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Catalog Datasheet	MFG & Type	PDF	Document Tags
hp 530 motherboard circuit and solution Abstract: 500765 IEC-297-1 hp 530 motherboard circuit Noryl GFN 2 - 701 zintec what are the dimensions of 19" rack, 3U height motherboard hp 530 hp 530 motherboard power supply solution bs476 Text: DIPLOMAT Cases An introduction to enclosures Our manufacturing facilities have long been at the forefront of technological development, and their commitment to the providing of the most fit-for-purpose products is demonstrated by the fact that we currently manufacture some of the	Original	PDF
IEC-297-3 Abstract: colour coding mazak ral VERO ELECTRONICS pk 55 29-1251h 10020B vero pk 100 173-202287K alocrom 1200 vero pk-100 AlMgSi0,5 Text: SUBRACK SECTION INDEX A GUIDE TO THE EMC SCREENING OF SUBRACKS . PAGE 4.02 CUSTOMISING OPTIONS . 4.03 II SUBRACK SYSTEMS KM6-I Dimensional Criteria . 4.04-4.07 Toolkit CAD Package . 4.08	Original	PDF
alocrom 1200 Abstract: 173-202287K alocrom BS 1470 NS4 material data sheet Almg3 953-236506A Almg3 5251-H24 173-253258D 173-232669L Text: P A N E L S KM6-II subracks: Front panels To meet the needs of subrack users, we offer a wide range of product conforming to IEC 60297-3 DIN 41494. Versatility is increased by the provision of separate card mounting devices, chosen to suit the user's needs.	Original	PDF	957-236340K 957-236341H 957-236386H 957-236387F 957-236388D 957-236389B 957-236390F 957-236391D 957-236393L 957-236394J alocrom 1200 173-202287K alocrom BS 1470 NS4 material data sheet Almg3 953-236506A Almg3 5251-H24 173-253258D 173-232669L
he9tf Abstract: heatsink with screw 160mm Text: Lawtronics Heatsink Case Kit Model LHSK160 Low Profile Heatsink Case Kit LHSK A free-standing or rack mount enclosure is achieved by combining two interlocking channels with end panels. Eurocard circuit boards can slide into internal card guides enabling power devices to be attached to the heatsink section of the vertical wall with	Original	PDF	LHSK160 160mm) 160mm 160mm LHSK160 he9tf heatsink with screw
he9tf Abstract: heatsink extrusion TOROIDAL transformer specification toroidal transformer enclosure Aluminium Text: Heatsink Enclosures These extruded aluminium channels are designed to be used as robust, low impedance, electronics enclosures, but can also be used as free-standing heatsink. Three different extrusions are available, providing a range of sizes and styles. The standard heatsink HSK is designed to form an 83mm high enclosure capable of	Original	PDF	100VA 160VA 220mm RHS/220 RHSK/220 he9tf heatsink extrusion TOROIDAL transformer specification toroidal transformer enclosure Aluminium