Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX106 PGA 1.27 mm grid socket, Surface mount SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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518-77-NNNMXX-XXX106
CuZn36Pb3
C36000)
C17200)
CH-2800
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Untitled
Abstract: No abstract text available
Text: High Power Chipled EOC20IRH 100 AG Preliminary Data Chip-LED Features - Circuit substrate-glass laminated epoxy - Directive characteristic 110° - Dimension: 3.2 L x 2.8 (W) x 1,6 (H) mm3 - Soldering pads: gold plated, all soldering methods applicable - Infrared GaAlAs (870nm)
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EOC20IRH
870nm)
EN60825)
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX104 BGA 1.27 mm grid, Interconnect pin surface mount SERIES 558 Interconnect pin, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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558-10-NNNMXX-XXX104
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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Untitled
Abstract: No abstract text available
Text: NEW Dialight Surface Mount LED Right Angle Type Package 597-2xx1-4xx SUBSTRATE GLASS FIBER LAMINATE CLEAR EPOXY LENS LED DIE ANODE LUMINOUS DIRECTION 3.0 [.118] .88 [.035] 2.0 [.079] 2X .30 [.012] 1.00 [.039] MECHANICAL SOLDERING REINFORCEMENT PAD COLOR
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597-2xx1-4xx
597-2111-4xx
597-2201-4xx
597-2311-4xx
597-2401-4xx
MIL-STD-202E,
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 558-10-NNNMXX-XXX101 PGA 1.27 mm grid, Interconnect pin solder tail SERIES 558 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, interconnect pin. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability
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558-10-NNNMXX-XXX101
CuZn36Pb3
C36000)
26x26
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX152 BGA 1.27 mm grid, Interconnect pin solder tail SERIES 550 Interconnect pin, through hole solder tail TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX152
CuZn36Pb3
C36000)
20x20
550-10-256M20-001152.
CH-2800
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Untitled
Abstract: No abstract text available
Text: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-180 Series Size 0805 Low Profile SMT LEDs DESCRIPTION AND FEATURES Features •Circuit substrate-glass laminated epoxy
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OLS-180
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Epoxy, glass laminate
Abstract: No abstract text available
Text: Multiadapter RE1070 - Glass reinforced epoxy laminate FR4 0.80 mm one-sided 35 µm CU<br><br>- 12 self-adhesive strips in pitch 0.50 mm<br>- scribed predetermined breaking point<br>- Surface area made from Au<br><br> - Size 90 x 100 mm
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RE1070
Epoxy, glass laminate
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Untitled
Abstract: No abstract text available
Text: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-130 Series Size 1206 Duplex SMT LEDs DESCRIPTION AND FEATURES Features •Circuit substrate-glass laminated epoxy
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OLS-130
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"Vibration Sensor"
Abstract: VIBRATION SENSOR Micro Sensor mvs-0608 VIBRATION SWITCH "Vibration switch" corrosion sensor VIBRATION SENSOR, vibrations sensor D-76133
Text: Data Sheet Micro Vibration Sensor MVS 0608.02 omnidirectional Version: V 2.0 The ball bridges two contacts reducing the resistance between the two external connection pads from several mega ohms (>30MOhm) to below 100 ohms. Material Package PCB laminate material (FR4, epoxy glass
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30MOhm)
300Hz,
500Hz;
500Hz,
D-76133
"Vibration Sensor"
VIBRATION SENSOR
Micro Sensor
mvs-0608
VIBRATION SWITCH
"Vibration switch"
corrosion sensor
VIBRATION SENSOR,
vibrations sensor
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 550-10-NNNMXX-XXX166 BGA 1.27 mm grid, BGA pin-adapter, SMD SERIES 550 Ball grid array adapters, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 New attribute UL 94V-O Pin Brass CuZn36Pb3 C36000 Mechanical life
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550-10-NNNMXX-XXX166
CuZn36Pb3
C36000)
20x20
514-83-256M20-001148.
