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    KA3213

    Abstract: KA32 KS5112 30A10 3A29
    Text: DENSE-PAC 32 Megabit CMOS DRAM DPD2MX16M2H3 M I C R O S Y S T E M S PRELIMINARY DESCRIPTION: The DPD2MX16M2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC stacked and leaded for


    OCR Scan     		PDF DPD2MX16M2H3 DPD2MX16M2 32-Megabits DPD2MX16M2H3 100ns 40-PIN 30A106-1S 275T415 0QQ137Ã KA3213 KA32 KS5112 30A10 3A29

    cb-rj

    Abstract: No abstract text available
    Text: DENSE-PAC ^ _ Me abit CMOSdram 32 8 MICROSYSTEMS DPD2MX16M2H3 PRELIMINARY DESCRIPTION: TheDPD2M X16M 2H3 "STA C K" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ stacked and leaded for


    OCR Scan     		PDF DPD2MX16M2H3 32-Megabits DPD2MX16M2H3 30A108-18 100ns 3QA10B-18 cb-rj