LBGA196
Abstract: AN-1205 CM12 Signal Path Designer
Text: National Semiconductor Application Note 1205 August 2001 Introduction conductors. Both DC and AC Inductance can be provided for packages. To determine which inductance is appropriate for your application, please see the section ’Frequency limitations of R-L-C parameters’.
|
Original
|
PDF
|
|
NAND FLASH BGA
Abstract: BGA NAND Flash BGA PACKAGE thermal profile BGA-56P-M01 MCP NAND FBGA56 FBGA69 32M X 32 MEMORY FLASH BGA FBGA71
Text: Stacked MCP Stacked Multi-Chip Package Stacked MCP is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash memory and SRAM configuration, the pin layout can accomodate a 128 MB combination.Typical package construction
|
Original
|
PDF
|
FBGA69)
IR250
NAND FLASH BGA
BGA NAND Flash
BGA PACKAGE thermal profile
BGA-56P-M01
MCP NAND
FBGA56
FBGA69
32M X 32 MEMORY
FLASH BGA
FBGA71
|
AN-1205
Abstract: CM12 Signal Path Designer
Text: National Semiconductor Application Note 1205 August 2001 INTRODUCTION This note is a snapshot of electrical performance of National’s IC packages. It is provided to help designers get an idea about electrical parasitics associated with the package, and help them compare the electrical performance of different
|
Original
|
PDF
|
AN-1205
AN-1205
CM12
Signal Path Designer
|
IC 4435
Abstract: 4435 power ic GL-16000 4435 ic assisted-gps assisted-gps gsm time frequency mobile gps chips GPS chip GPS BASEBAND PROCESSOR FBGA81
Text: GL-16000 GPS Baseband Processor RF chip GL-16000 Indoor GPSTM circuitry existing circuitry Device CPU optional aiding data Location Enabled Device ▲ Features • More than 16,000 hardware correlators enable PN code convolutions to be completed in real time
|
Original
|
PDF
|
GL-16000
GL-16000
-158dBm
TC-FS-20917-3/2002
IC 4435
4435 power ic
4435 ic
assisted-gps
assisted-gps gsm time frequency
mobile gps chips
GPS chip
GPS BASEBAND PROCESSOR
FBGA81
|
LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
|
Original
|
PDF
|
|
FPS200
Abstract: MB86S02A Veridicom MB86C00 gps cell wireless GL-16000 AUTOMATIC STREET LIGHT CONTROLLER using simple sensor for 12th class optical fingerprint sensor multi tune car reverse horn MBF200
Text: S p r i n g 2 0 0 2 Fujitsufocus The News on the Latest Semiconductor Technologies and Products from Fujitsu Microelectronics America, Inc. Rare Dual Wins at Engineering Competition Fujitsu Microelectronics won two awards in the prestigious 12th annual EDN
|
Original
|
PDF
|
MBF300
CORP-NL-20908-05/2002
FPS200
MB86S02A
Veridicom
MB86C00
gps cell wireless
GL-16000
AUTOMATIC STREET LIGHT CONTROLLER using simple sensor for 12th class
optical fingerprint sensor
multi tune car reverse horn
MBF200
|