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    5SC-TT-K-30-36

    Abstract: TTK thermocouple AN26020
    Text: Application Note AN26020 APPLICATIONS INFORMATION PROCEDURE FOR MEASURING PAD-TO-AMBIENT THERMAL RESISTANCE RθPA FOR EXPOSED PAD PACKAGES SCOPE For devices with an exposed die pad, the die-to-exposed pad thermal resistance (RθJP) is independent of the PWB on which the device is mounted. The value of pad-to-ambient thermal resistance (RθPA) can be


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    PDF AN26020 5SC-TT-K-30-36 TTK thermocouple AN26020