Untitled
Abstract: No abstract text available
Text: □PM DPS512X16A3 . Dense-Pac Microsystems Inc. O CERAMIC 512K X 16 CMOS SRAM MODULE PRELIMINARY DESCRIPTION: The DPS512X16A3 "DENSE-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless
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DPS512X16A3
DPS512X16A3
1024K
A0-A16
30A045-10
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Untitled
Abstract: No abstract text available
Text: □PM DPS512X16A3 Dense-Pac Microsystems, Inc. CERAMIC 512KX 16 CMOS SRAM MODULE O PRELIMINARY D ESC R IP TIO N : The D PS512X16A3 "D EN SE-STA CK" module is a re v o lu tio n a ry n e w m e m o ry su b sy ste m using Dense-Pac Microsystems' ceramic Stackable Leadless
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DPS512X16A3
512KX
PS512X16A3
DPS512X16A3
30A045-10
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Untitled
Abstract: No abstract text available
Text: □PM DPS512X16A3 O PRELIMINARY Dense-Pac Microsystems, Inc. CERAMIC 512K X 16 CM O S SRAM MODULE DESCRIPTION: The DPS512X16A3 "DENSE-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless
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DPS512X16A3
DPS512X16A3
1024K
30A04S-10
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Untitled
Abstract: No abstract text available
Text: □PM DPS512X16A3 Dense-Pac Microsystems, Inc. CERAMIC 512KX 16 CMOS SRAM MODULE O PRELIMINARY DESCRIPTION: The DPS512X16A3 "DENSE-STACK" m od ule is a r e v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless
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DPS512X16A3
512KX
DPS512X16A3
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50-PIN
Abstract: DPS512X16A3
Text: DENSE-PAC MICROSYSTEMS 8 Megabits CM OS SRAM DPS512Xl6n3 D ESCRIPTIO N ; The DPS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded
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DPS512Xl6n3
DPS512X16n3
50-pin
512Kx16
-40-C
125-C
100ns
120ns
DPS512X16A3
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Untitled
Abstract: No abstract text available
Text: «ffí 1 £ 1993 □PM D P S 5 1 2 X 1 6 n 3 Dense-Pac Microsystems, Inc. Ceramic, S12Kx16 SRAM Stack Modules O D E S C R IP T IO N : The D PS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight
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S12Kx16
PS512X16n3
50-pin
100ns
120ns
150ns
125-C
30A097-08
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