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    DOW CORNING TAIWAN Search Results

    DOW CORNING TAIWAN Result Highlights (4)

    Part ECAD Model Manufacturer Description Download Buy
    10474S7DF Renesas Electronics Corporation 1K X 4 ECL I/O SRAM, CORN Visit Renesas Electronics Corporation
    10474S8DF Renesas Electronics Corporation 1K X 4 ECL I/O SRAM, CORN Visit Renesas Electronics Corporation
    10474S4-5DF Renesas Electronics Corporation 1K X 4 ECL I/O SRAM, CORN Visit Renesas Electronics Corporation
    10474S4DF Renesas Electronics Corporation 1K X 4 ECL I/O SRAM, CORN Visit Renesas Electronics Corporation

    DOW CORNING TAIWAN Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    dow corning 732

    Abstract: Dow Corning DC 11 Dow Corning DC 896 MIL-A-46106A MIL-A-46106 Dow Corning DC 1200 Dow Corning Taiwan 0097B 10-1096E-01 PRIMER
    Text: Product Information DOW CORNING 732 Multi-Purpose Sealant FEATURES Multi-purpose silicone adhesive/sealant • One-component adhesive/sealant • Cures at room temperature when exposed to moisture in the air • Acetoxy cure system • Non-sag, paste consistency


    Original     		PDF MIL-A-46106A 0097B D1475 D2240 APPLICAT87 01-1125C-01 dow corning 732 Dow Corning DC 11 Dow Corning DC 896 MIL-A-46106A MIL-A-46106 Dow Corning DC 1200 Dow Corning Taiwan 10-1096E-01 PRIMER

    SC102

    Abstract: intel 2114 4405 delta young DHS-C8979-03 2114 Delta Electronics
    Text: DHS-C8979-03 Specification: • Material: Copper 1100 · Weight: 500 g ref. · Type: Soldering · Dimension: 88.9*79*25.5 (mm) · Heat Source size: 31*31 (mm) · Thermal Interface Material: Dow Corning SC102 · Test Condition: Fully Confined · Application: Intel Socket 603/604 Nocona CPU


    Original     		PDF DHS-C8979-03 SC102 283A0404 SC102 intel 2114 4405 delta young DHS-C8979-03 2114 Delta Electronics

    molex 2759T 08-50

    Abstract: WIESON 2510c888-001 wire 1007 AWG24 Socket 754 C1100 AMD athlon socket 754 Dow Corning 340 heat sink socket 478 Dow Corning AMD Athlon 5000 k8
    Text: FHS-A7015A40/FHS-A7015B40 Application: • Intel Socket 478 Prescott FMB1.5 Thermal & Mechanical Specification: · Thermal resistance: 0.28oC/W ref. · Heatsink Weight: 370 g (ref.) · Clipping Force: 32.0 Kgf (ref.) Component Specification: Noise (dBA) Thermal Resistance


    Original     		PDF FHS-A7015A40/FHS-A7015B40 28oC/W C1100 SC102 288A0404 molex 2759T 08-50 WIESON 2510c888-001 wire 1007 AWG24 Socket 754 AMD athlon socket 754 Dow Corning 340 heat sink socket 478 Dow Corning AMD Athlon 5000 k8

    Delta Electronics

    Abstract: a6063 molex 2759T intel lga775 Dow Corning TC 1996 FHS-A9025S16 TC-1996* Dow Corning Q8000 TC-1996 Dow Corning
    Text: FHS-A9025S16 DELTA ELECTRONICS, INC. Application: Picture: Intel LGA775 Wolfdale / Yorkfield 45nm CPU E8000/E7000/E6000/E5000/Q9000S/Q8000S sequence Thermal & Mechanical Spec.: Thermal performance for 65W CPU HSK Assembly Weight: 205 g (ref.) Clipping Force: 20 Kgf (ref.)


