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    DPV32X16A Search Results

    DPV32X16A Datasheets (29)

    Part ECAD Model Manufacturer Description Curated Type PDF
    DPV32X16A-12B Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-12C Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-12I Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-12M Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-15B Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-15C Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-15I Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-15M Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-17B Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-17C Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-17I Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-17M Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-20B Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-20C Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-20I Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-20M Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-25B Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-25C Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-25I Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF
    DPV32X16A-25M Dense-Pac Microsystems 32K x 16 UV EPROM PGA Module Scan PDF

    DPV32X16A Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: □PM Dense-Pac Microsystems. Inc. <T DPV32X16A 32K X 16 UVEPROM PGA MODULE O PRELIM IN ARY DESCRIPTION: The DPV32X16A is a 40-pin Pin G rid Array PGA consisting o f tw o 32K X 8 UVEPROM devices in ceram ic LCC packages surface m ounted on a co-fired ceram ic substrate w ith m atched thermal coefficients.


    OCR Scan     		PDF DPV32X16A DPV32X16A 40-pin 200ns 250ns

    0-32k

    Abstract: CERAMIC PIN GRID ARRAY 120 pins 6A14
    Text: £ n jS ¡^ DPV32X16A Dense-Pac Microsystems, Inc. 0 _ 32K X 16 UVEPROM PGA MODULE PRELIMINARY DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired


    OCR Scan     		PDF dpv32XI6A DPV32X16A 40pin 250ns l/OO-1/015 30a04902 0-32k CERAMIC PIN GRID ARRAY 120 pins 6A14

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 0.5 Megabit UVEPROM MICROSYSTEMS DPV32X16A DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of tw o 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate w ith matched thermal coefficients.


    OCR Scan     		PDF DPV32X16A DPV32X16A 40-pin 250ns 120ns 150ns 200ns 64KX8 32KX16 00G138S

    MEAB

    Abstract: No abstract text available
    Text: DENSE-PAC 0,5 Megabit UVEPROM DPV32X16A M I C R O S Y S T E M S DESCRIPTION: The D PV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 U VEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF DPV32X16A DPV32X16A 40-pin 250ns 120ns 150ns 170ns 200ns MEAB

    Untitled

    Abstract: No abstract text available
    Text: _ ' / f ' _ DENSE-PAC 0.5 Megabit UVEPROM D P V3 2 X 16A MICROSYSTEMS DESCRIPTION: The DPV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired


    OCR Scan     		PDF DPV32X16A 40-pin 250ns 120ns 150ns 170ns 200ns 250ns 64KXB 32KX16

    Untitled

    Abstract: No abstract text available
    Text: □PM D P V 3 2 X 1 6 A Dense-Pac Microsystems. Inc. 32K X 16 UVEPROM PGA MODULE O PRELIMINARY DESCRIPTION: The D PV32X16A is a 40-pin Pin Grid Array PGA consisting of two 32K X 8 U VEPRO M devices in ceramic LC C packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.


    OCR Scan     		PDF PV32X16A 40-pin 32KX16

    DP5Z

    Abstract: No abstract text available
    Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


    OCR Scan     		PDF 128Kx8, 64Kx16, 256Kx8, 384Kx8, DP5Z

    48-PIN

    Abstract: No abstract text available
    Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead


    OCR Scan     		PDF PS128M PS3232V DPS128X16CJ3/BJ3 PS128X16CH DPS128X16Y3 PS128X16H PS128X24BH PS512S8BN PS512S8N 48-PIN