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    FBGA PACKAGE THERMAL RESISTANCE Search Results

    FBGA PACKAGE THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    FBGA PACKAGE THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    FBGA 152

    Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
    Text: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		SII52010-4 EP2S15 EP2S30 EP2S60 FBGA 152 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484 PDF

    BT 1610

    Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		SII52010-4 EP2S15 EP2S30 EP2S60 BT 1610 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 PDF

    MS-034 1152 BGA

    Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 AGX52014-1
    Text: 14. Package Information for Arria GX Devices AGX52014-1.1 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


    Original     		AGX52014-1 EP1AGX35 EP1AGX50 EP1AGX20 EP1AGX90 FBGA35 152-pin MS-034 1152 BGA FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 PDF

    FBGA-484 datasheet

    Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
    Text: 14. Package Information for Arria GX Devices AGX52014-1.0 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


    Original     		AGX52014-1 EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX90 EP1AGX60 152-pin FBGA-484 datasheet 84 FBGA outline FBGA-484 asme y14.5m MS 034 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152 PDF

    3S110

    Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
    Text: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.


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    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80 PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


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    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22 PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


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    EQFP 144 PACKAGE

    Abstract: eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25
    Text: 15. Package Information for Cyclone III Devices CIII51015-1.1 Introduction This chapter provides package information for Altera Cyclone® III devices, and contains the following sections: • ■ “Thermal Resistance” on page 15–2 “Package Outlines” on page 15–2


    Original     		CIII51015-1 EP3C10 EP3C16 EQFP 144 PACKAGE eQFP wire bond E144 package EP3c55 E144 EP3C10 EP3C120 EP3C16 EP3C25 PDF

    pin information ep3c10

    Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
    Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55 PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance PDF

    MR0D08BMA35

    Abstract: 128Kbx8 MR0A08B FBGA thermal resistance
    Text: Thermal Resistance – 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Applicable Products: 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Temperature Grade Commercial Industrial Operating Temperature Products Part Numbers 256Kb Density 1 32Kbx8 Single VDD


    Original     		256Kb 32Kbx8) 128Kbx8) MR0D08BMA35 128Kbx8 MR0A08B FBGA thermal resistance PDF

    pin information ep3c10

    Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
    Text: Cyclone Series Device Thermal Resistance May 2008, version 3.0 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made May 2008 3.0 Updated Tables 2, 4, and 5. July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.


    Original     		EP3C25 EP3C10 pin information ep3c10 u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164 PDF

    FBGA-484 datasheet

    Abstract: arria MS-034 AGX52014-1
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		152-pin FBGA-484 datasheet arria MS-034 AGX52014-1 PDF

    BT 1610

    Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    FBGA-484 datasheet

    Abstract: MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		Packa35 152-pin FBGA-484 datasheet MS-034 1152 BGA 484-pin BGA JEDEC FBGA moisture sensitivity AGX52014-1 MS-034 EP1AGX90 PDF

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760 PDF

    EQFP 144 PACKAGE

    Abstract: eQFP E144 package altera cyclone 3 pins altera cyclone 3 E144 EP3C10 EP3C120 EP3C16 EP3C25
    Text: Section 4. Packaging Information This section includes the following chapter: • Revision History Altera Corporation Chapter 15, Package Information for Cyclone III Devices Refer to each chapter for its own specific revision history. For information on when each chapter was


    Original     		CIII51015-1 EQFP 144 PACKAGE eQFP E144 package altera cyclone 3 pins altera cyclone 3 E144 EP3C10 EP3C120 EP3C16 EP3C25 PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm PDF

    fbga Substrate design guidelines

    Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
    Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


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    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF