E700G
Abstract: No abstract text available
Text: Data Sheet LAMINATE fcCSP fcCSP Packages Amkor Technology offers the Flip Chip CSP fcCSP package – a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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DS577G
E700G
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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RCA03-4D
Abstract: SMD resistors codes FCR05 FCR06 FCR 06 smd jumper marking code G RCN06-10R smd code marking resistor RCA03 eia0603
Text: TOKEN FCR, RCA, RCN Chip Resistors Surface Mount Chip Resistors Token has introduced precision surface-mount resistor networks, chip array, and flip-chips. Preview Token has introduced precision surface-mount resistor networks, chip array, and flip-chips. Those no-lead packages are optimized
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Untitled
Abstract: No abstract text available
Text: LUXEON Flip Chip Chip Scale Package LED Introduction Philips Lumileds LUXEON Flip Chip LED Technology enables the next generation of lighting applications. Customers now have complete design flexibility to access Lumileds’ industry leading performance at the die level
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DS116
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Gps circuit diagram
Abstract: POWER DIVIDER 3GHz
Text: SFC2282-50 ChipClampΤΜ Flip Chip TVS Diode with T-Filter PRELIMINARY PROTECTION PRODUCTS Description Features Flip Chip bidirectional EMI/RFI filter with integrated ESD protection ESD protection to The SFC2282-50 is a low pass T-filter with integrated
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SFC2282-50
10MHz)
100MHz
SFC2282-50
Gps circuit diagram
POWER DIVIDER 3GHz
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MF0 IC U1X
Abstract: philips 22c Specification FCP2 Flip Chip Package SOT732CA2 12NC ordering code philips MF0ICU10
Text: INTEGRATED CIRCUITS ADDENDUM MF0 FCP2 U1 Flip Chip Package Specification Product Specification Revision 3.0 PUBLIC Philips Semiconductors October 2004 Philips Semiconductors Product Specification Rev 3.0 October 2004 Flip Chip Package Specification MF0 FCP2 U1
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SCA74
MF0 IC U1X
philips 22c
Specification FCP2 Flip Chip Package
SOT732CA2
12NC ordering code philips
MF0ICU10
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e1 marking
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
e1 marking
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Untitled
Abstract: No abstract text available
Text: VESD05C-FC1 Vishay Semiconductors Flip Chip Protection Diode - Chip Size 0402 Description Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for
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VESD05C-FC1
11-Mar-11
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smd diode marking A3
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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SFC05-5
SFC05-5
SFC05--5
smd diode marking A3
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tvs smd marking 20a
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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SFC05-5
tvs smd marking 20a
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Untitled
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS diode array. They are state-of-the-art devices that utilize solid-state silicon-avalanche technology for superior clamping
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WS609
Abstract: BGA heatsink compressive force solder paste alpha WS609 pcb warpage after reflow BGA PROFILING XAPP426 Alpha WS609 Alpha WS609 solder C-145 FF1152
Text: Application Note: Packaging R Implementing Xilinx Flip-Chip BGA Packages XAPP426 v1.3 March 3, 2006 Summary Xilinx flip-chip BGA package is offered for Xilinx high-performance FPGA products. Unlike traditional packaging in which the die is attached to the substrate face up and the connection is
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XAPP426
200-210oC
2050215oC.
WS609
BGA heatsink compressive force
solder paste alpha WS609
pcb warpage after reflow
BGA PROFILING
XAPP426
Alpha WS609
Alpha WS609 solder
C-145
FF1152
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Untitled
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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Untitled
Abstract: No abstract text available
Text: SFC05-5 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features The SFC05-5 is a five line flip chip TVS array. They are state-of-the-art devices that utilize solid-state siliconavalanche technology for superior clamping performance and DC electrical characteristics. The SFC
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IPC-9701
Abstract: Amkor mold compound coreless substrate amkor flip "IPC-9701"
Text: LAMINATE data sheet FCMBGA Features Thermal Performance Flip Chip Molded Ball Grid Array FCMBGA Packages: Amkor’s flip chip molded BGA (FCMBGA) package enables thinner packaging and improves thermal performance while reducing system cost. Presenting an exposed die format, the
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MS-034
15mm-42
IPC-9701
Amkor mold compound
coreless substrate
amkor flip
"IPC-9701"
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FC-BGA
Abstract: T0812012 daewon tray
Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.
