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    Untitled

    Abstract: No abstract text available
    Text: D IPPED R A D IA L LEAD C A P A C IT O R Y Seating_ Plane d M EC H A N IC A L G EN E R A L ELECTRICAL SPECIFICATION SPECIFICATION SYFER TYPE 81 31 M WIDTH X m m . 7 .6 2 Max. HEIGHT (Y) m m . 1 1 .6 Max. CAPACITANCE MEASUREMENT : I.O V rm s 1kHz © 20 'C .


    OCR Scan     		PDF H0PW00D ACA4/12059/1

    u.o.s

    Abstract: No abstract text available
    Text: DATE 3.80 Z> 3.80 CO CO 4491 ’L’ LEAD •J' LEAD ’J’ LEAD ’L’ LEAD CHIP SIZE 2 2 2 0 CHIP SIZE 5 5 5 0 3.80 3.80 ’J ’ LEAD ’L’ LEAD CHIP SIZE 2 2 2 5 CHIP SIZE 8 0 6 0 NOTES ON SOLDERING ’J ’ LEAD 1 MAX SOLDERING TEMPERATURE 260‘C


    OCR Scan     		PDF H0PW00D FSA4/01 u.o.s

    Untitled

    Abstract: No abstract text available
    Text: D IPPED R A D IA L LEAD C A P A C IT O R Y Seating_ Plane d M EC H A N IC A L G EN E R A L ELECTRICAL SPECIFICATION SPECIFICATION SYFER TYPE 81 31 M WIDTH X m m . 7 .6 2 Max. HEIGHT (Y) m m . 1 1 .6 Max. CAPACITANCE MEASUREMENT : 0 .5 V rm s 1kHz © 20 'C .


    OCR Scan     		PDF H0PW00D ACA4/11791/1