Untitled
Abstract: No abstract text available
Text: Bulletin PD-20533 rev. C 02/03 FD160H06A5B Fred Die in Wafer Form a 0.35 ± 0.01 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS INCHES . 2. CONTROLLING DIMENSION (INCH): d C b NOTES: (0.014 ± 0.0004) c A 40 (1.57) Wafer flat alligned with side b of the die 3. DIMENSIONS AND TOLERANCES:
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PD-20533
FD160H06A5B
S1025
30ETH06/
30EPH06
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30EPH06
Abstract: 30ETH06 S1025 FD160H06A5B
Text: Preliminary Data Sheet PD-20533 rev. A 01/01 FD160H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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PD-20533
FD160H06A5BT
S1025
30ETH06/
30EPH06
160x160
30ETH06
FD160H06A5B
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FD160H06A5B
Abstract: S1025 Semitec 30EPH06 30ETH06
Text: Preliminary Data Sheet PD-20533 rev. B 06/01 FD160H06A5B Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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PDF
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PD-20533
FD160H06A5B
S1025
30ETH06/
30EPH06
160x160
FD160H06A5B
Semitec
30ETH06
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Untitled
Abstract: No abstract text available
Text: PD - 20533 revE FD160H06A5B FRED Die in Wafer Form z z 600V VF = 2.6 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD160H06A5B
345nC
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FD160H06A5B
Abstract: 30EPH06 30ETH06 FD160H06A5F FD160H06A5P S1025
Text: PD - 20533 revE FD160H06A5B FRED Die in Wafer Form z z 600V VF = 2.6 V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter
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FD160H06A5B
345nC
125ability,
12-Mar-07
FD160H06A5B
30EPH06
30ETH06
FD160H06A5F
FD160H06A5P
S1025
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Semitec S1025
Abstract: h306 S-1025
Text: Preliminary Data Sheet PD-20533 11/00 FD160H06A5BT Fred Die in Wafer Form a 0.35 ± 0.01 0.014 ± 0.0004 c 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION (INCH): b C d NOTES: A 40 (1.57) Wafer flat alligned with side b of the die
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Original
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PDF
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PD-20533
FD160H06A5BT
S1025
160x160
Semitec S1025
h306
S-1025
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