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AN-659-1
FC-BGA
T0812012
daewon tray
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Untitled
Abstract: No abstract text available
Text: A22H165 High-performance class-G stereo headphone amplifier Datasheet - production data • Thermal shutdown A22H165 - Flip-chip Flip-chip package: 1.65 mm x 1.65 mm, 400 µm pitch, 16 bumps Applications Cellular / smart phones Portable media player
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A22H165
DocID026036
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Die Attach epoxy stamping
Abstract: Ablebond 8380 APN3001
Text: APPLICATION NOTE APN3001: Epoxy Die Attachment for GaAs Flip Chip Devices This application note describes the recommended method for die attachment of GaAs flip chip devices. A major concern in developing a process using epoxy as the attachment material for
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APN3001:
Die Attach epoxy stamping
Ablebond 8380
APN3001
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AN2348
Abstract: EIA standards 763 EIA 481-C flip chip bga 0,8 mm WLCSP stencil design EIA 763 Service Manual smd rework station WLCSP chip mount WLCSP flip chip BUT12
Text: AN2348 Application note IPAD 400 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 400 µm pitch Flip Chips. For information on 500 µm Flip Chips, see Application note AN1235.
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AN2348
AN1235.
AN2348
EIA standards 763
EIA 481-C
flip chip bga 0,8 mm
WLCSP stencil design
EIA 763
Service Manual smd rework station
WLCSP chip mount
WLCSP flip chip
BUT12
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PCN0214
Abstract: Altera bga BGA PACKAGE OUTLINE 672-BALL EP1M120 EP20K1000E EPXA10 amkor flip alsic
Text: PROCESS CHANGE NOTICE PCN0214 Copper Lid for Selected Altera BGA and FineLine BGA® Packages Change Description: Altera will be transitioning to an industry-standard copper lid, for its flip-chip BGA and flip-chip FineLine BGA package offerings. Reason for Change:
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PCN0214
packagesK1500E
1020-Ball
EP20K600E
672-Ball
EP20K400
EP20K400E
PCN0214
Altera bga
BGA PACKAGE OUTLINE
EP1M120
EP20K1000E
EPXA10
amkor flip
alsic
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smd diode marking A3
Abstract: No abstract text available
Text: SFC05-4 CSP TVS Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features ! 300 Watts peak pulse power tp = 8/20µs ! Transient protection for data lines to The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state
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SFC05-4
smd diode marking A3
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EIA standards 783
Abstract: smd diode order marking code stmicroelectronics EIA 481-C bulk id EIA standards 763 EIA 763 IEC-60286-3 WLCSP flip chip WLCSP stencil design st smd diode marking code
Text: AN1235 Application note IPAD 500 µm Flip Chip: package description and recommendations for use Introduction This document provides package and usage recomendation information for 500 µm pitch Flip Chips. For information on 400 µm Flip Chips, see Application note AN2348.
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AN1235
AN2348.
EIA standards 783
smd diode order marking code stmicroelectronics
EIA 481-C
bulk id
EIA standards 763
EIA 763
IEC-60286-3
WLCSP flip chip
WLCSP stencil design
st smd diode marking code
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Untitled
Abstract: No abstract text available
Text: SFC05-4 ChipClampΤΜ Flip Chip TVS Diode Array PRELIMINARY PROTECTION PRODUCTS Description Features 300 Watts peak pulse power tp = 8/20µs Transient protection for data lines to The SFC05-4 is a quad flip chip CSP TVS diode array. They are state-of-the-art devices that utilize solid-state
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SFC05-4
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Aluminum alloy - 8053
Abstract: No abstract text available
Text: RBD, RBF, RBH Series Vishay Foil Resistors High Precision Foil Flip Chip Resistor for Load Life High Precision Foil Flip Chip Resistor for Load Life Stability of 0.05% with Low Values from 0.005Ω, Power to 1.5W, 35% Space Saving vs. Wraparound Design FEATURES
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0R123
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Aluminum alloy - 8053
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