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    ttl crystal oscillator 32khz

    Abstract: DS3697 FQFP100 TQFP100 5mhz crystal oscillator MQFP-120
    Text: CLR70000 1.0µ 0.8µ L eff CMOS Gate Arrays DS3697 ISSUE 2.0 March 1993 Ordering Information Features • 1.0µ (0.8µ Leff) twin well, epitaxial CMOS process • Architecture optimised for Quad Flat Packs • New peripheral design employing state-of-the-art pad


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    PDF CLR70000 DS3697 CLR70000 ttl crystal oscillator 32khz DS3697 FQFP100 TQFP100 5mhz crystal oscillator MQFP-120

    USART 8251 interfacing with 8051 microcontroller

    Abstract: full 18*16 barrel shifter design 18*16 barrel shifter design USART 8251 USART 8251 expanded block diagram 8251 UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER P4QFP100-GH-1420 interfacing 8051 with ppi USART 8251 interfacing M8490 scsi
    Text: CLA90000 Series High Density CMOS Gate Arrays DS5500 ISSUE 2.0 INTRODUCTZarlinkION BENEFITS The CLA90000 family of gate arrays from Zarlink Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This


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    PDF CLA90000 DS5500 USART 8251 interfacing with 8051 microcontroller full 18*16 barrel shifter design 18*16 barrel shifter design USART 8251 USART 8251 expanded block diagram 8251 UNIVERSAL SYNCHRONOUS ASYNCHRONOUS RECEIVER P4QFP100-GH-1420 interfacing 8051 with ppi USART 8251 interfacing M8490 scsi

    Power Supply PS-613 uk

    Abstract: CQFP44 GP141 DS3820 mux2*1 hp 4552 PSOP28-MP0818 cla85xxx PS-3306 Series Mitel Semiconductor process flow
    Text: CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS3820-2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Mitel Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in


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    PDF CLA80000 DS3820-2 CLA80k 210ps Power Supply PS-613 uk CQFP44 GP141 DS3820 mux2*1 hp 4552 PSOP28-MP0818 cla85xxx PS-3306 Series Mitel Semiconductor process flow

    microprocessors interface 8086 to 8251

    Abstract: USART 8251 interfacing with 8051 microcontroller to design a full 18*16 barrel shifter design USART 8251 18*16 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design
    Text: CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS DS4375 - 2.0 April 1997 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Mitel Semiconductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This


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    PDF CLA90000 DS4375 microprocessors interface 8086 to 8251 USART 8251 interfacing with 8051 microcontroller to design a full 18*16 barrel shifter design USART 8251 18*16 barrel shifter design microprocessors architecture of 8251 USART 8251 expanded block diagram cqfp100 P2QFP100-GH-1420 full 18*16 barrel shifter design

    FQFP100

    Abstract: 5mhz crystal oscillator DS3697 TQFP100 zarlink CLA
    Text: CLR70000 1.0µ 0.8µ L eff CMOS Gate Arrays DS3697 ISSUE 2.0 March 1993 Ordering Information Features • 1.0µ (0.8µ Leff) twin well, epitaxial CMOS process • Architecture optimised for Quad Flat Packs • New peripheral design employing state-of-the-art pad


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    PDF CLR70000 DS3697 CLR70000 FQFP100 5mhz crystal oscillator DS3697 TQFP100 zarlink CLA

    CQFP44

    Abstract: hp 4552 CLA80000 Series MQFP52 clt82xxx O2-A2 CQFP100 gh 312 PS-3306 Series cqfp120
    Text: CLA80000 Series High Density CMOS Gate Arrays DS3820 ISSUE 2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Zarlink Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in


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    PDF CLA80000 DS3820 CLA80k 210ps CQFP44 hp 4552 CLA80000 Series MQFP52 clt82xxx O2-A2 CQFP100 gh 312 PS-3306 Series cqfp120

    SnPb36Ag2

    Abstract: Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100
    Text: Lead-free packaging for semiconductor devices E4 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors / Freescale Semiconductor 24 March 2005 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation


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    PDF 2002/95/E SnPb36Ag2 Lead Free reflow soldering profile BGA Infineon diffusion solder semiconductors cross reference philips pb-free products FeNi42 BGA Ball Crack VSO56 BGA and QFP Package freescale HTQFP100