    Original     		PDF FHS-A9025S16 LGA775 E8000/E7000/E6000/E5000/Q9000S/Q8000S A6063 TC-1996 90x90x25 July-2009 Delta Electronics molex 2759T intel lga775 Dow Corning TC 1996 FHS-A9025S16 TC-1996* Dow Corning Q8000 Dow Corning

    Dow Corning TC 1996

    Abstract: Dow Corning TC-1996 TC-1996 225G delta 4405 Dow Corning Taiwan nehalem DHS-B9090-22 TC-1996* Dow Corning
    Text: Model Name: DHS-B9090-22 DELTA ELECTRONICS, INC. 1. Application：Intel Nehalem/Westmere Socket 1366 1U Passive HSK 2. Material：Al1050 + Vapor chamber + SK7 3. Weight：225g 4. Type：Soldering 5. Dimension：90*90*25.5 [mm^2] 6. Heat source size：34*32 [mm^2]


    Original     		PDF DHS-B9090-22 MaterialAl1050 Weight225g Dimension90 size34 TC-1996 Dow Corning TC 1996 Dow Corning TC-1996 TC-1996 225G delta 4405 Dow Corning Taiwan nehalem DHS-B9090-22 TC-1996* Dow Corning

    FHS-A6025B01

    Abstract: W5500 Dow Corning 2073 Dow Corning TC-1996 2759T A602 Dow Corning TC 1996 intel nehalem e5500 TC-1996
    Text: Model Name: FHS-A6025B01 DELTA ELECTRONICS, INC. Application: • Intel Nehalem Socket 1366 2U • Xeon 45nm W5500/X5500/E5500/L5500 CPU sequence Pictures Thermal & Mechanical Spec.: • Thermal performance for 130W CPU • HSK Assembly Weight: 590 g (ref.)


    Original     		PDF FHS-A6025B01 W5500/X5500/E5500/L5500 A1100/ADC12/C1100 TC-1996 60x60x25 2759T 27-Apr-07 FHS-A6025B01 W5500 Dow Corning 2073 Dow Corning TC-1996 A602 Dow Corning TC 1996 intel nehalem e5500

    LGA1156

    Abstract: LGA115 a6063 intel i5 Dow Corning TC 1996 2759t Dow Corning TC-1996* Dow Corning TC-1996 LGA1156 thermal
    Text: 2009 Ne w LGA115 6 FHS-A9025S19 DELTA ELECTRONICS, INC. Application: Intel Core i5 Picture: Intel LGA1156 Nehalem(45nm 95W) / Westmere (32nm 87W) CPU Lynnfield & Clarkdale sequence (Low Profile M/B mounting hole pitch 75x 75mm) Thermal & Mechanical Spec.:


    Original     		PDF LGA115 FHS-A9025S19 LGA1156 A6063 C1100 TC-1996 90x90x25 Vo7054-1000 2759T July-2009 LGA115 a6063 intel i5 Dow Corning TC 1996 Dow Corning TC-1996* Dow Corning LGA1156 thermal

    auc0912d

    Abstract: Delta 3 wire fan
    Text: FHS-A9015S00 DELTA ELECTRONICS, INC. Application: Picture: Intel Nehalem LGA1156 45nm & Intel Sandy Bridge LGA1155 (32nm) Thermal & Mechanical Spec Thermal performance for 45 W CPU HSK Assembly Weight: 120 g (ref.) Clipping Force: 16 Kgf (ref.) Component Specification:


    Original     		PDF FHS-A9015S00 LGA1156 LGA1155 A6063 TC-1996 90x90x17 auc0912d Delta 3 wire fan

    processor FAN

    Abstract: thermal test vehicle -intel p4 processor AFB0712HB northwood 478 cpu connector Dow Corning 340 heat sink socket 478 intel p4 design 2.80ghz
    Text: Northwood P4 Processor Fan Heat Sink ACTIVE HEAT SINK FOR INTEL NORTHWOOD P4 2.66 TO 2.80 GHZ Aavid’s heat sink for Intel’s® Northwood P4 2.66 to 2.80GHz processor is suited for the thermal designer seeking a cost effective solution for value priced desktop PCs. The heat


    Original     		PDF 80GHz processor FAN thermal test vehicle -intel p4 processor AFB0712HB northwood 478 cpu connector Dow Corning 340 heat sink socket 478 intel p4 design 2.80ghz

    afb0712hhb

    Abstract: AFB0712HHB fan DELTA fan 3P-2510 AMD Processor Power and Thermal amd3000 K8 specific
    Text: AMD AthlonTM 64 K8 Processor Fan Heat Sink ACTIVE HEAT SINK FOR AMD ATHLONTM 64 3000 AND 3200 2.0 GHz PROCESSOR Aavid’s thermal solution for AMD 3000 and 3200 2.0 GHz AthlonTM 64 (K8) processor. The heat sink is designed for engineers seeking a cost effective solution for mainstream


