Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE Mounting Considerations for Exposed-Paddle Packages Introduction Many of Skyworks products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, which provides
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02743A
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land pattern for DFN
Abstract: "exposed pad" PCB via QFN PACKAGE Junction to PCB thermal resistance "thermal via" qfn44 QFN PACKAGE thermal resistance AN-121 QFN footprint DFN PACKAGE thermal resistance QFN44-24
Text: AN-121 Application Note Mounting Considerations for Exposed-Paddle Packages Introduction Many of AnalogicTech's products incorporate exposed paddles in their packages. The exposed paddle or exposed pad packages operationally decrease the thermal resistance, thereby providing superior heat dissipation from the die. The packages fall into two main categories: quad LLP leadless lead frame package QFN
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AN-121
AN-121
land pattern for DFN
"exposed pad" PCB via
QFN PACKAGE Junction to PCB thermal resistance
"thermal via"
qfn44
QFN PACKAGE thermal resistance
QFN footprint
DFN PACKAGE thermal resistance
QFN44-24
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5SC-TT-K-30-36
Abstract: TTK thermocouple AN26020
Text: Application Note AN26020 APPLICATIONS INFORMATION PROCEDURE FOR MEASURING PAD-TO-AMBIENT THERMAL RESISTANCE RθPA FOR EXPOSED PAD PACKAGES SCOPE For devices with an exposed die pad, the die-to-exposed pad thermal resistance (RθJP) is independent of the PWB on which the device is mounted. The value of pad-to-ambient thermal resistance (RθPA) can be
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AN26020
5SC-TT-K-30-36
TTK thermocouple
AN26020
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Package with Top Exposed Pad LQFP-TEP Q128.14x20A 4 D NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB 3 SYMBOL A B 3 D2 E 4 e E2 N/4 TIPS 0.20 C
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14x20A
MS-026,
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MS-026
Abstract: 3BHB
Text: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Package with Top Exposed Pad TEP-LQFP Q128.14x20B 4 D NOTE: EXPOSED PAD 128 Lead Thin Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB SYMBOL 3 NOM MAX NOTES A B 3 D2 E 4 e E2
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14x20B
MS-026,
MS-026
3BHB
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MS-026
Abstract: 3BHB
Text: Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Package with Top Exposed Pad TEP-LQFP Q128.14x20A 4 D NOTE: EXPOSED PAD 128 Lead Thin Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB SYMBOL 3 NOM MAX NOTES A B 3 D2 E 4 e E2
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14x20A
MS-026,
MS-026
3BHB
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Untitled
Abstract: No abstract text available
Text: Plastic Packages for Integrated Circuits Low Plastic Quad Flatpack Package with Top Exposed Pad LQFP-TEP Q128.14x20B 4 D NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2 D MILLIMETERS 3 BHB 3 SYMBOL A B 3 D2 E 4 e E2 N/4 TIPS 0.20 C
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MS-026,
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8 NARROW SO
Abstract: dd pack m lga 133 tssop 38 DATASHEET TSSOP-6 dd pack Q exposed die
Text: MOISTURE SENSITIVITY LEVEL FOR SURFACE MOUNT PACKAGE PACKAGE CATEGORY MSOP SO SOT-223 SOT TSOT SC70 TSSOP SSOP DFN QFN LGA DD PACK NOTES: DESCRIPTION SURFACE MOUNT PACKAGE 8 LEAD MSOP 8 LEAD MSOP EXPOSED DIE PAD 10 LEAD MSOP 10 LEAD MSOP EXPOSED DIE PAD
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OT-223
OT-23
OT-143
8 NARROW SO
dd pack m
lga 133
tssop 38 DATASHEET
TSSOP-6
dd pack Q
exposed die
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12-UNIT
Abstract: sot633
Text: PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-3 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2
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HTSSOP38:
OT633-3
12-UNIT
sot633
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sot633
Abstract: No abstract text available
Text: PDF: 2003 Apr 25 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-2 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2
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HTSSOP38:
OT633-2
MO-153
sot633
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MSE16
Abstract: No abstract text available
Text: MSE Package Variation: MSE16 12 16-Lead Plastic eMSOP with 4 Pins Removed Exposed Die Pad (Reference LTC DWG # 05-08-1871 Rev Ø) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ± 0.102 (.112 ± .004) 5.23 (.206) MIN 2.845 ± 0.102 (.112 ± .004) 0.889 ± 0.127
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MSE16
16-Lead
152mm
102mm
MSE16
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HTSSOP38
Abstract: No abstract text available
