FF1148 RAW MATERIAL PROPERTIES Search Results

FF1148 RAW MATERIAL PROPERTIES Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
UE62B46230S021		Amphenol Communications Solutions	1x4 OSFP cage with stainless steel material
UE62B46200S021		Amphenol Communications Solutions	1x4 OSFP cage with stainless steel material
10110818-2005LF		Amphenol Communications Solutions	SFP+ Cable Assembly, 30 AWG, 0.5 meters, passive --standard raw cable, non-halogen free.
10110818-3025LF		Amphenol Communications Solutions	SFP+ Cable Assembly, 28 AWG, 2.5 meters, passive -standard raw cable, non-halogen free.
10110818-4035LF		Amphenol Communications Solutions	SFP+ Cable Assembly, 26 AWG, 3.5 meters, passive -standard raw cable, non-halogen free.

FF1148 RAW MATERIAL PROPERTIES Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
qfn 3x3 tray dimension Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga	PDF
XILINX/part marking Hot Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160	PDF
xilinx topside marking Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G	PDF
xilinx part marking Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the	Original	UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance	PDF
BFG95 Abstract: No abstract text available Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL	Original	UG112 UG072, UG075, XAPP427, BFG95	PDF
FF1148 raw material properties Abstract: BIM G18 Y1 XQ4VSX55 xc4vlx25-10ffg668 XC4VFX60 ROCKETIO H8 hitachi programming manual Hearing Aid Circuit Diagram spartan ucf file 6 Virtex4 XC4VFX60 UG072 xi Text: QPro Virtex-4 Extended Temperature FPGAs DC and Switching Characteristics R DS595 v1.2 December 20, 2007 Preliminary Product Specification QPro Virtex-4 Electrical Characteristics QPro Virtex™-4 FPGAs are available in -10 speed grade and qualified for industrial (TJ = –40°C to +100°C), and for	Original	DS595 10CESnL 10CESnR 10CES 10CESn UG075 FF1148 raw material properties BIM G18 Y1 XQ4VSX55 xc4vlx25-10ffg668 XC4VFX60 ROCKETIO H8 hitachi programming manual Hearing Aid Circuit Diagram spartan ucf file 6 Virtex4 XC4VFX60 UG072 xi	PDF
XAPP680 Abstract: XC2VP20 fg676 hd-SDI deserializer LVDS lv114 parallel to serial conversion vhdl IEEE paper pcb layout mindspeed FF1152 FG256 XC2064 XC3090 Text: RocketIO Transceiver User Guide UG024 v3.0 February 22, 2007 R R “Xilinx” and the Xilinx logo shown above are registered trademarks of Xilinx, Inc. Any rights not expressly granted herein are reserved. CoolRunner, RocketChips, Rocket IP, Spartan, StateBENCH, StateCAD, Virtex, XACT, XC2064, XC3090, XC4005, and XC5210 are	Original	UG024 XC2064, XC3090, XC4005, XC5210 XAPP680 XC2VP20 fg676 hd-SDI deserializer LVDS lv114 parallel to serial conversion vhdl IEEE paper pcb layout mindspeed FF1152 FG256 XC2064 XC3090	PDF