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    GOLD RESISTIVITY Search Results

    GOLD RESISTIVITY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-ACPRREDAA0 Amphenol Cables on Demand RCA Male Plug Cable Connector (Red) - Amphenol ACPR-RED - Gold Plated Diecast Shell Datasheet
    AV-3.5MINYRCA-015 Amphenol Cables on Demand Amphenol AV-3.5MINYRCA-015 Stereo Y Adapter Cable - Premium Gold Stereo 3.5mm (Headphone Plug) to Dual RCA Y Adapter Cable - 3.5mm Mini-Stereo Male to Dual RCA Male 15ft Datasheet
    DA14580 PLT Golden Unit Renesas Electronics Corporation Bluetooth® Low Energy 16-site Production Line Tool Kit Golden Unit Daughterboard Visit Renesas Electronics Corporation
    PS7804-1A-A Renesas Electronics Corporation Low On-state Resistance, , / Visit Renesas Electronics Corporation

    GOLD RESISTIVITY Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: CSOM www.vishay.com Vishay Dale Thin Film Sandwich, 25 mil Pitch, Dual In-Line Thin Film Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic


    Original     		2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    resistivity wire nichrome

    Abstract: No abstract text available
    Text: CSO Vishay Thin Film Sandwich, 50 mil Pitch, Dual In-Line Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		18-Jul-08 resistivity wire nichrome PDF

    Untitled

    Abstract: No abstract text available
    Text: CSO Vishay Thin Film Sandwich, 50 mil Pitch, Dual In-Line Resistor, Surface Mount Network FEATURES • Lead Pb -free gold plated terminals standard • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		11-Mar-11 PDF

    marking 722

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder)


    Original     		03-May-01 marking 722 PDF

    resistivity wire nichrome

    Abstract: tantalum nitride
    Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line Resistor, Through Hole Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no internal solder)


    Original     		2002/95/EC 18-Jul-08 resistivity wire nichrome tantalum nitride PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding (no internal solder). • Monolithic construction


    Original     		27-Apr-01 PDF

    MC ATAU - Precision

    Abstract: No abstract text available
    Text: MC ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistors for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior temperature cycling robustness • Superior moisture resistivity, |R/R| < 0.5 %


    Original     		AEC-Q200 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 MC ATAU - Precision PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		18-Jul-08 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor, Through Hole Network Low Profile 0.20 Custom FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		2002/95/EC 11-Mar-11 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding


    Original     		05-May-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding


    Original     		05-May-05 PDF

    508E-10

    Abstract: No abstract text available
    Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Lead Pb -Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding


    Original     		10-May-05 508E-10 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low Profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		18-Jul-08 PDF

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


    Original     		2002/95/EC MIL-PRF-83401 MIL-PRF-83401 2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low Profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding


    Original     		08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: CTSP www.vishay.com Vishay Dale Thin Film Molded, Commercial, Single In-Line Thin Film Resistor, Through Hole Network Custom FEATURES • Lead (Pb)-free gold plated terminals standard • Gold to gold terminations (no internal solder) • Exceptional ratio stability over time and


    Original     		2002/95/EC MIL-PRF-83401 11-Mar-11 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Lead Pb -Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding


    Original     		08-Apr-05 PDF

    tantalum nitride

    Abstract: No abstract text available
    Text: Vishay Thin Film Sandwich, 50 Mil Pitch, Dual-In-Line Resistor Networks FEATURES • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermocompression bonding no internal solder . • Tighter tolerances than molded standards.


    Original     		27-Apr-01 tantalum nitride PDF

    Untitled

    Abstract: No abstract text available
    Text: CSD Vishay Thin Film Ceramic Sandwich, Dual-In-Line, Resistor Network Custom FEATURES • Lead (Pb)-Free available • Gold-to-gold terminations. External leads are Pb-free attached directly to gold pads on the ceramic Available substrate by thermo-compression bonding


    Original     		08-Apr-05 PDF

    Untitled

    Abstract: No abstract text available
    Text: CS Vishay Thin Film Ceramic Sandwich, Single-In-Line Resistor Networks Low profile 0.20 Custom FEATURES • Lead (Pb)-free available • Gold-to-gold terminations. External leads are attached directly to gold pads on the ceramic substrate by thermo-compression bonding (no


    Original     		08-Apr-05 PDF

    MC ATAU - Precision

    Abstract: No abstract text available
    Text: ACAS 0606 ATAU - Precision www.vishay.com Vishay Beyschlag Precision Gold Terminated Thin Film Chip Resistor Array for Conductive Gluing FEATURES • Gold terminations for conductive gluing • Superior moisture resistivity, |R/R| < 0.5 % 85 °C; 85 % RH; 1000 h


    Original     		2002/95/EC. 2002/95/EC 2011/65/EU. JS709A 02-Oct-12 MC ATAU - Precision PDF

    Untitled

    Abstract: No abstract text available
    Text: 13 12 10 MATERIALS AND FINISHES BODY: BRASS PLATED GOLD CENTER CONTACT: BERYLLIUM COPPER PLATED GOLD 15.24 COMPLIANT PINS: BERYLLIUM COPPER 5.08 REF .200 TYP PLATED GOLD 2.54 REF .100 TYP 5.08 _ INSULATOR: UHMW POLYETHYLENE SURFACE RESISTIVITY 10E13 OHM/SO


    OCR Scan     		10E13 10E18 PS-89675-2830 -348A, SD-73251-138 PDF