HALF BRIDGE MOTOR MODULE
Abstract: bi-directional switches IGBT DIM400PHM17-A000
Text: DIM400PHM17-A000 DIM400PHM17-A000 Half Bridge IGBT Module DS5561-1.1 September 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES typ
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DIM400PHM17-A000
DS5561-1
DIM400PHM17-A000
HALF BRIDGE MOTOR MODULE
bi-directional switches IGBT
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DIM400PHM17-A000
Abstract: DIM400PHM17-A
Text: DIM400PHM17-A000 IGBT Half Bridge Module Replaces DS5561-1.3 DS5561.2 January 2014 LN31262 FEATURES KEY PARAMETERS • VDRM VT* IC IC(PK) 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated AlSiC Base with AlN Substrates
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DIM400PHM17-A000
DS5561-1
DS5561
LN31262)
DIM400PHM17-A000
DIM400PHM17-A
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Digital Alarm System Clock in Holdover Mode
Abstract: GR-253-CORE simple block diagram for digital alarm clock with GR-1244-CORE MHM90401 MT90401 Digital Alarm Clock 40 pin Digital Alarm Clock by ttl
Text: MHM90401 Timing Module Preliminary Information DS5561 Features • • • • • • Meets requirements of Telcordia GR-253-CORE for SONET internal clocks Meets requirements of Telcordia GR-1244CORE for Stratum 3 clocks 8KHz input reference frequency, 19.44MHz
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MHM90401
DS5561
GR-253-CORE
GR-1244CORE
44MHz
MHM90401
Digital Alarm System Clock in Holdover Mode
GR-253-CORE
simple block diagram for digital alarm clock with
GR-1244-CORE
MT90401
Digital Alarm Clock 40 pin
Digital Alarm Clock by ttl
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igbt 600v 400A single half bridge
Abstract: DIM400PHM17-A000
Text: DIM400PHM17-A000 DIM400PHM17-A000 Half Bridge IGBT Module DS5561-1.1 September 2002 FEATURES • 10µs Short Circuit Withstand ■ High Thermal Cycling Capability ■ Non Punch Through Silicon ■ Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES typ
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Original
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PDF
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DIM400PHM17-A000
DS5561-1
DIM400PHM17-A000
igbt 600v 400A single half bridge
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bi-directional switches IGBT
Abstract: DIM400PHM17-A000
Text: . DIM400PHM17-A000 Half Bridge IGBT Module DS5561-1.3 May 2008 LN26122 FEATURES 10µs Short Circuit Withstand High Thermal Cycling Capability Non Punch Through Silicon Isolated MMC Base with AlN Substrates KEY PARAMETERS VCES VCE (sat) * (typ) IC (max) IC(PK)
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DIM400PHM17-A000
DS5561-1
LN26122)
DIM400PHM17-A000
bi-directional switches IGBT
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half bridge circuit diagram
Abstract: No abstract text available
Text: . DIM400PHM17-A000 Half Bridge IGBT Module DS5561-1.2 JULY 2005 LN24089 FEATURES • 10µs Short Circuit Withstand • High Thermal Cycling Capability • Non Punch Through Silicon • Isolated MMC Base with AlN Substrates • 6kV Isolation Voltage • Lead Free Construction
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DIM400PHM17-A000
DS5561-1
LN24089)
DIM400PHM17-A000
1700Vbility
half bridge circuit diagram
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