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    ITT Interconnect Solutions CIR030AFFP-32-1P-F80

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    DigiKey CIR030AFFP-32-1P-F80 Bag 10
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    Avnet Americas CIR030AFFP-32-1P-F80 Bulk 13 Weeks 10
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    Mouser Electronics CIR030AFFP-32-1P-F80
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    Newark CIR030AFFP-32-1P-F80 Bulk 10
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    Interstate Connecting Components CIR030AFFP-32-1P-F80
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    Master Electronics CIR030AFFP-32-1P-F80
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    ITT Interconnect Solutions CIR030AFFP-32-22P-F80

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    DigiKey CIR030AFFP-32-22P-F80 Bag 10
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    Avnet Americas CIR030AFFP-32-22P-F80 Bulk 13 Weeks 10
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    Mouser Electronics CIR030AFFP-32-22P-F80
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    Interstate Connecting Components CIR030AFFP-32-22P-F80
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    Master Electronics CIR030AFFP-32-22P-F80
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    ITT Interconnect Solutions FRCIR030FFP-32-31S-F80-T100-VO

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    Avnet Americas FRCIR030FFP-32-31S-F80-T100-VO Bulk 13 Weeks 10
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    Mouser Electronics FRCIR030FFP-32-31S-F80-T100-VO
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    ITT Interconnect Solutions CIR030AFFP-32-22P-F80-VO

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    Avnet Americas CIR030AFFP-32-22P-F80-VO Bulk 13 Weeks 10
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    Mouser Electronics CIR030AFFP-32-22P-F80-VO
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    Master Electronics CIR030AFFP-32-22P-F80-VO
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    ITT Interconnect Solutions FRCIR030AFFP-32A-13P-F80-T29

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    Avnet Americas FRCIR030AFFP-32A-13P-F80-T29 Bulk 13 Weeks 10
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    Mouser Electronics FRCIR030AFFP-32A-13P-F80-T29
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    FFP32 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    FFP32-G1

    Abstract: No abstract text available
    Text: パッケージ外形図 FFP32-G1 32pin 1pin INDEX TOP VIEW 0.35 2pin INDEX 0.254±0.1 0.85±0.15 (SIDE VIEW) 4.5±0.1 0.17 35 0.30 0. 0.103 0.303 1pin (BOTTOM VIEW) 0.5 0.5 0.20 0.365 0.27 4.5±0.1 単位 : mm Ver.2003-08-29


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    FFP32-G1 32pin FFP32-G1 PDF

    G1 Package

    Abstract: 103 transistor diode G1 FFP32-G1
    Text: PACKAGE DIMENSIONS FFP32-G1 32pin 1pin INDEX TOP VIEW 0.35 2pin INDEX 0.254±0.1 0.85±0.15 (SIDE VIEW) 4.5±0.1 0.17 35 0.30 0. 0.103 0.303 1pin (BOTTOM VIEW) 0.5 0.5 0.20 0.365 0.27 4.5±0.1 UNIT : mm


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    FFP32-G1 32pin G1 Package 103 transistor diode G1 FFP32-G1 PDF

    G1 Package

    Abstract: FFP32-G1
    Text: PACKAGE DIMENSIONS FFP32-G1 32pin 1pin INDEX TOP VIEW 0.35 2pin INDEX 0.254±0.1 0.85±0.15 (SIDE VIEW) 4.5±0.1 0.17 35 0.30 0. 0.103 0.303 1pin (BOTTOM VIEW) 0.5 0.5 0.20 0.365 0.27 4.5±0.1 UNIT : mm Ver.2003-08-29


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    FFP32-G1 32pin G1 Package FFP32-G1 PDF

    FFP32-G1

    Abstract: No abstract text available
    Text: パッケージ外形図 FFP32-G1 32pin 1pin INDEX TOP VIEW 0.35 2pin INDEX 0.254±0.1 0.85±0.15 (SIDE VIEW) 4.5±0.1 0.17 35 0.30 0. 0.103 0.303 1pin (BOTTOM VIEW) 0.5 0.5 0.20 0.365 0.27 4.5±0.1 単位 : mm


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    FFP32-G1 32pin FFP32-G1 PDF

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、粘着テーピング、エンボステーピ ング、トレイ及びビニール袋にて出荷しております。


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    50pcs/ 25pcs/ 20pcs/ 16pcs/ 10pcs/ DIP16 DIP18 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 PDF

    JIS C 0806

    Abstract: ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


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    ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 JIS C 0806 ET710 L336 FFP16-C1 EMP14 ET-7101 SDMP30 JRC TE1 TE2 TE3 PDF

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


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    BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 DMP8 pcb pattern QFP100-C2 PDF

