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    P2272

    Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
    Text: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)


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    PDF DS1210S DN801581AAC P22330 P22398 P22690 P22728 P22729 P22730 P22731 P2272 P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q

    P22518

    Abstract: mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -55 TO 125°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA AICL DN801581AAC 16 PIN SOIC 300 40 DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA (AICL)


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    PDF DS1210S DS1232L DS1232S DS1233 DS1233Z P22518 mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q

    dn729

    Abstract: P2254 P22154 P22264 P22328 P2252
    Text: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)


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    PDF DS1210S DS1210 DN738347AAA P21776 P22233 P22310 P22312 P22230 P22309 P22311 dn729 P2254 P22154 P22264 P22328 P2252

    P22328

    Abstract: P22157 p22230 mar 9746
    Text: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292


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    PDF DS2153 DS2153Q P22294 P22292 P22556 DN725561AAB DN720030AAB DN733468AAB P22328 P22157 p22230 mar 9746

    DS1620 C2

    Abstract: 9814 DS1621 P22328 DS2165Q
    Text: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti


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    PDF DM821478AIB DS2502 P23041 DS2153Q P23108 P22556 DN811539AAB DN733468AAB DS2108 DS1620 C2 9814 DS1621 P22328 DS2165Q

    P2215

    Abstract: P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403
    Text: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS


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    PDF DS2250T P22125 DS1210 DS1210S P2215 P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403