Untitled
Abstract: No abstract text available
Text: Preliminary GS880F18/36T-10/11/11.5/12/14 100 Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb Sync Burst SRAMs Features • Flow through mode operation. • 3.3V +10%/-5% Core power supply. • 2.5V or 3.3V I/O supply. • LBO pin for linear or interleaved burst mode.
|
Original
|
PDF
|
GS880F18/36T-10/11/11
100-lead
GS880F18/36T1
K880F18/36T1
1/2000L
GS880F1836T
1/2000L;
3/2000N
-10Mhz
|
Untitled
Abstract: No abstract text available
Text: Preliminary GS880F18/36T-10/11/11.5/12/14 100 Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb Sync Burst SRAMs Features 10ns - 14ns 3.3V VDD 3.3V & 2.5V I/O broadest access to multiple vendor sources. Boards designed with FT pin pads tied low may be stuffed with GSI’s Pipeline/Flow through
|
Original
|
PDF
|
GS880F18/36T-10/11/11
GS880F1836T
1/2000L;
3/2000N
-10Mhz
1/2000N;
3/2000O
|
GS880F18T-11
Abstract: tqfp 64 thermal resistance
Text: Preliminary GS880F18/36T-11/11.5/12/14/18 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 8Mb Sync Burst SRAMs Features 11 ns–18 ns 3.3 V VDD 3.3 V and 2.5 V I/O RAMS should be designed with V SS connected to the FT pin location to ensure the broadest access to multiple vendor
|
Original
|
PDF
|
GS880F18/36T-11/11
100-Pin
-10Mhz
GS880F1836T
2000O;
880F1836
880F18
GS880F18T-11
tqfp 64 thermal resistance
|