1292 BGA
Abstract: amkor flip flip chip bga 0,8 mm FOOTPRINTS USE BY AMKOR Flip Chip Substrate X3941 amkor
Text: LAMINATE data sheet Super FC Features: Super FC® Packages: Amkor’s SuperFC® is THE high performance flip chip solution. Flip chip interconnect utilizes array interconnect of die to substrate as a replacement for conventional wire bonding. This allows the
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lqfp 64 Shipping Trays
Abstract: DS310H
Text: LEADFRAME data sheet Multi-Chip & Stacked-Die Leadframe Packages Features: Multi-Chip Package MCP & Stacked-Die Leadframe Package Amkor's multi-chip package and stacked-die leadframe designs enable package level integration in a low cost, leadframe-based form factor. Leveraging
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HL832N
Abstract: ELC4785 E679 DS7409 MO-298 amkor flip Amkor Technology HL832 MO-192 MO-195
Text: LAMINATE data sheet FlipStack CSP FlipStack® CSP: The FlipStack® CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment
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Abstract: No abstract text available
Text: LAMINATE data sheet Features: et CSP Package: Thermal Performance: Amkor's etCSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The
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DS7409HGB
Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of
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DS820C
DS7409HGB
DS7409HG
FCCSP
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HL832 nx-a
HL832
E700G
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E679
Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking
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amkor
Abstract: amkor exposed pad
Text: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a
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JEDEC Jc-11 free
Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
Text: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw
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amkor exposed pad
Abstract: exposed QFP 128 amkor exposed QFP 144
Text: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small
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CS-007
Abstract: Amkor Electronics Amkor mold compound
Text: LEADFRAME data sheet FusionQuad Body Exposed Pad Size mm Size (mm) 176 ld 14 x 14 6.5 x 6.5 A Electrical: Theta JA (°C/W) by Velocity (m/s) 1.0 2.5 24.6 19.9 17.9 Body Pad Size Size Pkg (mm) 14 x 14 Inductance Capacitance Resistance (mm) Lead 6.5 x 6.5 176 ld
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5M80ZT100
Abstract: 5M570ZM100 5M2210ZF256 5M160ZE64 5m240Zt100 5M1270ZF324 5m570ZT144 EP4CE15F17 5M40ZE64A5 5M1270ZT
Text: The Automotive-Grade Device Handbook The Automotive-Grade Device Handbook 101 Innovation Drive San Jose, CA 95134 www.altera.com AUT5V1-2.0 Document last updated for Altera Complete Design Suite version: Document publication date: 11.0 May 2011 Subscribe 2011 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, HARDCOPY, MAX, MEGACORE, NIOS, QUARTUS and STRATIX are Reg. U.S. Pat.
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CU-106A
Abstract: 0.4mm pitch BGA IPC-6012A beagleboard 0.4mm pitch BGA routing IPC-6012 IPC-D-317 NAND FLASH LGA reflow profile CU-106A shelf life CBB Capacitor Selection Guide
Text: Application Report SPRAAV1B – May 2009 PCB Design Guidelines for 0.4mm Package-On-Package PoP Packages, Part I Keith Gutierrez and Gerald Coley . ABSTRACT
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Abstract: No abstract text available
Text: PRELIMINARY ICS843001-40 FEMTOCLOCKS CRYSTAL-TO-2.5V LVPECL FREQUENCY SYNTHESIZER GENERAL DESCRIPTION FEATURES The ICS843001-40 is an LVPECL output Synthesizer ICS and is a member of the HiPerClocksTM family of high HiPerClockS™ performance devices from IDT. The device uses a
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ICS843001-40
ICS843001-40
40MHz
50MHz,
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25MHz
637kHz
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EPM7128STC100-15
Abstract: EPF10K50RI240-4 ALTERA MAX EPM7128SQC100-15 EPF10K10LC84-3 qpsk modulation VHDL CODE 304 QFP amkor ALTERA EPF10K50RI240-4 MAX7000S EPF10K10LC84-4 EPF10K20A
Text: Newsletter for Altera Customers ◆ First Quarter ◆ February 1997 FLEX Devices: The Gate Array Alternative Altera’s FLEX 10K and FLEX 8000 devices combine the flexibility of programmable logic devices PLDs with the density and efficiency of gate arrays. As PLD unit
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100MHZ
Abstract: 50MHZ MO-220
Text: ICS843001-40 FEMTOCLOCKS CRYSTAL-TO-2.5V LVPECL FREQUENCY SYNTHESIZER GENERAL DESCRIPTION FEATURES The ICS843001-40 is an LVPECL output Synthesizer ICS and is a member of the HiPerClocksTM family of high HiPerClockS™ performance devices from IDT. The device uses a
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25MHz
637kHz
100MHZ
50MHZ
MO-220
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AN315
Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
Text: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are
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AN315
an315 audio power
an315 audio
AN315 AUDIO AMPLIFIER
QFN PACKAGE thermal resistance
"thermal via"
QFN 9X9
QFN PACKAGE Junction to PCB thermal resistance
CS4525
Signal Path Designer
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ICS83PN625I
Abstract: TRANSISTOR REPLACEMENT GUIDE
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN625I DATA SHEET General Description Features The ICS83PN625I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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10-VFQFN
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ICS83PN156I
Abstract: ICS3PN156DIL TRANSISTOR REPLACEMENT GUIDE 2 pin crystal oscillator 20mhZ
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN156I DATA SHEET General Description Features The ICS83PN156I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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10-VFQFN
ICS3PN156DIL
TRANSISTOR REPLACEMENT GUIDE
2 pin crystal oscillator 20mhZ
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ICS843PN187DKI
Abstract: ICS843PN187I
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN187I DATA SHEET General Description Features The ICS83PN187I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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Untitled
Abstract: No abstract text available
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN148I DATA SHEET General Description Features The ICS83PN148I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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Untitled
Abstract: No abstract text available
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN187I DATA SHEET General Description Features The ICS83PN187I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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Untitled
Abstract: No abstract text available
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN625I DATA SHEET General Description Features The ICS83PN625I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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TRANSISTOR REPLACEMENT GUIDE
Abstract: C392C
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN148I DATA SHEET General Description Features The ICS83PN148I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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C392C
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ICS83PN156I
Abstract: ICS3PN156DIL 83PN156DKILF TRANSISTOR REPLACEMENT GUIDE
Text: Programmable FemtoClock NG LVPECL Oscillator Replacement ICS83PN156I DATA SHEET General Description Features The ICS83PN156I is a programmable LVPECL synthesizer that is “forward” footprint compatible with standard 5mm x 7mm oscillators. The device uses IDT’s fourth generation FemtoClock® NG
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ICS83PN156I
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ICS3PN156DIL
83PN156DKILF
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