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    DPS2ME16MKN3 Search Results

    DPS2ME16MKN3 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    DPS2ME16MKN3 DPAC Technologies 2mx16 High Speed CMOS SRAM Original PDF

    DPS2ME16MKN3 Datasheets Context Search

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    30A12

    Abstract: No abstract text available
    Text: 2Mx16, 20 - 45ns, STACK 30A129-28 B 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    Original     		PDF 2Mx16, 30A129-28 DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A12

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 MICROSYSTEMS D ESCRIPTIO N : The DPS2ME16MKn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded


    OCR Scan     		PDF DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV

    1431 T

    Abstract: No abstract text available
    Text: DENSE-PAC 32 Megabit High Speed CMOS SRAM DPS2ME16MKn3 MICROSYSTEMS DESCRIPTION: The DPS2ME16MKn3 High Speed SRAM "STACK” modules are a re vo lu tio n a ry new m em ory su b syste m using D ense-P ac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .


    OCR Scan     		PDF DPS2ME16MKn3 DPS2ME16MKn3 32-Megabits 500mV 30A129-28 1431 T