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    FGG400* PACKAGE Search Results

    FGG400* PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    FGG400* PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    FGG400

    Abstract: bga-100 0.5 DSASW0042006 400-BALL
    Text: R Fine-Pitch FG400/FGG400 BGA Package PK083 (v1.0) March 1, 2005 400-Ball Fine-Pitch BGA, 1.00 mm Pitch (FG400/FGG400) 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF FG400/FGG400) PK083 400-Ball FGG400 bga-100 0.5 DSASW0042006

    FGG400

    Abstract: PK516
    Text: 100% Material Declaration Data Sheet for Spartan -3E/-3A FGG400 Cu Wire Package PK516 (v1.1) March 19, 2012 Average Weight: 1.9400 g Component Substance Description CAS# or Description % of Component Silicon Die Silicon Die Attach Material Mold Compound


    Original     		PDF FGG400 PK516 FGG400 PK516

    Spartan-3an

    Abstract: FTG256 XC3S50AN XC3S700AN UG331 UG332 fgg484 XC3S200AN spartan hdmi DS557
    Text: 1 Spartan-3AN FPGA Family Data Sheet DS557 April 1, 2011 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS557 v4.1 April 1, 2011 DS557 (v4.1) April 1, 2011 • • • • • • • •


    Original     		PDF DS557 DS557 Spartan-3an FTG256 XC3S50AN XC3S700AN UG331 UG332 fgg484 XC3S200AN spartan hdmi

    XC3S700AN FGG484

    Abstract: XC3S400AN-FGG400 XC3S700A FGG484 xc3s200an XC3S400AN FGG400 FGG676 SPARTAN 3an XC3S50A XC3S700AN-FG484 XC3S700AN
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 June 2, 2008 Module 1: Introduction and Ordering Information - DS557-1 v3.1 June 2, 2008 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview


    Original     		PDF DS557 DS557-1 XC3S50AN. XC3S700AN FG484 XC3S1400AN FGG676 DS557-4 XC3S700AN FGG484 XC3S400AN-FGG400 XC3S700A FGG484 xc3s200an XC3S400AN FGG400 SPARTAN 3an XC3S50A XC3S700AN-FG484

    DS557-2

    Abstract: FTG256 FGG484 XC3S200ANTM 3061220
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 September 24, 2007 Module 1: Introduction and Ordering Information - DS557-1 v2.0.1 September 12, 2007 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview


    Original     		PDF DS557 DS557-1 DS557-2 UG331: SRL16 DS529-4 DS557-4 DS557-2 FTG256 FGG484 XC3S200ANTM 3061220

    xilinx platform cable usb

    Abstract: XC3S700AN
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 August 16, 2007 Module 1: Introduction and Ordering Information - DS557-1 v2.0 August 16, 2007 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview


    Original     		PDF DS557 DS557-1 DS557-2 UG331: SRL16 DS529-4 DS557-4 XC3S200AN. xilinx platform cable usb XC3S700AN

    XC3S50AN

    Abstract: XC3S400AN-FGG400 XC3S1400AN xc3s200an L05P Spartan-3an xc3s50an XC3S400AN XC3S700AN DS529 DS557
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 December 12, 2007 Module 1: Introduction and Ordering Information - DS557-1 v3.0 December 12, 2007 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview


    Original     		PDF DS557 DS557-1 XC3S50AN. DS557-4 XC3S50AN XC3S400AN-FGG400 XC3S1400AN xc3s200an L05P Spartan-3an xc3s50an XC3S400AN XC3S700AN DS529

    Untitled

    Abstract: No abstract text available
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 September 12, 2007 Module 1: Introduction and Ordering Information - DS557-1 v2.0.1 September 12, 2007 • • • • • • • • Introduction Features Architectural Overview Configuration Overview In-system Flash Memory Overview


