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Catalog Datasheet	MFG & Type	PDF	Document Tags
dycostrate Abstract: CH-2074 without underfill Text: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP	Original	PDF	CH-2074 D-13355 dycostrate without underfill

Catalog Datasheet

MFG & Type

PDF

Document Tags

dycostrate

Abstract: CH-2074 without underfill
Text: Wafer Level CSP with Solder Support Structure Jörg Jasper EM-Marin S.A., Rue des Sors 3, CH-2074 Marin, Switzerland Jürgen Simon Technical University of Berlin, Gustav-Meyer-Allee 25, D-13355 Berlin, Germany Abstract Chip scale package CSP and flip chip interconnects proliferate in telecommunication and other portable products. Wafer level CSP

Original

PDF

CH-2074 D-13355 dycostrate without underfill