Senju M705-GRN360-K2-V
Abstract: Senju M705-GRN360-K2-V solder paste solder paste M705-GRN360-K2-V Senju oz 221 pcb warpage after reflow M705-GRN360 senju M705-GRN360-K2 fh4219
Text: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. 0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors
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Senju M705-GRN360-K2-V
Senju M705-GRN360-K2-V solder paste
solder paste M705-GRN360-K2-V
Senju oz 221
pcb warpage after reflow
M705-GRN360
senju
M705-GRN360-K2
fh4219
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