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    G4296 Price and Stock

    Seiko Epson Corporation SG-8018CG-4.2960M-TJHSA0

    XTAL OSC XO 4.2960MHZ CMOS SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SG-8018CG-4.2960M-TJHSA0 Reel 1,000
    • 1 -
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    • 1000 $0.56055
    • 10000 $0.56055
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    Seiko Epson Corporation SG-8101CG-4.2960M-TCHSA0

    SG-8101CG 4.2960M-TCHSA0: OSC MH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SG-8101CG-4.2960M-TCHSA0 Reel 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $2.07959
    • 10000 $2.07959
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    Seiko Epson Corporation SG-8018CG-4.2960M-TJHPA0

    XTAL OSC XO 4.2960MHZ CMOS SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SG-8018CG-4.2960M-TJHPA0 Reel 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $0.56055
    • 10000 $0.56055
    		Buy Now

    Seiko Epson Corporation SG-8101CG-4.2960M-TBGPA0

    SG-8101CG 4.2960M-TBGPA0: OSC MH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SG-8101CG-4.2960M-TBGPA0 Reel 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $2.07959
    • 10000 $2.07959
    		Buy Now

    Seiko Epson Corporation SG-8101CG-4.2960M-TBGSA0

    SG-8101CG 4.2960M-TBGSA0: OSC MH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SG-8101CG-4.2960M-TBGSA0 Reel 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $2.07959
    • 10000 $2.07959
    		Buy Now
    Find more G4296 price and stock on Findchips.com

    G4296 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    sac 326

    Abstract: tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance
    Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要


    Original     		PDF PC114 G4296 513ja 144pin 44pin 100pin G3896 21x24 29x29 P-BGA144-1313-0 sac 326 tsop 138 6-tsop PGA133-C-S14D-2 PGA240 PBGA352 35 G43-87 G38-96 DIP18-P-300-2 TSOP 48 thermal resistance

    G43-87

    Abstract: G3896
    Text: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 5 章 パッケージの熱抵抗 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 5 章部分とな


    Original     		PDF G42-96 G38-96 G42-96 G43-87 G3896

    QFP160-P-2828-0

    Abstract: QFP304 TSOP 66 pin Package thermal resistance TSOP 48 thermal resistance bga 208 PACKAGE QFJ32-P-R450-1 SDIP64-P-750-1 SOJ28-P-400-1 QFP208-P-2828-0 TSOP 48 thermal resistance junction to case
    Text: This version: Apr. 2001 Previous version:Jun. 1997 PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE This document is Chapter 5 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 5. THERMAL-RESISTANCE OF IC PACKAGE


    Original     		PDF

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


    Original     		PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20

    G43-87

    Abstract: DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0
    Text: 5. パッケージの熱抵抗 5. パッケージの熱抵抗 5-1. 熱抵抗概要 - 2 5-2. 熱抵抗一覧 - 5 5 1 5. パッケージの熱抵抗 5-1. 熱抵抗概要


    Original     		PDF PC114 G42-96 P-BGA144-1313-0 P-BGA256-2727-1 P-BGA352-3535-1 P-BGA560-3535-1 13x13x0 25x25x1 35x35x1 G43-87 DIP14-P-300-2 DIP20-P-300-2 DIP36-P-600-2 PBGA-144 G38-96 QFP160 PGA240 QFP208-P-2828-0