J476
Abstract: 0E128 capacitor j476 8J1234 Decoupling Device for High Frequency
Text: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 hours at +105°C. Adapted to the RoHS directive 2002/95/EC . Type numbering system (Example : 2.5V 220µF)
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Original
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PDF
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2002/95/EC)
120Hz)
180mm
330mm
50MIN.
8100X-1
J476
0E128
capacitor j476
8J1234
Decoupling Device for High Frequency
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0e128
Abstract: No abstract text available
Text: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 hours at +105°C. Adapted to the RoHS directive 2002/95/EC . Type numbering system (Example : 2.5V 220µF)
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Original
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PDF
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2002/95/EC)
120Hz)
F110E227MDLAH1
F110E128MFKAH3
F110G107MDLAH1
F110J476MDLAH1
V-220
V-1200
8100X-1
0e128
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0E128
Abstract: F110E128MFK
Text: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 1000 hours at +105°C. Adapted to the RoHS directive 2002/95/EC . Specifications
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Original
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PDF
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2002/95/EC)
120Hz)
500hours
F110E227MDLAH1
F110E128MFKAH3
F110G107MDLAH1
F110J476MDLAH1
V-220
V-100
V-1200
0E128
F110E128MFK
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0E128
Abstract: 8J1234 0220 F110E128MFK F110E227MDL F110E607MFK F110G107MDL F110G807MFK
Text: DECOUPLING DEVICE FOR HIGH FREQUENCY F11 Higher Capacitance. Low ESR, Low ESL,High ripple current. Resin-molded Chip. Designed for surface mounting on high density PC board. Load life of 5000 hours at +105°C. Compliant to the RoHS directive 2002/95/EC .
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Original
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PDF
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2002/95/EC)
120Hz)
500hours
300kHz)
V-220
V-1200
8100Y
0E128
8J1234
0220
F110E128MFK
F110E227MDL
F110E607MFK
F110G107MDL
F110G807MFK
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