PHA1 MARKING
Abstract: OC48 STM-16 DO13 package 330nF capacitor
Text: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are
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GD16556/GD16557*
GD16556
GD16557
STM-16
DK-2740
PHA1 MARKING
OC48
DO13 package
330nF capacitor
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SDS4 C1
Abstract: TLE8110 sds relays SDS4 A6901 Lambda LN
Text: TLE 8110 EE Smart Multichannel Low Side Switch with Parallel Control and SPI Interface coreFLEX TLE8110EE Data Sheet Rev. 1.3.1, 2011-05-26 Automotive Power TLE 8110 EE Smart Multichannel Switch Table of Content Table of Content 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
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TLE8110EE
SDS4 C1
TLE8110
sds relays
SDS4
A6901
Lambda LN
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GD16578
Abstract: OC48 STM-16
Text: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* an Intel company Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are
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GD16556/GD16557*
GD16556
GD16557
STM-16
GD16578
OC48
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gd16054
Abstract: GD16131 GD16554 GD-16054 GD16132-GLP GD16132 GIGA GD16554 GD160 GD16131GLP GD16131-GLP
Text: 622 Mbit/s MUX/DeMUX Chip Set GD16131/GD16132 General Description Features The GD16131, 32:4 / Quad 8:1 MUX and the GD16132, 4:32 / Quad 1:8 DeMUX are intended for use in 2.5 Gbit/s transmission systems. The high-speed interface is designed to accommodate the
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GD16131/GD16132
GD16131,
GD16132,
GD16554
GD16543
STM-16.
GD16131
GD16162
GD16131
GD16132
gd16054
GD16554
GD-16054
GD16132-GLP
GIGA GD16554
GD160
GD16131GLP
GD16131-GLP
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10gd1
Abstract: OC48 STM-16 GD16556-100BA 322581 regenerator 3R
Text: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* an Intel company Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are
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GD16556/GD16557*
GD16556
GD16557
STM-16
10gd1
OC48
GD16556-100BA
322581
regenerator 3R
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Untitled
Abstract: No abstract text available
Text: OBSOLETE PRODUCT HMC670LC3C v02.1209 HIGH SPEED LOGIC - SMT 13 Gbps, 1:2 FANOUT BUFFER Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement
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HMC670LC3C
HMC670LC3C
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Untitled
Abstract: No abstract text available
Text: Motors | Automation | Energy | Transmission & Distribution | Coatings Frequency Inverter MW500 User's Manual User’s Manual Series: MW500 Language: English Document Nº: 10002218015 / 01 Publishing Date: 02/2015 Summary of Reviews The information below describes the reviews made in this manual.
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MW500
MW500
MW500B06P5T4)
P0403)
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CDM4
Abstract: SDS4 C1 "Stepper Motors" 1.8 2V 1.45A 5MIO SDS4 TLE8110 PG-DSO-36-41 "Lambda Sensor" dso-36-41 sds relays
Text: Data Sheet, Rev. 1.0, June 2009 TLE8110EE Smart Multichannel Low Side Switch with Parallel Control and SPI Interface coreFLEX Automotive Power FLEX Smart Multi-Channel Switch 1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
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TLE8110EE
CDM4
SDS4 C1
"Stepper Motors" 1.8 2V 1.45A
5MIO
SDS4
TLE8110
PG-DSO-36-41
"Lambda Sensor"
dso-36-41
sds relays
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VSC716
Abstract: No abstract text available
Text: VSC7166 Data Sheet FEATURES ● OC-192 SONET Frame Transport Mechanisms ● Channel-to-Channel Deskewing in Receiver ● Converts Sixteen LVDS Inputs at 622Mb/s into Twelve 8B/10B Encoded LVDS Outputs at 1.244Gb/s ● Redundant Channel for Fault Tolerance
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VSC7166
OC-192
622Mb/s
8B/10B
244Gb/s
244Gb/s
622Mb/s
OIF-VSR4-01
256-Pin,
VSC716
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Untitled
Abstract: No abstract text available
Text: HMC670LC3C v00.1207 13 Gbps, 1:2 Fanout Buffer Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement Propagation Delay: 55 ps