    DMP14

    Abstract: DMP16 EMP14 SDMP30 SSOP10
    Text: 推奨フットパターン 推奨フットパターン(表面実装パッケージ) 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、はんだブリッジの発生の有無などを


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    OT-89 USB10-C3 USB12-E3 BCC24 BCC32 BCC36 DMP14 DMP16 EMP14 SDMP30 SSOP10 PDF

    JRC 6001

    Abstract: JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2
    Text: テーピング寸法図 4.テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法(ET-7101:粘着式)」に準じ、エンボスキャリアテーピングの規


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    EIAJET-7101: JISC-0806: 14pin 30pin 24pin 20pin 16pin 18pin JRC 6001 JRC 8002 -71/JRC 8002 EIAJ-RRM-08B EIAJ-RRM-08-B EIAJ-RRM08B kw2j EMP14 SDMP30 EMP20-E2 PDF

    FFP32-G1

    Abstract: GRM36 HK1005 HK1608 NJG1707PG1
    Text: NJG1707PG1 800MHz TDMA FRONT-END GaAs MMIC nGENERAL DESCRIPTION NJG1707PG1 is a front-end IC for a digital cellular phone of 800MHz band. A 2x6 antenna switches and a low noise amplifier are included. The parallel control signals of three bits logic connect T/R


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    NJG1707PG1 800MHz NJG1707PG1 FFP32-G1 GRM36 HK1005 HK1608 PDF

    ET-7101

    Abstract: jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


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    ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 ET-7101 jrc 4001 EMP14 EMP16-E2 EMP20-E2 SDMP30 PDF

    QFP-144L

    Abstract: VSP8 Package EMP8
    Text: PACKAGE DIMENSIONS DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 0.51M IN 1.0±0.2 0.46±0.1 2.54 2.8M IN 0.74MAX 4.7M AX 1.5±0.2 +0.15 0.25 -0.05 ~ 15º UNIT: mm 19.0±0.3 DIP14 8 1 7 6.4±0.2 14 7.62 1.5±0.2 2.54 0.46±0.1 2.8M IN 0.51M IN 4.7M AX 2.03MAX +0.15


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    74MAX DIP14 03MAX DIP16 51MIN 76MAX DIP16-D2 25MAX 84MAX 33MAX QFP-144L VSP8 Package EMP8 PDF

    DMP24 JRC

    Abstract: kw2j JRC 8002 EMP14 SDMP30
    Text: テーピング寸法図 3.テーピング寸法図 テーピング品については粘着テーピングとエンボスキャリアテーピングがあります。 粘着テーピングの規格は、EIAJ「電子部品のテーピング寸法(ET-7101:粘着式)


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    EIAJET-7101: JISC-0806: 14pin 20pin 24pin 30pin 16pin 18pin DMP24 JRC kw2j JRC 8002 EMP14 SDMP30 PDF

    SSOP10

    Abstract: DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube SSOP10 SSOP10 DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 PDF

    tdma block diagram

    Abstract: block diagrams for cellular handsets SSOP10 FFP32-G1 NJG1705V NJG1707PG1 NJG1709KC1 tdma circuit diagram low noise amplifier MMIC
    Text: MULTI-FUNCTION ICs 1.9GHz BAND FRONT-END GaAs MMIC 800MHz TDMA FRONT-END GaAs MMIC NJG1705V/ DATA SHEET NJG1709KC1 DATA SHEET NJG1707PG1 DATA SHEET • GENERAL DESCRIPTION ■ GENERAL DESCRIPTION NJG1705V/NJG1709KC1 is a GaAs MMIC designed mainly for LNA+MIXER IC of 1.5 and 1.9GHz band cellular phone


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    800MHz NJG1705V/ NJG1709KC1 NJG1707PG1 NJG1705V/NJG1709KC1 NJG1707PG1 SSOP10/FLP10-C1 30dBm 10dBm tdma block diagram block diagrams for cellular handsets SSOP10 FFP32-G1 NJG1705V tdma circuit diagram low noise amplifier MMIC PDF

    50PCS

    Abstract: DIP18 DIP20 DIP32 DIP40 SDIP22 SDIP24 SDIP28
    Text: 包装仕様一覧 1.概要 新日本無線は電子機器の軽薄短小化更には自動実装による省力化のニーズに対して、スティックケース、エンボステーピング、トレイ及び ビニール袋にて出荷しております。


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    DIP14 DIP16 DIP18 DIP20 DIP22 DIP24 DIP32 DIP40 SDIP22 SDIP24 50PCS DIP18 DIP20 DIP32 DIP40 SDIP22 SDIP24 SDIP28 PDF

    DMP14

    Abstract: DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP-20-C3
    Text: 推奨フットパターン 推奨フットパターン(表面実装パッケージ) 以下に推奨フットパターンの例を示します。設計に際し実装の容易さ、接続の信頼性、配線スペース、 はんだブリッジの発生の有無などを考慮して下さい。


