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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: High Power Chipled EOC20IRH 100 AG Preliminary Data Chip-LED Features - Circuit substrate-glass laminated epoxy - Directive characteristic 110° - Dimension: 3.2 L x 2.8 (W) x 1,6 (H) mm3 - Soldering pads: gold plated, all soldering methods applicable - Infrared GaAlAs (870nm)	Original	PDF	EOC20IRH 870nm) EN60825)

Catalog Datasheet

MFG & Type

PDF

Document Tags

Untitled

Abstract: No abstract text available
Text: High Power Chipled EOC20IRH 100 AG Preliminary Data Chip-LED Features - Circuit substrate-glass laminated epoxy - Directive characteristic 110° - Dimension: 3.2 L x 2.8 (W) x 1,6 (H) mm3 - Soldering pads: gold plated, all soldering methods applicable - Infrared GaAlAs (870nm)

Original

PDF

EOC20IRH 870nm) EN60825)