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HMC670LC3C
HMC670LC3C
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POR25K08SFPX
Abstract: POT25K08SFPX
Text: Optobahn Corporation/NGK Insulators 1/6 DATA SHEETS 2.5Gb/s 8ch SINGLE MODE PARALLEL OPTICAL INTERCONNECT GENERAL DESCRIPTIONS AND MAXIMUM RATINGS Table 1. General Descriptions Parameters Part Number Number of Channels Type of Optical Fiber Optical Connector
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POT25K08SFPX
POR25K08SFPX
DS-011203C
POR25K08SFPX
POT25K08SFPX
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HMC670-LC3C
Abstract: HMC670LC3C N4901B
Text: HMC670LC3C v02.1209 13 Gbps, 1:2 Fanout Buffer HIGH SPEED LOGIC - SMT 7 Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement
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HMC670LC3C
HMC670LC3C
HMC670-LC3C
N4901B
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sck 054
Abstract: diagram HANNSTAR k mv SB824 Wistron Corporation PCI7412 BCM4401E S 2-H11 BT 342 project hannstar HD64F2111BV-C
Text: A B C AG1 Block Diagram Mobile CPU CLK GEN. 4 Yonah 478 Celeron M ICS954305D IDT CV155 3 D Project code: 91.4A901.001 PCB P/N : 55.4A903.XXX REVISION : 05225-1 (Hannstar, GCE) G792 19 400/533/667MHz 533/667MHz 533/667 MHz DDR2 14 CRT DCBATOUT 1D8V_S3 S TPS51100
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TPS51120
ICS954305D
CV155)
4A901
4A903
MAX8743EE
400/533/667MHz
533/667MHz
TPS51100
533/667MHz
sck 054
diagram HANNSTAR k mv
SB824
Wistron Corporation
PCI7412
BCM4401E
S 2-H11
BT 342 project
hannstar
HD64F2111BV-C
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N4901B
Abstract: No abstract text available
Text: HMC670LC3C v01.1208 13 Gbps, 1:2 Fanout Buffer HIGH SPEED LOGIC - SMT 7 Typical Applications Features The HMC670LC3C is ideal for: Inputs Terminated Internally in 50 Ohms • RF ATE Applications Differential Inputs are DC Coupled • Broadband Test & Measurement
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HMC670LC3C
HMC670LC3C
N4901B
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POT10K08SFPX
Abstract: do1n POR10K08SFPX Optobahn
Text: Optobahn Corporation/NGK Insulators 1/6 DATA SHEET 1.25Gb/s 8ch SINGLE MODE PARALLEL OPTICAL INTERCONNECT GENERAL DESCRIPTIONS AND MAXIMUM RATINGS Table 1. General Descriptions Parameters Part Number Number of Channels Type of Optical Fiber Optical Connector
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25Gb/s
POT10K08SFPX
POR10K08SFPX
DS-011203B
POT10K08SFPX
do1n
POR10K08SFPX
Optobahn
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POT10K08MFPX
Abstract: POR10K08MFPX
Text: Optobahn Corporation/NGK Insulators 1/6 DATA SHEET 1.25Gb/s 8ch MULTIMODE PARALLEL OPTICAL INTERCONNECT GENERAL DESCRIPTIONS AND MAXIMUM RATINGS Table 1. General Descriptions Parameters Part Number Number of Channels Type of Optical Fiber Optical Connector
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25Gb/s
POT10K08MFPX
POR10K08MFPX
DS-011203A
POT10K08MFPX
POR10K08MFPX
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10gd1
Abstract: GD16578 DO14 OC48 STM-16 bang bang phase detector GD16556-100BA 322581
Text: 2.5 Gbit/s Transponder Chip Set with Digital “Wrapping” GD16556/GD16557* an Intel company Preliminary General Description Features The GD16556 and GD16557 constitute a high performance multi-bitrate transponder chip set designed for Optical Network applications. The devices are
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GD16556/GD16557*
GD16556
GD16557
STM-16
10gd1
GD16578
DO14
OC48
bang bang phase detector
GD16556-100BA
322581
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Untitled
Abstract: No abstract text available
Text: 9 x 3 0 x x [ 133H S - x - x x Z 0 0 S -0 L -Z x - x x - x x L A V d g - w d i ON -A 9 \LLZ\ \LLZ\ \LLZ\ \LL~Z\ V/N V/N V/N [Z6 I-] [Z6 I-] [Z6" L] [Z6" l] 9M a d Z N O d a d O H d S O H d n V N IL A / d d l
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OCR Scan
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NOIldldOS30
ZZ099
-031\A
LV09-QV6-Z18
31V3S
133HS
D31WVS
N31LldM
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