    TI2050

    Abstract: PLX6150 Intel 21150 Intel 21150 datasheet TI2250 PLX6140 21152 PBGA304 Intel 21152 PI7C8140A
    Text: #81 Pericom PCI-to-PCI Bridge Intel/TI/PLX substitute By Jay Jung Introduction According to different chips and packages in the following list, this application brief provides the pin difference descriptions and the guidelines for device replacement. Each section is


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    PDF PI7C8140A, 128-pin PI7C8148A/B, 160-pin PI7C8150/A/B, 208-pin 256-pin PI7C8152/A/B, TI2050 PLX6150 Intel 21150 Intel 21150 datasheet TI2250 PLX6140 21152 PBGA304 Intel 21152 PI7C8140A

    IC ax 2008 USB FM PLAYER

    Abstract: STi7110 IC ax 2008 used for mp3 player le88221 PI7C9X440SL PI7C9X111SL bl3458 pi3eqx6701 PI3EQX5701 PAS5201
    Text: Table of Contents PAGE 2 3 About Pericom Applications 13 Products - Signal Integrity 14 17 18 19 PCI Express ReDriver SAS/SATA/XAUI ReDriver Digital Video Signal Integrity DisplayPort, HDMI, DVI USB3 ReDriver 21 Products - Connectivity 23 25 27 33 35 45


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    smd code marking 56 sot23-6

    Abstract: marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5
    Text: PACKAGING Package Information Packaging & Ordering Packaging Solutions for Modern Electronic Design In addition to standard legacy packaging, Pericom leads the industry in smaller, more advanced packaging profiles and footprints for today’s designers. Our offerings include very small packages,


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    PDF PI3USB412 PI74STX1GU04A PI3USBA03 PI74STX2G04 PI3USBA201 PI74STX2G14 PI5A121 PI74STX2G4245 PI5A122 smd code marking 56 sot23-6 marking code 604 SOT23-6 PD-1503 smd zG sot 23 smd marking sot23 W16 ic SMD MARKING CODE ad 5.9 ic ap 2068 PD2029 SMD MARKING ed sot23-5 MARKING CODE SMD IC sot23-5

    SnPb36Ag2

    Abstract: J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42
    Text: Lead-free packaging for semiconductor devices E3 presentation Infineon Technologies / ST Microelectronics / Philips Semiconductors June 2003 Content 1 2 3 4 5 6 7 8 9 Aim of this document Legislation Target / Status Standardisation Moisture Sensitivity Level MSL statements


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    PDF 2002/95/EC SnPb36Ag2 J-STD-020B Lead Free reflow soldering profile BGA lead-free solder joint reliability thermal cycle Infineon diffusion solder FeNi42-leadframe reflow temperature bga bga thermal cycling reliability JSTD020B FeNi42

    datasheet MC68000

    Abstract: hardware interface MC68000 MHB 2114 QFP-64 bta 06 400 v PowerPC 740 reference manual MPC603EFE133LN VME to isa bridge hc 7400 BTA 18 800
    Text: 32-BIT EMBEDDED PROCESSORS QUARTER 1, 2004 SG1001/D REV 0 WWW.MOTOROLA.COM/SEMICONDUCTORS About This Revision–Q1/2004 A summary of new information is provided in this section. In addition, a change bar appears in the left margin of every page referenced in this section to mark the


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    PDF 32-BIT SG1001/D Q1/2004 MCF5281 SG1001 MC9328MX21 MMC2100 SG1001/D datasheet MC68000 hardware interface MC68000 MHB 2114 QFP-64 bta 06 400 v PowerPC 740 reference manual MPC603EFE133LN VME to isa bridge hc 7400 BTA 18 800

    hp 4552

    Abstract: O2-A2 CQFP100 PSOP24-MP0816 CLT84 gh 312 clt82xxx CQFP44 diode gp 421 PS-3306 Series
    Text: CLA80000 Series High Density CMOS Gate Arrays DS3820 ISSUE 2.1 July 1997 INTRODUCTION ARRAY SIZES The CLA80k gate array series from Zarlink Semiconductor offers advantages in speed and density over previous array series. Improvements in design combined with advances in


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    PDF CLA80000 DS3820 CLA80k 210ps hp 4552 O2-A2 CQFP100 PSOP24-MP0816 CLT84 gh 312 clt82xxx CQFP44 diode gp 421 PS-3306 Series

    t06 sot23

    Abstract: TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12
    Text: Plastic IC Package Information Tape & Reel Tape and Reel packing system protects Pericom’s products from mechanical and electrical damage and is designed for automatic pick-and-place equipment. Pericom’s tape and reel specifications are in compliance with Electronics Industries Association standards for embossed carrier taping of sur face mount components for Automatic Handling EIA-481, current


