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Seiko Epson Corporation SG-8018CG-4.2960M-TJHSA0 XTAL OSC XO 4.2960MHZ CMOS SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SG-8018CG-4.2960M-TJHSA0	Reel			1,000	1 - 10 - 100 - 1000 $0.56055 10000 $0.56055	Buy Now
Seiko Epson Corporation SG-8018CG-4.2960M-TJHPA0 XTAL OSC XO 4.2960MHZ CMOS SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SG-8018CG-4.2960M-TJHPA0	Reel			1,000	1 - 10 - 100 - 1000 $0.56055 10000 $0.56055	Buy Now
Seiko Epson Corporation SG-8101CG-4.2960M-TCHPA0 SG-8101CG 4.2960M-TCHPA0: OSC MH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SG-8101CG-4.2960M-TCHPA0	Reel			1,000	1 - 10 - 100 - 1000 $2.07959 10000 $2.07959	Buy Now
Seiko Epson Corporation SG-8101CG-4.2960M-TBGSA0 SG-8101CG 4.2960M-TBGSA0: OSC MH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SG-8101CG-4.2960M-TBGSA0	Reel			1,000	1 - 10 - 100 - 1000 $2.07959 10000 $2.07959	Buy Now
Seiko Epson Corporation SG-8101CG-4.2960M-TCHSA0 SG-8101CG 4.2960M-TCHSA0: OSC MH
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SG-8101CG-4.2960M-TCHSA0	Reel			1,000	1 - 10 - 100 - 1000 $2.07959 10000 $2.07959	Buy Now

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G4296 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram	PDF
sac 326 Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要	Original	PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance	PDF
G43-87 Abstract: G3896 Text: 作成：前回作成： 2001 年 4 月 1998 年 7 月パッケージインフォメーション第 5 章パッケージの熱抵抗本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 5 章部分とな	Original	G42-96 G38-96 G42-96 G43-87 G3896	PDF
QFP160-P-2828-0 Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE	Original		PDF
SMD IC 2025 bl Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20 Text: J2T0011-38-60 まえがき平素は「沖半導体製品」を御愛用いただき厚く御礼申し上げます。エレクトロニクス分野におきましては半導体製品の応用はますます広がりをみせており、その性能機	Original	J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20	PDF
G43-87 Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0 Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要	Original	PC114 G42-96 P-BGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA560-3535-1 13x13x0 25x25x1 35x35x1 G43-87 DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0	PDF