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    foxconn dimm

    Abstract: No abstract text available
    Text: ITEM DESCRIPTIO N Q'TY MATERIAL TREATMENT 1 HOUSING 1 2 CONTACT SAME AS NO. OF POSITION SEE BELOW PHOSPHOR BRONZE 50 ¡1" MIN. NICKEL UNDER PLATING, 100 n " MIN. TIN/LEAD PLATING AT TAIL. (SEE BELOW FOR CONTACT AREA PLATING) 3 METAL SPRING 2 COPPER ALLOY


    OCR Scan     		PDF 500VDC. MIL-STD-208F, IL-STD-1344A IL-STD-202F HC992352 HC98399 HC97164 AS0A12 foxconn dimm

    foxconn ML 94V-0

    Abstract: E551 Foxconn Precision Co foxconn dimm
    Text: DESCRIPTION Q’TY HOUSING 1 METAL SPRING & SOLDER PAD 2 CONTACT TREATMENT MATERIAL THERMOPLASTIC. LCP, UL94 V-0 REMARK IVORY COLOR 50u" MIN. NICKEL UNDER PLATING, l00u” MIN. TIN/LEAD PLATING OVER ALL 50UH MIN. NICKEL UNDER PHOSPHOR BRONZE PLATING, 100U’* MIN. TIN/LEAD


    OCR Scan     		PDF 500VDC. 454Kg) MIL-STD-202F, MIL-STD-1344A, ASQA12 HC97164 foxconn ML 94V-0 E551 Foxconn Precision Co foxconn dimm