    Original     		PDF

    AFB0712HHB

    Abstract: AFB0712HHB fan heat sensor with fan cooling application heat sensor with fan cooling AMD Socket 754 processor FAN S57V
    Text: AMD AthlonTM 64 K8 Processor Fan Heat Sink ACTIVE HEAT SINK FOR AMD ATHLONTM 64 3400 2.2 GHz PROCESSOR Aavid’s solution for AMD’s Athlon 64 3400 2.2GHz processor is designed specifically for thermal engineers who require a cost effective solution for high performance


    Original     		PDF

    STM16

    Abstract: H150 STM1645-10 RF Power Modules RF power amplifier 10mW
    Text: STM1645-10 RF POWER MODULES SATELLITE COMMUNICATIONS APPLICATIONS . . . . PRELIMINARY DATA SATELLITE COMMUNICATIONS AMPLIFIER 1625 - 1665 MHz 18/28 VOLTS INPUT/OUTPUT 50 OHMS POUT = 10 W MIN. GAIN = 30 dB MIN. CASE STYLE H150 BRANDING STM1645-10 ORDER CODE


    Original     		PDF STM1645-10 STM1645-10 STM16 H150 RF Power Modules RF power amplifier 10mW

    xantar

    Abstract: E45329 e35688 TSE392W r22b1 MBG322 TB 1238 AWG20 HQV-22 E98818
    Text: Philips Components Product specification Focus Metal-glaze Preset FMP , Micro-Slot focus units (MCS), 13 kV FMP-MCS-U FEATURES • Designed for integration in a high voltage unit • High temperature and voltage stability • Wide design freedom. APPLICATIONS


    Original     		PDF Al203) HQV-22/002" PRV-53-8-52/48" xantar E45329 e35688 TSE392W r22b1 MBG322 TB 1238 AWG20 HQV-22 E98818

    philips tin foil

    Abstract: e35688 180-PE-1000 jet-lube TSE392W UL1032 awm 105 EHT Transformer list awm style 3239 vw-1 philips catalog potentiometer
    Text: Philips Components Objective specification Focus Metal-glaze Preset for Monitor Line Transformer 14"/15", 26 kV FMP-MLT-15 FEATURES • Designed for integration in a high voltage unit • High temperature and voltage stability • Wide design freedom. APPLICATIONS


    Original     		PDF FMP-MLT-15 HQV-14/001" HQV-22/002" PRV-53-8-52/48" philips tin foil e35688 180-PE-1000 jet-lube TSE392W UL1032 awm 105 EHT Transformer list awm style 3239 vw-1 philips catalog potentiometer

    LEXAN 9440

    Abstract: 9440 lexan e35688 EHT TRANSFORMERS symbol details PO-2209 TSE392W Jet-Lube
    Text: Philips Components Product specification Focus Metal-glaze Preset FMP , DSB-Slot focus units, 16 kV FMP-DSB FEATURES • Designed for integration in a high voltage unit • High temperature and voltage stability • Special flash protection • Wide design freedom.


    Original     		PDF HQV-22/002: PRV-53-8-52/48: LEXAN 9440 9440 lexan e35688 EHT TRANSFORMERS symbol details PO-2209 TSE392W Jet-Lube

    STM901-30

    Abstract: No abstract text available
    Text: STM901-30 RF POWER MODULE LINEAR BASE STATION APPLICATIONS . . . LINEAR POWER AMPLIFIER 860 - 900 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS POUT = +44.7 dBm PEP GAIN = 35 dB MIN. CASE STYLE H141 ORDER CODE STM901-30 BRANDING STM901-30 PIN CONNECTION DESCRIPTION


    Original     		PDF STM901-30 STM901-31 STM901-30

    Brown Boveri induction Motor

    Abstract: sj 2025 ic sj 2025 ASEA fast thyristor berulub F GD Rectifiers BROWN BOVERI servo motor bn16 brown Boveri diode Diode BN16
    Text: IGBT Module Half-Bridge Configuration VII200-12G4 IC DC VCES VCE(sat) 3 High Short Circuit SOA Capability Symbol Test Conditions VCES VCGR T J = 25°C to 150°C T J = 25°C to 150°C; RGE = 1 MΩ VGES VGEM Continuous Transient IC25 IC100 ICM T C = 25°C


