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    FBGA 12 X 12 HEAT SINK Search Results

    FBGA 12 X 12 HEAT SINK Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CYD18S18V18-167BBAXC Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    CYD18S18V18-167BBAXI Rochester Electronics LLC 1MX18 DUAL-PORT SRAM, 4ns, PBGA256, 17 X 17 MM, 1.70 MM HEIGHT, 1 MM PITCH, LEAD FREE, MO-192, FBGA-256 Visit Rochester Electronics LLC Buy
    N0436N-ZK-E1-AY Renesas Electronics Corporation Power MOSFETs with Support for High-efficiency Drive and Low Heat Design Visit Renesas Electronics Corporation
    N0605N-S19-AY Renesas Electronics Corporation Power MOSFETs with Support for High-efficiency Drive and Low Heat Design Visit Renesas Electronics Corporation
    ISL78444EVAL1Z Renesas Electronics Corporation 100V 3A Source, 4A Sink Half-Bridge Drivers Evaluation Board Visit Renesas Electronics Corporation

    FBGA 12 X 12 HEAT SINK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ms-029

    Abstract: FBGA1152
    Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    BGA and eQFP Package

    Abstract: BGA 256 PACKAGE thermal resistance fbga 12 x 12 thermal resistance
    Text: PRELIMINARY Delta39K Power Estimation and Thermal Management Summary This application note covers a brief explanation of the Delta39K™ Power Estimator spreadsheet, suggestions on reducing the overall power consumption of Delta39K designs, and use of forced airflow and heat-sinks to manage heat dissipation.


    Original     		PDF Delta39KTM Delta39K BGA and eQFP Package BGA 256 PACKAGE thermal resistance fbga 12 x 12 thermal resistance

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    FBGA 152

    Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
    Text: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 FBGA 152 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    BT 1610

    Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 BT 1610 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90

    BT 1610

    Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    MD300-10A

    Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
    Text: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP


    Original     		PDF S64F1-CA1 S108S1-YHC P116S1-YJC S144S1-YKC S176S1-2C S224S1-3C-1 S304S1-6C S256N7-B6 S352N7-F6-1 S420N7-F6 MD300-10A QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA

    fbga Substrate design guidelines

    Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
    Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    PC2-6400

    Abstract: SN13 240 pin DIMM DDR2 connector
    Text: Memory Module Specifications KVR800D2D4F5/2GI 2GB 256M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" “Intel certified” memory module. This module is based on thirty-six 128M x 4-bit 800MHz


    Original     		PDF KVR800D2D4F5/2GI 72-Bit PC2-6400 240-Pin 72-bit) PC2-6400 800MHz 240-pin SN13 240 pin DIMM DDR2 connector

    SN13

    Abstract: PC2-6400 DDR2 DIMM 240 pinout KVR800
    Text: Memory Module Specifications KVR800D2D4F5/4GI 4GB 512M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 4GB 512M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" “Intel certified” memory module. This module is based on thirty-six 256M x 4-bit 800MHz


    Original     		PDF KVR800D2D4F5/4GI 72-Bit PC2-6400 240-Pin 72-bit) PC2-6400 800MHz 240-pin SN13 DDR2 DIMM 240 pinout KVR800

    DDR2 DIMM 240 pinout

    Abstract: SN13 FBGA 12 x 12 heat sink ValueRAM PS8222
    Text: Memory Module Specifications KVR533D2D4F4/2GI 2GB 256M x 72-Bit PC2-4200 CL4 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" “Intel Certified” memory module. This module is based on thirty-six 128M x 4-bit 533MHz


    Original     		PDF KVR533D2D4F4/2GI 72-Bit PC2-4200 240-Pin 72-bit) PC2-4200 533MHz 240-pin DDR2 DIMM 240 pinout SN13 FBGA 12 x 12 heat sink ValueRAM PS8222

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


    Original     		PDF Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"

    PC2-6400

    Abstract: SN13 DDR2 pin out ddr2 pins detail 240 pin DIMM DDR2 connector JEDEC
    Text: Memory Module Specifications KVR800D2D4F5/4GEF 4GB 512M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 4GB 512M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 256M x 4-bit 800MHz DDR2 FBGA


    Original     		PDF KVR800D2D4F5/4GEF 72-Bit PC2-6400 240-Pin 72-bit) PC2-6400 800MHz 240-pin SN13 DDR2 pin out ddr2 pins detail 240 pin DIMM DDR2 connector JEDEC

    "DDR2 SDRAM"

    Abstract: DDR2 SDRAM ECC SN13 240 pin DIMM DDR2 connector
    Text: Memory Module Specifications KVR533D2D4F4/2G 2GB 256M x 72-Bit PC2-4200 CL4 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 128M x 4-bit 533MHz DDR2 FBGA


