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    Text: FTS88130 128Kx8 High Speed SRAM FEATURES Advanced CMOS Technology Fast tOE Automatic Power Down Packages —32-Pin 300 mil DIP and SOJ —32-Pin 400 mil SOJ —32-Pin 600 mil Ceramic DIP —32-Pin 400 mil Ceramic DIP —32-Pin Solder Seal Flatpack —32-Pin LCC 400 x 820 mil [Two-Sided]


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    PDF 128Kx8 FTS88130 --32-Pin FT88130