RC1100 CE
Abstract: RC05 SN62 PB36 ag2 RC0550 RC1206 RC2010 RC-722 Vishay Techno RC
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available
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18-Jul-08
RC1100 CE
RC05
SN62 PB36 ag2
RC0550
RC1206
RC2010
RC-722
Vishay Techno RC
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SN62 PB36 ag2
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold
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Original
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PDF
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2002/95/EC
11-Mar-11
SN62 PB36 ag2
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RC-722
Abstract: platinum Hot wire SN62 PB36 ag2 108D RC0550 RC1206 vishay 1001
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES MECHANICAL SPECIFICATIONS Resistive Element Encapsulation Substrate Termination Solder Finish Ruthenium oxide Glass 96 % alumina Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold
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Original
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MIL-STD-202
18-Jul-08
RC-722
platinum Hot wire
SN62 PB36 ag2
108D
RC0550
RC1206
vishay 1001
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Untitled
Abstract: No abstract text available
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available
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Original
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PDF
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2002/95/EC
11-Mar-11
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RC1206* Vishay
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold
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PDF
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2002/95/EC
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
RC1206* Vishay
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RC2010
Abstract: RC1206 Techno RC
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES MECHANICAL SPECIFICATIONS Resistive element Encapsulation Substrate Termination Solder finish Ruthenium oxide Glass 96 % alumina Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold
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Original
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PDF
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2002/95/EC
18-Jul-08
RC2010
RC1206
Techno RC
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Untitled
Abstract: No abstract text available
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold available
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Original
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PDF
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2002/95/EC
18-Jul-08
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RC1206
Abstract: RC1206* Vishay
Text: RC Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination: Gold, palladium silver, platinum gold, platinum silver or platinum palladium gold RoHS*
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18-Jul-08
RC1206
RC1206* Vishay
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C0805X7R250
Abstract: C0402X7R160-104KPP C0402X7R160 C0603X7R250-224KPP Venkel A0201 C0201X7R6R3-104KGP C0402X7R100 C0201X7R C0402X7R100-104K
Text: SIZE & RANGE UPDATES: GOLD & PALLADIUM SILVER Pd/Ag TERMINATIONS - CHIP CAPACITORS P/N SIZE TERMINATION TYPE MAX VALUE STD LEAD TIME C0201X7R6R3-104KGP 0201 Gold 0.1uF 10-12 wks N/A 0201 Palladium Silver N/A N/A C0402X7R100-104KGP 0402 Gold 0.1uF 10-12 wks
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C0201X7R6R3-104KGP
C0402X7R100-104KGP
C0402X7R160-104KPP
C0603X7R250-224KPP
C0805X7R250-105KPE
C0805X7R250
C0402X7R160-104KPP
C0402X7R160
C0603X7R250-224KPP
Venkel
A0201
C0201X7R6R3-104KGP
C0402X7R100
C0201X7R
C0402X7R100-104K
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500 platinum Hot wire
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications • Termination material: Gold, palladium silver, platinum gold, platinum silver or platinum
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Original
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PDF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
500 platinum Hot wire
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Untitled
Abstract: No abstract text available
Text: RC www.vishay.com Vishay Techno Thick Film Chip Resistors, Alternate Terminations FEATURES • Suitable for solderable, epoxy bondable, or wire bondable applications Available • Termination material: gold, platinum silver, platinum palladium gold or solder coated
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Original
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PDF
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2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
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S200-20
Abstract: No abstract text available
Text: LANGUAGE PRODUCT SPECIFICATION ENGLISH 1.0 SCOPE This specification covers the 1.27mm 0.050" centre line gold plated or gold flash over palladium nickel Dimm Connector for 1.27 +/- 0.10 mm th ick memory module. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND PART NUMBER
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E29179
LR019980
T5/MAR/10
U5-0926
DCBRD03
PS-87609-002
PS-87609-002
ES-40000-3996
95/MAR/10
S200-20
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right angle 2 pin pcb connector
Abstract: DDR right angle 240 connector smes-152 UL E29179 CONNECTOR 5 PIN FOR pcb mount MIL-STD pcb connector right angle 24 pin pcb connector hrs connector 30 pin connector pcb mounted
Text: LANGUAGE PRODUCT SPECIFICATION ENGLISH 1.0 SCOPE This specification covers the 1.27mm 0.050" centre line gold plated or gold flash over palladium nickel Dimm Connector for 1.27 +/- 0.10 mm th ick memory module. 2.0 PRODUCT DESCRIPTION 2.1 PRODUCT NAME AND PART NUMBER
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Original
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PDF
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E29179
LR019980
PS-87609-002
ES-40000-3996
95/MAR/10
PS-87609-002
U5-0926
DCBRD03
right angle 2 pin pcb connector
DDR right angle 240 connector
smes-152
UL E29179
CONNECTOR 5 PIN FOR pcb mount
MIL-STD pcb connector
right angle 24 pin pcb connector
hrs connector 30 pin
connector pcb mounted
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SZZA031
Abstract: Cu OSP and Cu SOP gold embrittlement palladium DIAMOND TECHNOLOGIES IPC-A-610C gold embrittlement sn-pb-ag solder paste