    Original     		PDF DS557 DS557-1 DS529-4 DS557-4

    xc3s50an

    Abstract: XC3S700AN-FG484 Spartan-3AN XC3S700AN-FG484 DS557 Spartan-3an UG332 XC3S1400AN xc3s200an XC3S400AN-FGG400 XC3S700AN XC3s700
    Text: 1 Spartan-3AN FPGA Family Data Sheet DS557 December 2, 2010 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS557 v4.0 December 2, 2010 DS557 (v4.0) December 2, 2010 • • • • • •


    Original     		PDF DS557 DS557 xc3s50an XC3S700AN-FG484 Spartan-3AN XC3S700AN-FG484 Spartan-3an UG332 XC3S1400AN xc3s200an XC3S400AN-FGG400 XC3S700AN XC3s700

    XC3S50AN

    Abstract: XC3S700AN xc3s200an FTG256 616 xc3s200an user FGG484 Spartan-3an xc3s50an spartan3an DS557 XC3S400AN
    Text: 1 Spartan-3AN FPGA Family Data Sheet DS557 November 30, 2010 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS557 v4.0 November 30, 2010 DS557 (v4.0) November 30, 2010 • • • • •


    Original     		PDF DS557 DS557 XC3S50AN XC3S700AN xc3s200an FTG256 616 xc3s200an user FGG484 Spartan-3an xc3s50an spartan3an XC3S400AN

    XC3S50AN-4 TQG144 I

    Abstract: XC3S50AN XC3S50AN TQ144 xc3s200an XC3S400AN FGG484 FGG676 Spartan-3AN XC3S700AN-FG484 XC3S700AN XC3S700AN-FG484
    Text: Spartan-3AN FPGA Family Data Sheet R DS557 November 19, 2009 Product Specification Module 1: Introduction and Ordering Information - DS557-1 v3.2 November 19, 2009 • • • • • • • • Introduction Features Architectural Overview Configuration Overview


    Original     		PDF DS557 DS557-1 DS557-4 XC3S50AN-4 TQG144 I XC3S50AN XC3S50AN TQ144 xc3s200an XC3S400AN FGG484 FGG676 Spartan-3AN XC3S700AN-FG484 XC3S700AN XC3S700AN-FG484

    Untitled

    Abstract: No abstract text available
    Text: R < B L B XA Spartan-3A Automotive FPGA Family Data Sheet DS681 v1.0 April 30, 2008 Product Specification Summary The XA Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in most high-volume, cost-sensitive, I/O-intensive automotive


    Original     		PDF DS681 AEC-Q100

    LVDS-33

    Abstract: virtex 4 vs spartan 3e BLVDS25 XC3S1400 AEC-Q100 DS529
    Text: R <B L Bl ue XA Spartan-3A Automotive FPGA Family Data Sheet DS681 v1.1 February 3, 2009 Product Specification Summary The Xilinx Automotive (XA) Spartan -3A family of FPGAs solves the design challenges in most high-volume, cost-sensitive, I/O-intensive automotive electronics


    Original     		PDF DS681 AEC-Q100 LVDS-33 virtex 4 vs spartan 3e BLVDS25 XC3S1400 DS529

    FGG484

    Abstract: PPDS25 FGG400 FGG400* Package BLVDS-25 UG331
    Text: R < B L B XA Spartan-3A Automotive FPGA Family Data Sheet DS681 v1.0.1 May 7, 2008 Product Specification Summary The XA Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in most high-volume, cost-sensitive, I/O-intensive automotive


    Original     		PDF DS681 32-/64-bit, FGG484 PPDS25 FGG400 FGG400* Package BLVDS-25 UG331

    UG331

    Abstract: 8 bit binary numbers multiplication picoblaze XA3S200A AEC-Q100 DS529 RPT103 PPDS25 ftg256a XA3S700A 8 bit binary numbers division picoblaze
    Text: 57 XA Spartan-3A Automotive FPGA Family Data Sheet DS681 v2.0 April 22, 2011 Product Specification Summary The Xilinx Automotive (XA) Spartan -3A family of FPGAs solves the design challenges in most high-volume, cost-sensitive, I/O-intensive automotive electronics