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    PDF EIA-481, 13-inch t06 sot23 TQFN-56 TQFN-64 ZL42 SC70-5 w08 SOT23-5 w08 TQFN56 TQFN-72 LQFP64 reel size ZG12

    Untitled

    Abstract: No abstract text available
    Text: THIS DOCUMENT IS FOR MAINTENANCE PURPOSES ONLY AND IS NOT RECOMMENDED FOR NEW DESIGNS MARCH 1993 DS3697-2.0 CLR70000 1.0µ 0.8µ L eff CMOS GATE ARRAYS FEATURES • 1.0µ (0.8µ Leff) twin well, epitaxial CMOS process ■ Architecture optimised for Quad Flat Packs


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    PDF DS3697-2 CLR70000 CLA70000

    P2QFP100-GH-1420

    Abstract: IR 1838 3v with 3 pins
    Text: S i GEC P L E S S E Y s i; M i c o n i i c; r o DECEMBER 1996 r s DS4375-2.0 CLA90000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION BENEFITS The CLA90000 family of gate arrays from GEC Plessey Semiconductors GPS) consists of 14 fixed-size arrays with


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    PDF DS4375-2 CLA90000 144-ACB-4040 208-ACB-4545 209-ACB-4545 84-ACB-2828 P2QFP100-GH-1420 IR 1838 3v with 3 pins

    TL 1838

    Abstract: ITT 2222 A Mitel Semiconductor process flow to design a full 18*16 barrel shifter design pic 1840 ATS 16Mhz MITEL CLA full 18*16 barrel shifter design
    Text: CLA90000 SERIES j j j j ivilTEL HIGH DENSITY CMOS GATE ARRAYS s b m Sc o n â î c t o r DS4375 - 2.0 April 1997 INTRODUCTION BENEFITS The CLA90000 family of gate arrays from Mitel Sem icon­ ductor consists of 14 fixed-size arrays with the option of building optimized arrays with up to 1.1 million gates. This


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    PDF CLA90000 DS4375 84-ACB-2828 144-ACB-4040 208-ACB-4545 209-ACB-4545 TL 1838 ITT 2222 A Mitel Semiconductor process flow to design a full 18*16 barrel shifter design pic 1840 ATS 16Mhz MITEL CLA full 18*16 barrel shifter design

    LT8900

    Abstract: itt 2222a LT89000 2203a ses cree 3535 PS-303 AD clt850 LT8600 2168A LT8500
    Text: Æ | M IT - L I f 1 w II CLA80000 SERIES I Km*Ink HIGH DENSITY CMOS GATE ARRAYS SEMICONDUCTOR DS3820-2.1 July 1997 INTRODUCTION ARRAY SIZES T he C L A 8 0 k gate array se rie s from M itel S e m ico n d u cto r offers advan ta ge s in spe ed and d e n sity over previous array


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    PDF CLA80000 DS3820-2 rra635 MLA85 MLA87 MLT88 MLT89 GA84-ACA-2828 PGA100-ACA-3434 PGA120-ACA-3434 LT8900 itt 2222a LT89000 2203a ses cree 3535 PS-303 AD clt850 LT8600 2168A LT8500

    Untitled

    Abstract: No abstract text available
    Text: Mr ? ma SI GEC PLESSEY MARCH 1993 S E M I C O N D U C T O R S DS3697-2.0 CLR70000 1.0n 0.8|i L eff CMOS GATE ARRAYS F E A TU R E S • 1.0(1 (0.8|i Leff) twin well, epitaxial CMOS process ■ Architecture optimised for Quad Flat Packs ■ New peripheral design employing


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    PDF DS3697-2 CLR70000 CLA70000â

    BMA16X16

    Abstract: No abstract text available
    Text: SI GE C P L E S S E Y MARCH 1997 S E M I C O N D U C T O R S CLA80000 SERIES HIGH DENSITY CMOS GATE ARRAYS INTRODUCTION ARRAY SIZES The CLA80k gate array series from GEC Plessey Semiconductors offers advantages in speed and density over previous array series. Improvements in design combined with


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    PDF CLA80000 CLA80k PGA100-ACA-3434 PGA120-ACA-3434 PGA144-ACA-4040 PGA180-ACA-4040 PGA181 -ACA-4040 PGA257-ACA-5151 BMA16X16