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT633-1 E D A X c y exposed die pad side HE v M A Dh Z 38 20 A2
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HTSSOP38:
OT633-1
MO-153
HTSSOP38
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HTSSOP32
Abstract: sot549
Text: PDF: 2004 Jan 22 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-3 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2
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HTSSOP32:
OT549-3
HTSSOP32
sot549
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Untitled
Abstract: No abstract text available
Text: MSE Package 10-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1664 Rev F BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 ± 0.102 (.074 ± .004) 5.23 (.206) MIN 0.889 ± 0.127 (.035 ± .005) 1 0.05 REF 10 0.305 ± 0.038 (.0120 ± .0015) TYP RECOMMENDED SOLDER PAD LAYOUT
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10-Lead
152mm
102mm
254mm
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"exposed pad" PCB via
Abstract: No abstract text available
Text: Application Note, Rev. 1.0, November 2008 Thermal Evaluation: Comparison of Standard and Exposed Pad DSO Package Example of SPOC Devices BTS5682E, BTS5672E, BTS5662E Automotive Division by U. Fröhler H. Hopfgartner M. Walder Thermal Evaluation: Standard vs. Exposed Pad DSO Package
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BTS5682E,
BTS5672E,
BTS5662E
"exposed pad" PCB via
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HTSSOP32
Abstract: SOT549
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-1 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2
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HTSSOP32:
OT549-1
HTSSOP32
SOT549
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HTSSOP32
Abstract: sot549
Text: PDF: 2003 Apr 25 Philips Semiconductors Package outline HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad SOT549-2 E D A X c y HE exposed die pad side v M A Dh Z 32 17 A2
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HTSSOP32:
OT549-2
HTSSOP32
sot549
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Untitled
Abstract: No abstract text available
Text: MS8E Package 8-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1662 Rev H BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 (.074) 1 1.88 ± 0.102 (.074 ± .004) 0.29 REF 1.68 (.066) 0.889 ± 0.127 (.035 ± .005) 0.05 REF 5.23 (.206) MIN DETAIL “B”
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152mm
102mm
254mm
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HTSSOP-20
Abstract: HTSSOP20
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 E D A X c y HE exposed die pad side v M A Dh Z 11 20 A 3 A2 Eh pin 1 index
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HTSSOP20:
OT527-1
HTSSOP-20
HTSSOP20
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Untitled
Abstract: No abstract text available
Text: MSE Package 12-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1666 Rev C BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ± 0.102 (.112 ± .004) 5.23 (.206) MIN 2.845 ± 0.102 (.112 ± .004) 0.889 ± 0.127 (.035 ± .005) 6 1 1.651 ± 0.102 3.20 – 3.45
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12-Lead
152mm
102mm
MSE12)
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MSE16
Abstract: No abstract text available
Text: MSE Package 16-Lead Plastic eMSOP, Exposed Die Pad Reference LTC DWG # 05-08-1667 Rev B BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 ± 0.102 (.112 ± .004) 5.23 (.206) MIN 2.845 ± 0.102 (.112 ± .004) 0.889 ± 0.127 (.035 ± .005) 8 1 1.651 ± 0.102 (.065 ± .004)
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16-Lead
MA007)
152mm
102mm
MSE16)
MSE16
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HTSSOP56
Abstract: HTSSOP-56 sot793
Text: PDF: 2003 Mar 14 Philips Semiconductors Package outline HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads; body width 6.1 mm; exposed die pad D SOT793-1 A E X c y exposed die pad v M A HE Dh Z 56 29 A 3 A A2 Eh θ A1 pin 1 index
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HTSSOP56:
OT793-1
143E36T
MO-153
HTSSOP56
HTSSOP-56
sot793
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HTSSOP-8
Abstract: sot770
Text: PDF: 2002 May 14 Philips Semiconductors Package outline HTSSOP8: plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad SOT770-1 E D A X c y HE exposed die pad v M A Dh1 Dh Z 5 8 A Eh Eh1 A2 A3 A1 pin 1 index
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OT770-1
HTSSOP-8
sot770
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Untitled
Abstract: No abstract text available
Text: T DP / B D T T D M VIEW NOTES: 1. DIMENSIONS ARE IN MM[INCHES]. 2. CONTROLLING DIMENSION: MM. 3. EXPOSED PAD: Cu WITH Sn/Pb PLATING. DIMENSION DOES NOT INCLUDE MOLD FLASH OF 0.254[0.010] MAX. /§\ DIE A /A UP ORIENTATION SHOWN. EXPOSED PAD IS VISIBLE FROM BOTTOM
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