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    FD087H02A5B

    Abstract: MIL-HDBK-263 MUR820 S1025 0519J
    Text: I - 0519J revB FD087H02A5B FRED Die in Wafer Form z z 200V VF = 0.975V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage


    Original     		PDF 0519J FD087H02A5B 12-Mar-07 FD087H02A5B MIL-HDBK-263 MUR820 S1025

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    Abstract: No abstract text available
    Text: I - 0519J revB FD087H02A5B FRED Die in Wafer Form z z 200V VF = 0.975V max. 5" Wafer 100% Tested at Probe c Available in Tape and Reel (upon request), Chip Pack, and Sawn on Film d Electrical Characteristics Parameter VFM VRRM IRM trr Description Maximum Forward Voltage


    Original     		PDF 0519J FD087H02A5B