BGA PACKAGE thermal profile
Abstract: BGA 256 PACKAGE thermal resistance 484-pin BGA The Diode Data Book with Package Outlines CII51015-2 EP2C20 EP2C35 EP2C50 F256 MS 034 aaj
Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. The chapters in this section contain the required PCB layout guidelines and package specifications.
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BGA PACKAGE thermal profile
Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
Text: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.
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EP2C15
BGA PACKAGE thermal profile
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TQFP 144 PACKAGE DIMENSION
EP2C20
EP2C35
EP2C50
F256
EP2C5256
CII51015
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ep2c50f484
Abstract: EP2C20F256 EP2C8F256 EP2C35F672 EP2C8F256 package TSMC 90nm sram EP2C5 pin table EP2C5F256 EP2C20F484 Cyclone II EP2C35
Text: 1. Introduction CII51001-3.1 Introduction Following the immensely successful first-generation Cyclone device family, Altera® Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 logic elements LEs and provide up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are
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EP2C35F672
EP2C8F256 package
TSMC 90nm sram
EP2C5 pin table
EP2C5F256
EP2C20F484
Cyclone II EP2C35
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PCN0712
Abstract: GE100LFCS SUMITOMO EME G770 Hitachi CEL-9750ZHF10AKL nitto GE CEL-9750ZHF10AKL sumitomo g770 EME-G770 Nitto GE100LFCS Nitto GE 100
Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0712 MOLD COMPOUND CHANGES FOR BGA, UBGA, MBGA AND FBGA PACKAGES Change Description: Altera is implementing mold compound material changes to the wire bonded Plastic Ball-Grid Array BGA , Ultra FineLine Ball-Grid Array (UBGA), Micro FineLine Ball-Grid Array
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PCN0712
CEL-9750ZHF10AKL
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GE-100LFCS
PCN0712
GE100LFCS
SUMITOMO EME G770
Hitachi CEL-9750ZHF10AKL
nitto GE
sumitomo g770
EME-G770
Nitto GE100LFCS
Nitto GE 100
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EP2C35F672
Abstract: EP2C20F256 EP2C8F256 EP2C5 ep2c50f484 F256 CII51001-3 EP2C15A EP2C20 EP2C35
Text: 1. Introduction CII51001-3.2 Introduction Following the immensely successful first-generation Cyclone device family, Altera® Cyclone II FPGAs extend the low-cost FPGA density range to 68,416 logic elements LEs and provide up to 622 usable I/O pins and up to 1.1 Mbits of embedded memory. Cyclone II FPGAs are
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ep2c50f484
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EP2C35
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EP2C5F256
Abstract: CII51001-3 EP2C15A EP2C20 EP2C35 EP2C50 EP2C8F256 EP2C70F672 TSMC 90nm sram
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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Firefly
Abstract: No abstract text available
Text: Configurable Processor Modules Product DATA SHEET Features • • • • • • • • Complete Nios II processor system on a module Altera Cyclone II FPGA Up to 95 user I/O available Functionally compatible with Firefly I modules Hardware DSP support
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CII51001-1
Abstract: CII51002-1 EP2C20 EP2C35 EP2C50 SSTL-18
Text: Section I. Cyclone II Device Family Data Sheet This section provides provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package
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CII51002-1
Abstract: EP2C20 EP2C35 EP2C50 SSTL-18
Text: Chapter 2. Cyclone II Architecture CII51002-1.0 Functional Description Cyclone II devices contain a two-dimensional row- and column-based architecture to implement custom logic. Column and row interconnects of varying speeds provide signal interconnects between logic array blocks
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pin information ep3c10
Abstract: EP3C40F484 EP3c55 EP3C16F484 EP3C16 EP3C40Q240 EP3C40 U256 100 PIN PQFP ALTERA DIMENSION PIN INFORMATION FOR EP3C55
Text: Cyclone Series Device Thermal Resistance July 2007, version 2.2 Revision History Data Sheet The following table shows the revision history for this data sheet. Date Document Version Changes Made July 2007 2.2 Updated values for EP3C25 E144 device in Table 2.
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EP3c55
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EP3C16
EP3C40Q240
EP3C40
U256
100 PIN PQFP ALTERA DIMENSION
PIN INFORMATION FOR EP3C55
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bga 896
Abstract: TSMC 90nm sram EP2C50F484 APU 2471
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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EP2C35F672
Abstract: 26075 EP2C20F256 TMS 3617 PQFP16 ic 4017 pin configuration 2864 rom 3844 b so 8 EP2C5 EP2C15A
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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EP2C8F256 package
Abstract: S-2501-1 EP2C20F256 bga 896 TSMC 90nm sram
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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EP2C35F672
Abstract: EP2C20F256 Sw 2604 tms 3617 4017 pins configuration 753 53 2525 401 CMOS 4017 series cyclone II FIR filter matlaB simulink design matlab programs for impulse noise removal
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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SW 2596
Abstract: EP2C35F672 HP 3070 series 3 Manual circuit integers p 2503 n EP2C20 484-pin package APU 2471 cyclone II EP2C20F256 K 3053 TRANSISTOR SSTL-18
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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Untitled
Abstract: No abstract text available
Text: Section I. Cyclone II Device Family Data Sheet This section provides information for board layout designers to successfully layout their boards for Cyclone II devices. It contains the required PCB layout guidelines, device pin tables, and package specifications.
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transistor D 2395
Abstract: bt 1690
Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.2 Copyright 2005 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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Untitled
Abstract: No abstract text available
Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.1 Copyright 2005 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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TMS 3617
Abstract: bga 896 TSMC 90nm sram
Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-2.3 Copyright 2006 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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TSMC 90nm flash
Abstract: ep2c2
Text: Cyclone II Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-3.1 Copyright 2007 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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EP2C5Q208C8
Abstract: EP2C5Q208 EP2C35F672 EP2C5T144C6
Text: Cyclone II Device Handbook, Volume 1 Preliminary Information 101 Innovation Drive San Jose, CA 95134 408 544-7000 http://www.altera.com CII5V1-1.2 Copyright 2005 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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EP2C35F672C6
EP2C35F672C7
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EP2C35*
EP2C5Q208C8
EP2C5Q208
EP2C35F672
EP2C5T144C6
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pin configuration of 7496 IC
Abstract: TMS 3617 Transistor TT 2246 ttl to mini-lvds EP2C35F672 IC 4033 pin configuration EP2C20F256 CI 4017 combinational digital lock circuit projects EP2C8F256
Text: Cyclone II Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com CII5V1-3.2 Copyright 2007 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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pin configuration of 7496 IC
Abstract: tms 3617 Transistor TT 2246 4174 logic hex D type flip-flop tt 2246 data sheet ic 4017 Ic D 1708 ag BLOCK DIAGRAM DESCRIPTION of IC 4017 WITH 16 PINS EP2C20F256 EP2C35F672
Text: Cyclone II Device Handbook, Volume 1 101 Innovation Drive San Jose, CA 95134 www.altera.com CII5V1-3.3 Copyright 2008 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
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bd248
Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)
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