    Original     		PDF DS681 AEC-Q100 UG331 8 bit binary numbers multiplication picoblaze XA3S200A DS529 RPT103 PPDS25 ftg256a XA3S700A 8 bit binary numbers division picoblaze

    Lead Free reflow soldering profile BGA

    Abstract: XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160
    Text: Application Note: Packaging R XAPP427 v2.4 February 12, 2009 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 Lead Free reflow soldering profile BGA XAPP427 FFG668 BGA reflow guide BFG95 BGA PROFILING TQG144 VOG48 PQG100 PQG160

    LVPECL25

    Abstract: HSTL-18 MiniLVDS25 FGG400 FGG484 CSG484 RSDS25 LVCMOS25 LVDS-25 HSTL18
    Text: XI LI NX AUTOMOTIVE SOLUTION S Spartan-IIE Part Number Logic Resources Clock Resources XA2S50E XA2S100E XA2S150E XA2S200E XA2S300E XA3S50 XA3S200 XA3S400 XA3S1000 XA3S1500 XA3S100E XA3S250E XA3S500E XA3S1200E 50K 100K 150K 200K 300K 50K 200K 400K 1000K 1500K


    Original     		PDF XA2S100E XA2S150E XA2S200E XA2S300E XA3S50 XA3S200 XA3S400 XA3S1000 XA3S1500 XA3S100E LVPECL25 HSTL-18 MiniLVDS25 FGG400 FGG484 CSG484 RSDS25 LVCMOS25 LVDS-25 HSTL18

    CSG484

    Abstract: Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D
    Text: Application Note: Packaging R XAPP427 v2.5 February 4, 2010 Summary Implementation and Solder Reflow Guidelines for Pb-Free Packages Author: Mj Lee Recent legislative directives and corporate driven initiatives around the world have called for the elimination of Pb and other hazardous substances in electronics used in many sectors of


    Original     		PDF XAPP427 CSG484 Lead Free reflow soldering profile BGA FFG676 XAPP427 BGA reflow guide PQG240 CPG196 ipc 610D pcb warpage in ipc standard IPC-A-610D

    XC3S50A/AN VQ100

    Abstract: SPARTAN 3an ttl to mini-lvds XC3S700A FGG484 xilinx XC3S200A Spartan-3an xc3s50an XC3S50AN xilinx MARKING CODE xc3s400a ftg256 spartan 3a
    Text: 6 R Extended Spartan-3A Family Overview DS706 v1.0 July 31, 2008 Product Specification General Description The Extended Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many highvolume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in


    Original     		PDF DS706 XC3S50A/AN VQ100 SPARTAN 3an ttl to mini-lvds XC3S700A FGG484 xilinx XC3S200A Spartan-3an xc3s50an XC3S50AN xilinx MARKING CODE xc3s400a ftg256 spartan 3a

    xc3s400a ftg256

    Abstract: xilinx MARKING CODE SPARTAN 3an XC3S700A FGG484 Xilinx XC3S200AN XC3S50A VQ100 Spartan-3an xc3s50an xilinx XC3S200A 8 bit binary numbers multiplication picoblaze UG331
    Text: 6 R Extended Spartan-3A Family Overview DS706 v1.0.1 January 29, 2010 Product Specification General Description The Extended Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many highvolume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in


    Original     		PDF DS706 xc3s400a ftg256 xilinx MARKING CODE SPARTAN 3an XC3S700A FGG484 Xilinx XC3S200AN XC3S50A VQ100 Spartan-3an xc3s50an xilinx XC3S200A 8 bit binary numbers multiplication picoblaze UG331

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		PDF UG112 UG072, UG075, XAPP427, BFG95

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G