    Original     		PDF VII200-12G4 IC100 Brown Boveri induction Motor sj 2025 ic sj 2025 ASEA fast thyristor berulub F GD Rectifiers BROWN BOVERI servo motor bn16 brown Boveri diode Diode BN16

    Dow Corning d 340

    Abstract: LT5232 GSM module circuit diagram H100 STM915-16
    Text: STM915-16  RF POWER MODULE GSM MOBILE APPLICATIONS • ■ ■ ■ ■ ■ LINEAR POWER AMPLIFIER 890-915 MHz 12.5 VOLTS INPUT/OUTPUT 50 OHMS POUT = 16 W MIN. GAIN = 42 dB MIN. DESCRIPTION The STM915-16 is a linear power module designed for 12.5 V applications in GSM Cellular


    Original     		PDF STM915-16 STM915-16 Dow Corning d 340 LT5232 GSM module circuit diagram H100

    LT5232

    Abstract: H100 STM915-16
    Text: STM915-16 RF POWER MODULE GSM MOBILE APPLICATIONS • ■ ■ ■ ■ ■ LINEAR POWER AMPLIFIER 890-915 MHz 12.5 VOLTS INPUT/OUTPUT 50 OHMS POUT = 16 W MIN. GAIN = 42 dB MIN. DESCRIPTION The STM915-16 is a linear power module designed for 12.5 V applications in GSM Cellular


    Original     		PDF STM915-16 STM915-16 LT5232 H100

    STM901-30

    Abstract: No abstract text available
    Text: STM901-30 RF POWER MODULE LINEAR BASE STATION APPLICATIONS . . . LINEAR POWER AMPLIFIER 860 - 900 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS P OU T = +44.7 dBm PEP GAIN = 35 dB MIN. CASE STYLEH141 ORDER CODE STM901-30 BRANDING STM901-30 PIN CONNECTION DESCRIPTION


    Original     		PDF STM901-30 STYLEH141 STM901-30

    Untitled

    Abstract: No abstract text available
    Text: STM901-30 RF POWER MODULE LINEAR BASE STATION APPLICATIONS . . . LINEAR POWER AMPLIFIER 860 - 900 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS P OU T = +44.7 dBm PEP GAIN = 35 dB MIN. CASE STYLEH141 ORDER CODE STM901-30 BRANDING STM901-30 PIN CONNECTION DESCRIPTION


    Original     		PDF STM901-30 STYLEH141 STM901-30 STM901-31

    STM901-30

    Abstract: dow corning C20 STM90 h141
    Text: STM901-30 RF POWER MODULE LINEAR BASE STATION APPLICATIONS . . . LINEAR POWER AMPLIFIER 860 - 900 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS POUT = +44.7 dBm PEP GAIN = 35 dB MIN. CASE STYLE H141 ORDER CODE STM901-30 s t BRANDING STM901-30 c u d o r P PIN CONNECTION


    Original     		PDF STM901-30 STM901-31 STM901-30 dow corning C20 STM90 h141

    DOW 340

    Abstract: H110 STM961-15B PO42 Dow Corning Canada
    Text: STM961-15B  RF POWER MODULE DIGITAL CELLULAR APPLICATIONS • ■ ■ ■ ■ ■ LINEAR POWER AMPLIFIER 915-960 MHz 26 VOLTS INPUT/OUTPUT 50 OHMS POUT = 42 dBm CW or PEP GAIN = 30 dB DESCRIPTION The STM961-15B module is designed for digital cellular radio base station applications in the


    Original     		PDF STM961-15B STM961-15B DOW 340 H110 PO42 Dow Corning Canada

    STM900-30

    Abstract: G0733 STM900
    Text: S G S - 1 H M S N „ •[LI gî»iQ(gi S TM 900-30 RF POWER MODULE DIGITAL CELLULAR APPLICATIONS P R E L IM IN A R Y D A TA I LINEAR POWER AMPLIFIER ■ 860 - 900 MHz . 26 VOLTS . INPUT/OUTPUT 50 OHMS ■ P o u t = +45 dBm P E P . GAIN - 36 dB MIN. PIN CONNECTION


    OCR Scan     		PDF STM900-30 G0733 STM900