Text: Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange Standard Linear & Logic ABSTRACT This gold Au embrittlement study evaluates TI’s original four-layer nickel-palladium (NiPd)
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Original
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PDF
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SZZA031
Cu OSP and Cu SOP
gold embrittlement palladium
DIAMOND TECHNOLOGIES
IPC-A-610C
gold embrittlement
sn-pb-ag solder paste
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lr64026 relay
Abstract: 211sa lr64026 FBR211 d012 111 relay D012 FBR211 Series FBR211SCD006-n FBR211SAD024
Text: MINIATURE RELAY 1 POLE—1 to 2 A FOR SIGNAL SWITCHING FBR211 SERIES RoHS compliant n FEATURES 2 A maximum carrying current Capable of 2 A maximum continuous carrying current in the contact l Superior reliability gold-overlay contacts P type: Gold-overlay silver-palladium contacts
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FBR211
E63615)
LR64026)
lr64026 relay
211sa
lr64026
d012 111 relay
D012
FBR211 Series
FBR211SCD006-n
FBR211SAD024
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d012 111 relay
Abstract: FBR211 Series Fujitsu LR64026 d012 relay 211sa
Text: MINIATURE RELAY 1 POLE—1 to 2 A FOR SIGNAL SWITCHING FBR211 SERIES RoHS compliant n FEATURES 2 A maximum carrying current Capable of 2 A maximum continuous carrying current in the contact l Superior reliability gold-overlay contacts P type: Gold-overlay silver-palladium contacts
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Original
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PDF
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FBR211
E63615)
LR64026)
d012 111 relay
FBR211 Series
Fujitsu LR64026
d012 relay
211sa
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211SA
Abstract: lr64026 d012 111 relay D012 - M relay lr64026 relay
Text: MINIATURE RELAY 1 POLE—1 to 2 A FOR SIGNAL SWITCHING FBR211 SERIES RoHS compliant n FEATURES 2 A maximum carrying current Capable of 2 A maximum continuous carrying current in the contact l Superior reliability gold-overlay contacts P type: Gold-overlay silver-palladium contacts
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Original
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PDF
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FBR211
E63615)
LR64026)
211SA
lr64026
d012 111 relay
D012 - M relay
lr64026 relay
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Untitled
Abstract: No abstract text available
Text: REV ISIO N S SYM ZONE AMPHENOL PART NUMBER CONFIGURATION: U65 — B XX — X X E 0 XX A CONNECTOR TYPE -04 = 4X 12 = 12X PLATING -1 50ju” GOLD 2 30p” GOLD 3 GOLD FLASH OVER PALLADIUM-NICKEL LEAD FREE 4 50p” GOLD (RoHS COMPLIANT)
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OCR Scan
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PDF
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OF047
4X/12X
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Untitled
Abstract: No abstract text available
Text: 10_ |_ 9_ |_ 8_ |_ 7_ | NOTES : I- MATERIAL : POLYESTER FIBER GLASS FILED 94-V-O COLOR BLACK . TERMINAL : COPPER ALLOY. PLATINGS : BASE FINISH: NICKEL CONTACT SURFACE FINISH: GOLD OR GOLD FLASH OVER PALLADIUM NICKEL
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OCR Scan
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PDF
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PS-95009-001
IEC-60603-7
TIA-1096-A
PS-95009-001.
AS-9500I.
PK-95029.
87/0A/22
SDA-95009-F
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Untitled
Abstract: No abstract text available
Text: 1 3 2 Ordering Information: 2075 S 0 * B * * * 1 2 3 4 5 6 7 Material: 8 1. 2. 3. 4. Series No. S: Socket 0: Single stack Plating: F = Selective gold flash over 5 0// nickel R = Selective gold flash over 30//.” palladium / nickel over 5 0// nickel K = Selective 3 0// gold plated over 5 0// nickel
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OCR Scan
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PDF
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E010143
E000210
E010052
E990130
207504S
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85502-5006
Abstract: No abstract text available
Text: 10 N O TES: SEE NOTE U 1- MATERIAL: HOUSING: LCP GLASS FILLED UL 94V0 COLOUR: BLACK TERMINAL: COPPER ALLOY PLATED WITH: BASE FINISH: NICKEL CONTACT SURFACE FINISH: GOLD OR GOLD FLASH OVER PALLADIUM NICKEL. EXCEEDS PRODUCT REQUIREMENTS BASED ON PS-85502-001
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OCR Scan
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PDF
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PS-85502-001
PK-85502.
SD-85502-101
85502-5006
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Untitled
Abstract: No abstract text available
Text: n ES 00 A MATERIALI SHELL li CONTACTS- COPPER ALLOY. HOUSING- UL 94V-0 RATED, THERMOPLASTIC, SEE TABLE. PLATING* CONTACTS- a 076un MINIMUM GOLD OVER a 76un MINIMUM PALLADIUM-NICKEL ON MATING AREA. OR CONTACT ALTRENATE PLATING 0. 76un MINIMUM GOLD ON MATING AREA.
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OCR Scan
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PDF
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076un
187un
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Untitled
Abstract: No abstract text available
Text: DESCRIPTION: 2MM SHUNT LOW PROFILE, .075" 15 MICROINCH GOLD ±.005 ,154 £ .075 ,025 ±,005 ,134 MATERIAL! HDUSING; HIGH TEMP, P A -6T 260° PRDCESS TEMP, CEINT ACT : BERYLLIUM CLIPPER PLATING: 15 MICRD-INCHES PALLADIUM/NICKEL WITH GOLD FLASH OVERALL ELECTRICALS: CURRENT RATING: 1,0 AMPERE MAX,
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OCR Scan
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PDF
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LP1R001
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Untitled
Abstract: No abstract text available
Text: n ES A A A 00 MATERIAL SHELL 1 CONTACTS- COPPER ALLOY. HOUSING- UL 94V-0 RATES. THERMOPLASTIC. SEE TABLE. PLATING* CONTACTS- a 076un MINIMUM GOLD OVER a 76un MINIMUM PALLADIUM-NICKEL ON MATING AREA. OR CONTACT ALTRENATE PLATING 0. 76un MINIMUM GOLD ON MATING AREA.
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OCR Scan
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PDF
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076un
187un
ZSZB17VUZBBi7
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