CH-2800
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
CH-2800
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Preci-Dip
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 514-PP-NNNMXX-XXX148 BGA 1.27 mm grid socket, Surface mount SERIES 514 Ball grid array sockets, surface mount. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-0 Sleeve Brass CuZn36Pb3 C36000 Contact Beryllium copper (C17200)
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514-PP-NNNMXX-XXX148
CuZn36Pb3
C36000)
C17200)
20x20
CH-2800
Preci-Dip
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Untitled
Abstract: No abstract text available
Text: PGA / BGA / PLCC SOCKETS 518-77-NNNMXX-XXX105 PGA 1.27 mm grid socket, Solder tail SERIES 518 Micro pin grid array sockets µPGA , with contacts placed on 1.27 mm grid, solder tail. TECHNICAL SPECS.: Insulator Glass-epoxy laminate FR4 Flammability UL 94V-O
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518-77-NNNMXX-XXX105
CuZn36Pb3
C36000)
C17200)
CH-2800
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Untitled
Abstract: No abstract text available
Text: AG Luitpoldstr. 6 D-85276 Pfaffenhofen EOM32 - White Series Standard LED – white - Size 1206 - Features 3 Size 1206 - 3,2 L x 1,6(W) x 1,2(H) mm Directive characteristic 150° Circuit substrate-glass laminated epoxy Soldering pads: gold plated, all soldering methods applicable
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D-85276
EOM32
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fr4 94v0
Abstract: 12X12 nema 23 NEMA FR-4
Text: Vectorbord: 12X12WE Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12WE 12.0" W x 12.0 " L .No Holes.FR-4 Epoxy Glass .UNCLAD PCB SHEET MATERIAL Dimension 12" X 12" Square Sheets of FR-4 PCB laminate with NO COPPER
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12X12WE
P13949
com/Product/Vectorbord/12X12WE
fr4 94v0
12X12
nema 23
NEMA FR-4
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150HY
Abstract: No abstract text available
Text: 147 Central Avenue Hackensack, New Jersey 07601 Tel: 201-489-8989 • Fax: 201-489-6911 CHICAGO MINIATURE LAMP, INC. WHERE INNOVATION COMES TO LIGHT OLS-150 Series Size 1206 Standard SMT LEDs DESCRIPTION AND FEATURES 1.20 1.60 0.40 2.00 3.20 Features •Circuit substrate-glass laminated epoxy
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OLS-150
150HY
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Untitled
Abstract: No abstract text available
Text: Surface Mount LED Right Angle Type Package SUBSTRATE GLASS FIBER LAMINATE 597-2xx1-4xx PART NO.* 597-2002-4xx 597-2111-4xx 597-2201-4xx 597-2212-4xx 597-2222-4xx 597-2311-4xx 597-2401-4xx ANODE CLEAR EPOXY LENS MECHANICAL SOLDERING REINFORCEMENT PAD .88
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597-2xx1-4xx
597-2002-4xx
597-2111-4xx
597-2201-4xx
597-2212-4xx
597-2222-4xx
597-2311-4xx
597-2401-4xx
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cem-1 94v-0
Abstract: CEM-1 pcb
Text: Vectorbord: 12X12C1 Home Page 1 of 1 About Vector Distributors Sales Contact Us Vectorbord Part Number : 12X12C1 12.0" W x 12.0 " L .No Holes.CEM-1 Epoxy Glass COMPOSITE. .COPPER-CLAD 1 SID PCB Sheet Material Dimension 12" X 12" Square Sheets of CEM-1 PCB laminate
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12X12C1
com/Product/Vectorbord/12X12C1
cem-1 94v-0
CEM-1 pcb
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Untitled
Abstract: No abstract text available
Text: AT-BUS Prototyping Board Stock No. RE 429 EP - Epoxy fibre-glass reinforced laminated FR4 1.50 mm double-sided 35 |jm CU - Plated through-holes HP = FR2 - Phenolharzhartpapier / SRBP-Paper / Résine phénolplaste / papel duro a base de résina fenölica EP = FR4 - Epoxydglashartgewebe / epoxy fibre-glas / fibre de verre époxyde / epöxido
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Untitled
Abstract: No abstract text available
Text: Epoxy glass cloth base laminated FR4 5.10 RATING ,5 .9 0 ^ °10 DATE CODE EPOXY SEAL « mm CO a d a d co MM MM TT TT 0.76+.o.oo 0.76+gi1 - 0.00 5.08 10.16 14.35 P.C. MOUNTING 6 .0 5 _ ▲ ID csi SWITCH FUNCTION + 3 POS. 1 T2 Model No. 1 01.09 & POS. 2 4
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20mOhm
UL94V-0)
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433.92 Mhz oscillator 12v
Abstract: mipot 433.92 43402 tip1220
Text: 433.92 MHZ - AM TRANSMUTER 12V VERSION Description: Highlights: Applications: p. n. 3-2000267 AM Transmitter Module, manufactured in SMT technology on glass-epoxy laminate developed for fixed systems applications. Stand-by supply current lower than 0.1 joA.
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prETS300
12Vdc
433.92 Mhz oscillator 12v
mipot 433.92
43402
tip1220
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CAT 7114
Abstract: SE12XC09
Text: TERMINAL & COMPONENT BOARDS COMPONENT CARRIERS Designed for mounting discrete components such as resistors, capacitors, diodes and other electronic components. Carriers plug directly into panel boards or sockets. FEATURES •VARIETY • FLAME RETARDANT EPOXY GLASS BASE
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MS27249-1E1
MS27249-1E2
MS27249-1E3
MS27249-1E4
MS27249-1E5
MS27249-2E1
MS27249-2E2
MS27249-2E3
MS27249-2E4
MS27249-2E5
CAT 7114
SE12XC09
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Untitled
Abstract: No abstract text available
Text: FEATURES • Circuit substrate-glass laminated epoxy • Size 1206:3.2 L x 1.6 (W) x 1.2(H) mm • Soldering pads: gold plated, all soldering methods applicable • HY, HD (AllnGaP) high luminous intensity types • Taped in 8 mm-blister tape, cathode marking to
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OLS-156R
OLS-156SD
OLS-156SR
OLS-156UH
OLS-156G
OLS-156Y
OLS-156D
OLS-156HY
OLS-156HD
OLS-156HR
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