electrofilms back contact
Abstract: bcr resistor
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
03-Aug-04
electrofilms back contact
bcr resistor
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
29-Mar-04
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Untitled
Abstract: No abstract text available
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Only one wire bond required Product may not be to scale • Small size: 0.020 inches square. • Resistance range: 10Ω to 1MΩ The Back Contact Resistor BCR series single-value
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MIL-STD-883.
08-Apr-05
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WBCR-008
Abstract: bcr efi electrofilms back contact
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES Product may not be to scale The Back Contact Resistor BCR series single-value backcontact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space.
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MIL-STD-883.
07-Aug-01
WBCR-008
bcr efi
electrofilms back contact
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Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor With Part Mark FEATURES Product may not be to scale • Only one wire bond required • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip requires
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MIL-STD-883.
07-Aug-01
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Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
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MIL-STD-883.
03-Aug-04
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Untitled
Abstract: No abstract text available
Text: BCP Vishay Electro-Films CHIP RESISTORS Thin Film Back-Contact Resistor with Part Mark FEATURES • Only one wire bond required Product may not be to scale • Part marked - 5 digits maximum • Smallest size: 0.022 inches square The BCP series single-value back-contact resistor chip
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MIL-STD-883.
23-Mar-04
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Untitled
Abstract: No abstract text available
Text: SFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 20 inches square Product may not be to scale • Resistance range: 10Ω to 510kΩ The SFN series resistor chips offer a combination of nichrome stability, good power rating and small size.
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MIL-STD-883.
125mW
07-Aug-01
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Untitled
Abstract: No abstract text available
Text: QFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 0.020 inches square Product may not be to scale The QFN series nichrome on quartz resistor chips offer a combination of nichrome stability, excellent frequency
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MIL-STD-883.
19-Mar-04
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Untitled
Abstract: No abstract text available
Text: V i sh ay I n t e rt e ch n o l o g y, I n c . I INNOVAT AND TEC O L OGY BCR N HN Thin Film Resistor O 19 62-2012 Resistors - Space Saving, Back Contact Thin Film, Back Contact Resistor Key Benefits • • • • • Requires only one wire bond, thus saving space
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08-Aug-11
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Untitled
Abstract: No abstract text available
Text: BCM Vishay Electro-Films CHIP RESISTORS Miniature Back-Contact Resistor Chip FEATURES • Only one wire bound required Product may not be to scale • Small size: 0.015 inches square • Single top contact The BCM series are the smallest single value chips available
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03-Aug-04
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material for chip resistors
Abstract: electrofilms
Text: SFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 20 inches square Product may not be to scale • Resistance range: 10Ω to 510kΩ The SFN series resistor chips offer a combination of nichrome stability, good power rating and small size.
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MIL-STD-883.
125mW
07-Aug-01
material for chip resistors
electrofilms
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Untitled
Abstract: No abstract text available
Text: SC3 Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Small single chip size: 0.050 inches square Product may not be to scale The SC3 series resistor chips on silicon offer a combination of nichrome stability, wide resistance range and higher power
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MIL-STD-883.
400mW
07-Aug-01
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Untitled
Abstract: No abstract text available
Text: QFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 0.020 inches square Product may not be to scale • Resistance range: 10Ω to 510kΩ The QFN series nichrome on quartz resistor chips offer a combination of nichrome stability, excellent frequency
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MIL-STD-883.
03-Aug-04
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Untitled
Abstract: No abstract text available
Text: SFX Vishay Electro-Films CHIP RESISTORS Thin Film, Top-Contact Megohm Resistor FEATURES Product may not be to scale • Megohm resistance range: 1M to 20MΩ • Chip size: 0.040 inches square The SFX series resistor chips extends the range of available resistance to 20 Meg. These offer one of the best combinations
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MIL-STD-883.
07-Aug-01
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Untitled
Abstract: No abstract text available
Text: BCM Vishay Electro-Films CHIP RESISTORS Miniature Back-Contact Resistor Chip FEATURES • Only one wire bound required Product may not be to scale • Small size: 0.015 inches square • Single top contact The BCM series are the smallest single value chips available
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08-Apr-05
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Vishay Power resistor
Abstract: bcr efi one wire bcr resistor
Text: Thin Film, Back-Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chip can be attached either eutectically or with conductive epoxy • Smaller footprint than alternative configurations
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MIL-STD-883.
29-Mar-04
Vishay Power resistor
bcr efi
one wire
bcr resistor
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one wire
Abstract: No abstract text available
Text: PRODUCT SHEET V I S H A Y I N T E R T E C H N O L O G Y, I N C . RESISTORS Model BCR Thin Film, Back Contact Resistor FEATURES • Requires only one wire bond, thus saving space • Second electrical connection is made through the back of the chip • Chips can be attached either eutectically or with conductive epoxy
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250mW
07-Aug-01
VMN-PT9012-0209
one wire
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MATRIX TRAYS
Abstract: No abstract text available
Text: BCM Vishay Electro-Films CHIP RESISTORS Miniature Back-Contact Resistor Chip FEATURES Product may not be to scale • Only one wire bound required • Small size: 0.015 inches square • Single top contact The BCM series are the smallest single value chips available
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07-Aug-01
MATRIX TRAYS
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Untitled
Abstract: No abstract text available
Text: BCM Vishay Electro-Films CHIP RESISTORS Miniature Back-Contact Resistor Chip FEATURES • Only one wire bound required Product may not be to scale • Small size: 0.015 inches square • Single top contact The BCM series are the smallest single value chips available
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15-Jan-04
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Untitled
Abstract: No abstract text available
Text: QFN Vishay Electro-Films CHIP RESISTORS NiCr Thin Film, Top-Contact Resistor FEATURES • Chip size: 0.020 inches square Product may not be to scale • Resistance range: 10Ω to 510kΩ The QFN series nichrome on quartz resistor chips offer a combination
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MIL-STD-883.
07-Aug-01
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WBCR02750000F
Abstract: BCR50000FKAHWS
Text: BCR Vishay Electro-Films CHIP RESISTORS Thin Film, Back-Contact Resistor FEATURES • Wire bondable Product may not be to scale • Only one wire bond required • Small size: 0.020 inches square • Resistance range: 10 Ω to 1 MΩ • Oxidized silicon substrate for good power dissipation
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18-Jul-08
WBCR02750000F
BCR50000FKAHWS
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tantalum nitride
Abstract: bcr electrofilms back contact resistor
Text: ELECTRO-FILMS INC/ SEMI- 3ME 3101535 QQGQ174 b THIN-FILM BACK-CONTACT RESISTOR tFEA T U R ES t ì o The BCR series, single value, back contact resistor chips require only one wire bond, save hybrid space, and shorten hybrid assem bly time. They are manufactured in the sm allest chip size available.
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MIL-STD-883.
tantalum nitride
bcr electrofilms
back contact resistor
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Untitled
Abstract: No abstract text available
Text: bcp semes T H IN -F IL M I The BCP series, single value, back contact resistor chips require only one wire bond save hybrid space and shorten hybrid assembly time. They are manufactured in the smallest chip size available. These chips are manufactured using state-of-the-art thin-film techniques, are 100%
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MIL-STD-883.
MIL-STD-883
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