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    schematic inductive proximity sensor

    Abstract: heat sink design guide, IGBT NCDT3300 FP10R06WE3 eddy current measurements chip Micro-Epsilon schematic coil inductive proximity sensor easypim igbt Thermal grease
    Text: The Thermal Heat Sink Interface of IGBT Modules w/o Base Plate A Comprehensive Experimental and Simulation Study P.Kanschat1, Th. Stolze1, D. Kreuzer1, R. Cordes2 1 Infineon Technologies AG, Max Planck Str.5, D-59581 Warstein Germany 2) University of Applied Sciences Südwestfalen, Campus Soest, Dept. Electrical Power Engineering,


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    PDF D-59581 NCDT3300, schematic inductive proximity sensor heat sink design guide, IGBT NCDT3300 FP10R06WE3 eddy current measurements chip Micro-Epsilon schematic coil inductive proximity sensor easypim igbt Thermal grease