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    Untitled

    Abstract: No abstract text available
    Text: Q1-2005 FIT-MTBF REPORT Family Device Physical Transceiver KS8737 FA1444.1 TQFP-64 116 168 GR61122.A2 C66096.02 GR61194.1 GR91434.1M15 GR61294.8 G66021.00 4x4MLF-24 4x4MLF-24 4x4MLF-24 4x4MLF-24 4x4MLF-24 4x4MLF-24 116 56 116 116 115 60 168 168 168 168 168


    Original     		PDF Q1-2005 KS8737 130-150c FA1444 TQFP-64 GR61122 C66096 GR61194 GR91434 GR61294

    Untitled

    Abstract: No abstract text available
    Text: RELIABILITY REPORT DATE : 2/18/05 QUALITY ENG : PART NUMBER : Dinh Pham MIC3001 PROJECT # : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS 23119-3 MIC3001 4x4 MLF-24L AMKOR 0342 GR61294.8 TSMC G700 TSMC 0.35 24016-1 (MIC3001) 4x4 MLF-24L AMKOR


    Original     		PDF MIC3001 MIC3001) MLF-24L GR61294 C66021

    B1340

    Abstract: sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E
    Text: Q1-2004-MICREL- PKG STORAGE LIFE TEST BAKE TA = + 150C Package Family PKG Type Lds Device WM W-SOIC W-SOIC W-SOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC WSOIC 16 16 16 20 28 28 28 28 28 28 28 MIC2027 MIC2527 MIC2527 MIC2177 MIC1700B SY69952ZC SY69952ZC


    Original     		PDF Q1-2004-MICREL- MIC2027 MIC2527 MIC2177 MIC1700B SY69952ZC SY87701V B1340 sy10s897 TSMC 0.18 um CMOS 2A243 bcd3 cmos tsmc 0.18 TSMC 0.25Um MIC29203BU Unisem B816E