    Original     		PDF KVR533D2D4F4/2G 72-Bit PC2-4200 240-Pin 72-bit) PC2-4200 533MHz 240-pin "DDR2 SDRAM" DDR2 SDRAM ECC SN13 240 pin DIMM DDR2 connector

    240 pin DIMM DDR2 connector

    Abstract: KVR667D2D4F52G "DDR2 SDRAM" ddr2 DDR2 SDRAM DDR2 SDRAM ECC KVR667D2 PC2-5300 SN13 DDR2 pin out
    Text: Memory Module Specifications KVR667D2D4F5/2G 2GB 256M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-5300 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 128M x 4-bit 667MHz DDR2 FBGA


    Original     		PDF KVR667D2D4F5/2G 72-Bit PC2-5300 240-Pin 72-bit) PC2-5300 667MHz 240-pin 240 pin DIMM DDR2 connector KVR667D2D4F52G "DDR2 SDRAM" ddr2 DDR2 SDRAM DDR2 SDRAM ECC KVR667D2 SN13 DDR2 pin out

    ddr2 pins detail

    Abstract: 339B SN13
    Text: Memory Module Specifications KVR533D2D4F4K2/4G 4GB 2GB 256M x 72-Bit x 2 pcs. PC2-4200 CL4 ECC 240-Pin FBDIMM Kit Description: ValueRAM's KVR533D2D4F4K2/4GB is a kit of two (256M x 72-bit) PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory modules. Total kit capacity is 4GB (4096MB). Each module is based on


    Original     		PDF KVR533D2D4F4K2/4G 72-Bit PC2-4200 240-Pin KVR533D2D4F4K2/4GB 72-bit) 4096MB) 533MHz 240-pin ddr2 pins detail 339B SN13

    DDR2 DIMM 240 pinout

    Abstract: PC2-6400 SN13 KVR800
    Text: Memory Module Specifications KVR800D2D4F5/2G 2GB 256M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 128M x 4-bit 800MHz DDR2 FBGA


    Original     		PDF KVR800D2D4F5/2G 72-Bit PC2-6400 240-Pin 72-bit) PC2-6400 800MHz 240-pin DDR2 DIMM 240 pinout SN13 KVR800

    KVR800

    Abstract: PC2-6400 SN13 SCK 206
    Text: Memory Module Specifications KVR800D2D4F5/4G 4GB 512M x 72-Bit PC2-6400 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 4GB 512M x 72-bit PC2-6400 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory module. This module is based on thirty-six 256M x 4-bit 800MHz DDR2 FBGA


    Original     		PDF KVR800D2D4F5/4G 72-Bit PC2-6400 240-Pin 72-bit) PC2-6400 800MHz 240-pin KVR800 SN13 SCK 206

    DDR2 DIMM 240 pinout

    Abstract: PC2-5300 SN13 DDR2 207 ddr2 pins detail
    Text: Memory Module Specifications KVR667D2D4F5/2GI 2GB 256M x 72-Bit PC2-5300 CL5 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 2GB 256M x 72-bit PC2-5300 CL5 SDRAM (Synchronous DRAM) fully buffered ECC “dual rank” “Intel Certified” memory module. This module is based on thirty-six 128M x 4-bit 667MHz


    Original     		PDF KVR667D2D4F5/2GI 72-Bit PC2-5300 240-Pin 72-bit) PC2-5300 667MHz 240-pin DDR2 DIMM 240 pinout SN13 DDR2 207 ddr2 pins detail

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LSI CSP • CSP Chip Size Package •CSP The FBGA (commonly known as CSP) has an area array terminal structure with solder balls on the bottom, to give it a near chip-size footprint. This high-density, compact and low-profile package technology will greatly help in the design of compact mobile equipment, such as mobile phones and


    Original     		PDF

    4626

    Abstract: Kvr667D2D8F5K2 PC2-5300 SN13
    Text: Memory Module Specifications KVR667D2D8F5K2/2G 2GB 1GB 128M x 72-Bit x 2 pcs. PC2-5300 CL5 ECC 240-Pin FBDIMM Kit Description: ValueRAM's KVR667D2D8F5K2/2G is a kit of two 1GB (128M x 72-bit) PC2-5300 CL5 SDRAM (Synchronous DRAM) "fully buffered" ECC "dual rank" memory modules. Total kit capacity is 2GB (2048MB). Each module is


    Original     		PDF KVR667D2D8F5K2/2G 72-Bit PC2-5300 240-Pin KVR667D2D8F5K2/2G 72-bit) 2048MB) 667MHz 4626 Kvr667D2D8F5K2 SN13