423 pin, XeonTM, Foster, Prestonia, Gallatin Rely on Aavid Thermalloy's high performance heat pipe heat sink


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    thermal test vehicle -intel

    Abstract: X23776 G751
    Text: Heat Sink for Intel Nocona 3.2GHz in 1U Servers Preliminary PASSIVE HEAT SINK FOR INTEL® NOCONA™ 3.2GHz PROCESSORS Aavid’s solution for Nocona™ 3.2GHz processors is designed specifically for thermal engineers who require high performance solution for single processor 1U servers.


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    honeywell pcm45

    Abstract: CEK 550 PCM45F G751 thermal test vehicle -intel
    Text: Heat Sink for Intel Xeon Potomac MP and Nocona DP Processors in 4U Servers PASSIVE HEAT SINK FOR INTEL® XEON™ POTOMAC MP AND NOCONA DP PROCESSORS Aavid’s solution for Xeon™ Potomac MP and Nocona DP processors is designed specifically for thermal engineers


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    heat pipes

    Abstract: prestonia aavid
    Text: Pentium 4 2-U High Performance Heat Sink Part Number 037863 HIGH PERFORMANCE HEAT SINK DESIGNED FOR 2-U SERVER APPLICATIONS USING THE PENTIUM® 4 PROCESSOR 423 pin, XeonTM, Foster, Prestonia, Gallatin Rely on Aavid Thermalloy's high performance heat pipe heat sink


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    arstech

    Abstract: No abstract text available
    Text: Proceedings of IPACK2007 ASME InterPACK '07 July 8-12, 2007, Vancouver, British Columbia, CANADA IPACK2007-33870 CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER SYSTEMS Sukhvinder Kang kang@aavid.com David Miller John Cennamo Aavid Thermalloy LLC,


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    PDF IPACK2007 IPACK2007-33870 D2570-96 arstech

    hydrosink

    Abstract: No abstract text available
    Text: RoHS Compliant Celebrating xc Years of Innovation Lz/whqcLw HydroSinkTMYvsYAirYCoolingYSystem HIGHERYRELIABILITYY HydroSink is an intelligent, innovative, high performance Liquid Cooling System which aims to replace existing air cooled systemsp HydroSink™ is the most efficient and convenient


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    PDF 822nhppngjfH4dChina4toll4freec UHhnrpnhppjr222 hydrosink

    Untitled

    Abstract: No abstract text available
    Text: Datasheet ECL-PTU Series LonMark Certified Powered Terminal Unit Programmable Controllers Overview The ECL-PTU Series are microprocessor-based programmable controllers designed to control powered terminal units such as powered fan coil units, heat pumps units, and chilled beams.


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    PDF 05DI-DSELPTU-11

    liquid cooling systems

    Abstract: ACS010-HX
    Text: Successfully delivering electronics cooling solutions since 1964 Liquid Cooling Systems Liquid-Air Heat Exchangers Stand-Alone Hydraulic Modules Integrated Cooling Systems Liquid Cold Plates Aavid’s liquid cooling system, coupled with Aavid’s liquid cold plates,


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    SUS304-WPB MATERIAL

    Abstract: SPRON100 SPRON510 SUS304-WPB disc springs SUS304WPB SUS316L properties SUS316L corrosion
    Text: C M Y C K Micro-Energy Division who manufactures the products described in this catalog holds the ISO 9001 quality management system certificate, and the ISO 14001 environmental management systems certificate. www.sii-me.com Asia 4-5/F, Wyler Centre 2, 200 Tai Lin Pai Rd.,


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    PDF SPRON100 D-63263 F-92600 CAS1010EJ0005-10C SUS304-WPB MATERIAL SPRON100 SPRON510 SUS304-WPB disc springs SUS304WPB SUS316L properties SUS316L corrosion

    Project Report of fire alarm

    Abstract: Project Report of simple fire alarm asp105 AIR FLOW DETECTOR FULL REPORT power wizard 1.1 fault codes
    Text: FAAST Fire Alarm Aspiration Sensing Technology Table of Contents 3825 Ohio Avenue, St. Charles, Illinois 60174 1.800.SENSOR2; Fax: 630.377.6495 www.systemsensor.com Modifying the Pipe Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10


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    PDF SS-400-007 E56-3621-003 Project Report of fire alarm Project Report of simple fire alarm asp105 AIR FLOW DETECTOR FULL REPORT power wizard 1.1 fault codes

    mps 0940

    Abstract: jedec footprint MO-220 VHHD-2 32-lead TQFP TQFP 80 slug up top programmable delay JEDEC Drawing MO-220 7mm tqfp 64 pcb land pattern
    Text: FemtoClock LVDS Programmable Delay Line ICS854S295I-25 DATA SHEET General Description Features The ICS854S295I-25 is a high performance LVDS Programmable Delay Line. The delay can vary from 1.6ns to 16.0ns in 10ps steps. The ICS854S295I-25 is characterized to operate from a 2.5V power


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    PDF ICS854S295I-25 ICS854S295I-25 10-bit mps 0940 jedec footprint MO-220 VHHD-2 32-lead TQFP TQFP 80 slug up top programmable delay JEDEC Drawing MO-220 7mm tqfp 64 pcb land pattern

    intel packaging handbook 240800

    Abstract: heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759
    Text: A AP-759 APPLICATION NOTE Intel Embedded Processor Module EMBMOD133 Thermal Design Guide December, 1997 Order Number: 273143-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of


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    PDF AP-759 EMBMOD133) Inte31 intel packaging handbook 240800 heat pipes intel CompactPCI specification 82439HX EMBMOD133 EMBMOD166 273143 intel 82439hx tqfp 44 thermal resistance Intel AP-759

    Superior performance Co-Ni Alloy Product (SPRON)

    Abstract: SPRON100 SPRON510 Factory Environmental Activities Glossary SUS316L corrosion
    Text: Superior performance Co-Ni Alloy Product SPRON Product Catalogue 2014 Superior Superior performance performance Co-Ni Co-Ni Alloy Alloy Product Product (SPRON) (SPRON) solves designers’ problems " " is a special metal (Co-Ni alloy) developed for mechanical watch


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    PDF SPRON100 SPC3009EJ-01C1402 Superior performance Co-Ni Alloy Product (SPRON) SPRON100 SPRON510 Factory Environmental Activities Glossary SUS316L corrosion

    USB Specification Revision 1.1

    Abstract: NH13734 458 TIMER CIRCUIT COLLECTION EIA-364-52 INCOMING RAW MATERIAL INSPECTION tablet display 10.1 CONNECTOR 5 PIN PET How to convert 4-20 ma two wire transmitter INCOMING RAW MATERIAL INSPECTION procedure nec d 882 p datasheet
    Text: Universal Serial Bus Specification Compaq Intel Microsoft NEC Revision 1.1 September 23, 1998 Universal Serial Bus Specification Revision 1.1 Scope of this Revision The 1.1 revision of the specification is intended for product design. Every attempt has been made to ensure a


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