Untitled
Abstract: No abstract text available
Text: CSOM www.vishay.com Vishay Dale Thin Film Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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resistivity wire nichrome
Abstract: No abstract text available
Text: CSO Vishay Thin Film Sandwich, 50 mil Pitch, Dual In-Line Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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PDF
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18-Jul-08
resistivity wire nichrome
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Untitled
Abstract: No abstract text available
Text: CSO Vishay Thin Film Sandwich, 50 mil Pitch, Dual In-Line Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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PDF
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11-Mar-11
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marking 722
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder)
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PDF
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03-May-01
marking 722
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resistivity wire nichrome
Abstract: tantalum nitride
Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line Resistor, Through Hole Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)
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Original
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PDF
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2002/95/EC
18-Jul-08
resistivity wire nichrome
tantalum nitride
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Untitled
Abstract: No abstract text available
Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder). • Monolithic construction
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27-Apr-01
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MC ATAU - Precision
Abstract: No abstract text available
Text: MC ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistors for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior temperature cycling robustness • Superior moisture resistivity, |R/R| < 0.5 %
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Original
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PDF
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AEC-Q200
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
MC ATAU - Precision
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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PDF
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18-Jul-08
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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Original
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PDF
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2002/95/EC
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding
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Original
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PDF
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05-May-05
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Untitled
Abstract: No abstract text available
Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding
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Original
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PDF
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05-May-05
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508E-10
Abstract: No abstract text available
Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Lead Pb -Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding
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Original
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PDF
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10-May-05
508E-10
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low Profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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Original
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PDF
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18-Jul-08
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Untitled
Abstract: No abstract text available
Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and
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Original
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PDF
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2002/95/EC
MIL-PRF-83401
MIL-PRF-83401
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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|
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low Profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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Original
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PDF
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08-Apr-05
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding
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Original
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PDF
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08-Apr-05
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Untitled
Abstract: No abstract text available
Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and
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Original
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PDF
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2002/95/EC
MIL-PRF-83401
11-Mar-11
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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Original
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PDF
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08-Apr-05
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Untitled
Abstract: No abstract text available
Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Lead Pb -Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding
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Original
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PDF
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08-Apr-05
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tantalum nitride
Abstract: No abstract text available
Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding no internal solder . • Tighter tolerances than molded standards.
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Original
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PDF
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27-Apr-01
tantalum nitride
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Untitled
Abstract: No abstract text available
Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding
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Original
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PDF
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08-Apr-05
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Untitled
Abstract: No abstract text available
Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no
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Original
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PDF
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08-Apr-05
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MC ATAU - Precision
Abstract: No abstract text available
Text: ACAS 0606 ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistor Array for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior moisture resistivity, |R/R| < 0.5 % 85 °C; 85 % RH; 1000 h
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Original
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PDF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
MC ATAU - Precision
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Untitled
Abstract: No abstract text available
Text: 13 12 10 MATERIALS AND FINISHES BODY: BRASS PLATED GOLD CENTER CONTACT: BERYLLIUM COPPER PLATED GOLD 15.24 COMPLIANT PINS: BERYLLIUM COPPER 5.08 REF .200 TYP PLATED GOLD 2.54 REF .100 TYP 5.08 _ INSULATOR: UHMW POLYETHYLENE SURFACE RESISTIVITY 10E13 OHM/SO
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OCR Scan
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PDF
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10E13
10E18
PS-89675-2830
-348A,
SD-73251-138
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