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    OT-23-6-1 FLP10-C1 SSOP10 SSOP14 SSOP16 SSOP20 SSOP20-B2 SSOP20-C3 SSOP20-F1 SSOP24 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 EMP24-E3 SDMP30 SSOP-20-C3 PDF

    DMP8 pcb pattern

    Abstract: BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2
    Text: RECOMMENDED SOLDER PADS 4. Recommended Solder Pads for Surface Mount Package Recommended solder pads for each package are shown in the following table. Please take easiness of mounting, reliability of bonding, prevention of solder bridge, margin of pattern area into consideration when


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    BCC32 BCC36 PCSP20-CC DMP8 pcb pattern BCC32 QFP80 QFP64-B3 QFP80-C3 DMP14 DMP16 EMP14 EMP16-E2 EMP20-E2 PDF

    EIAJ-RRM-08-B

    Abstract: EMP14 EMP16-E2 EMP20-E2 SC-82AB SC8-2 EIAJRRM08B
    Text: テーピング寸法図 4.テーピング寸法図 エンボスキャリアテーピングの規格はJIS「電子部品のテーピング寸法(C-0806:表面実装部品)」に準じております。 各テーピングでの IC の包装方向、1 リール当りの数量は下記一覧表のようになります。


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    JISC-0806: 14pin 16pin 20pin 24pin 30pin 18pin 22pin 28pin 40pin EIAJ-RRM-08-B EMP14 EMP16-E2 EMP20-E2 SC-82AB SC8-2 EIAJRRM08B PDF

    JRC 8002

    Abstract: EIAJ-RRM-08-B JRC 6001 EMP14 ET-7101 SDMP30 JRC 2105 JRC TE1 TE2 TE3 TE1 JRC EIAJ-RRM-08B
    Text: TAPING DIMENSIONS Taping Dimensions There are two types of taping packing, Adhesive Taping in accordance with EIAJ standard ET-7101 ”Packaging of Electronic Components on Continuous Tapes Adhesive Types ” and Emboss carrier taping in accordance with JIS standard


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    ET-7101 C-0806 14pin 16pin 20pin 24pin 30pin 18pin PLCC28-M2 JRC 8002 EIAJ-RRM-08-B JRC 6001 EMP14 ET-7101 SDMP30 JRC 2105 JRC TE1 TE2 TE3 TE1 JRC EIAJ-RRM-08B PDF

    DIP18

    Abstract: DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube 20pcs/pcs/tray 50pcs/tray DIP18 DIP20 DIP40 SDIP22 SDIP24 SDIP28 SDIP30 TO-252 njrc PDF

    NJG1705V

    Abstract: NJG1707PG1 NJG1709KC1 mmic19
    Text: MULTI-FUNCTION ICs 1.9GHz帯フロントエンドGaAs MMIC 8 0 0 M H z T D M Aフ ロ ン ト エ ン ドI C NJG1705V/ DATA SHEET NJG1709KC1 DATA SHEET NJG1707PG1 DATA SHEET • 概 要 ■ 概 要 NJG1705V/NJG1709KC1は低雑音増幅器とローカルアン


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    NJG1705V/ NJG1709KC1 NJG1707PG1 NJG1705V/NJG1709KC1 NJG1707PG1800MHzTDMA 15/18dB 13/16dB SSOP10/FLP10-C1 30dBm NJG1705V NJG1707PG1 mmic19 PDF

    QFP80-C2

    Abstract: MTP61
    Text: パッケージ外形図 3.パッケージ外形図 DIP8 8.8±0.3 5 1 4 6.4±0.2 8 7.62 2.54 0.46±0.1 2.8MIN 1.0±0.2 0.51MIN 0.74MAX 4.7MAX 1.5±0.2 +0.15 0.25 -0.05 0 ~15゚ 単位 : mm 単位 : mm パッケージ外形図 19.0±0.3 DIP14 8 1 7 6.4±0.2


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    51MIN 74MAX DIP14 DIP14-D1 03MAX 32MAX 39MAX 54MIN 06MAX QFP80-C2 MTP61 PDF

    QFP80

    Abstract: sop28 SSOP10 SOP8 tray reel
    Text: PACKING SPECIFICATION TABLE • General Description NJRC delivers ICs in 4 methods, plastic tube container, two kinds of Taping, tray and vinyl bag packing. Except adhesive tape treated anti electrostatic and contain carbon are using as the ESD Electrostatic


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    25pcs/tube 20pcs/tube 14pcs/tube 10pcs/tube 000pcs/ QFP80 sop28 SSOP10 SOP8 tray reel PDF